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Semiconductor Reliability Handbook
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Book Synopsis Materials and Reliability Handbook for Semiconductor Optical and Electron Devices by : Osamu Ueda
Download or read book Materials and Reliability Handbook for Semiconductor Optical and Electron Devices written by Osamu Ueda and published by Springer Science & Business Media. This book was released on 2012-09-24 with total page 618 pages. Available in PDF, EPUB and Kindle. Book excerpt: Materials and Reliability Handbook for Semiconductor Optical and Electron Devices provides comprehensive coverage of reliability procedures and approaches for electron and photonic devices. These include lasers and high speed electronics used in cell phones, satellites, data transmission systems and displays. Lifetime predictions for compound semiconductor devices are notoriously inaccurate due to the absence of standard protocols. Manufacturers have relied on extrapolation back to room temperature of accelerated testing at elevated temperature. This technique fails for scaled, high current density devices. Device failure is driven by electric field or current mechanisms or low activation energy processes that are masked by other mechanisms at high temperature. The Handbook addresses reliability engineering for III-V devices, including materials and electrical characterization, reliability testing, and electronic characterization. These are used to develop new simulation technologies for device operation and reliability, which allow accurate prediction of reliability as well as the design specifically for improved reliability. The Handbook emphasizes physical mechanisms rather than an electrical definition of reliability. Accelerated aging is useful only if the failure mechanism is known. The Handbook also focuses on voltage and current acceleration stress mechanisms.
Book Synopsis Semiconductor Device Reliability by : A. Christou
Download or read book Semiconductor Device Reliability written by A. Christou and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 571 pages. Available in PDF, EPUB and Kindle. Book excerpt: This publication is a compilation of papers presented at the Semiconductor Device Reliabi lity Workshop sponsored by the NATO International Scientific Exchange Program. The Workshop was held in Crete, Greece from June 4 to June 9, 1989. The objective of the Workshop was to review and to further explore advances in the field of semiconductor reliability through invited paper presentations and discussions. The technical emphasis was on quality assurance and reliability of optoelectronic and high speed semiconductor devices. The primary support for the meeting was provided by the Scientific Affairs Division of NATO. We are indebted to NATO for their support and to Dr. Craig Sinclair, who admin isters this program. The chapters of this book follow the format and order of the sessions of the meeting. Thirty-six papers were presented and discussed during the five-day Workshop. In addi tion, two panel sessions were held, with audience participation, where the particularly controversial topics of bum-in and reliability modeling and prediction methods were dis cussed. A brief review of these sessions is presented in this book.
Book Synopsis The Reliability Handbook by : National Semiconductor Corporation
Download or read book The Reliability Handbook written by National Semiconductor Corporation and published by . This book was released on 1979 with total page 890 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Materials and Reliability Handbook for Semiconductor Optical and Electron Devices by : Osamu Ueda
Download or read book Materials and Reliability Handbook for Semiconductor Optical and Electron Devices written by Osamu Ueda and published by Springer Science & Business Media. This book was released on 2012-09-22 with total page 618 pages. Available in PDF, EPUB and Kindle. Book excerpt: Materials and Reliability Handbook for Semiconductor Optical and Electron Devices provides comprehensive coverage of reliability procedures and approaches for electron and photonic devices. These include lasers and high speed electronics used in cell phones, satellites, data transmission systems and displays. Lifetime predictions for compound semiconductor devices are notoriously inaccurate due to the absence of standard protocols. Manufacturers have relied on extrapolation back to room temperature of accelerated testing at elevated temperature. This technique fails for scaled, high current density devices. Device failure is driven by electric field or current mechanisms or low activation energy processes that are masked by other mechanisms at high temperature. The Handbook addresses reliability engineering for III-V devices, including materials and electrical characterization, reliability testing, and electronic characterization. These are used to develop new simulation technologies for device operation and reliability, which allow accurate prediction of reliability as well as the design specifically for improved reliability. The Handbook emphasizes physical mechanisms rather than an electrical definition of reliability. Accelerated aging is useful only if the failure mechanism is known. The Handbook also focuses on voltage and current acceleration stress mechanisms.
Book Synopsis Reliability Handbook by : National Semiconductor Corporation
Download or read book Reliability Handbook written by National Semiconductor Corporation and published by . This book was released on 1979 with total page 275 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Semiconductor Process Reliability in Practice by : Zhenghao Gan
Download or read book Semiconductor Process Reliability in Practice written by Zhenghao Gan and published by McGraw Hill Professional. This book was released on 2012-10-10 with total page 624 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proven processes for ensuring semiconductor device reliability Co-written by experts in the field, Semiconductor Process Reliability in Practice contains detailed descriptions and analyses of reliability and qualification for semiconductor device manufacturing and discusses the underlying physics and theory. The book covers initial specification definition, test structure design, analysis of test structure data, and final qualification of the process. Real-world examples of test structure designs to qualify front-end-of-line devices and back-end-of-line interconnects are provided in this practical, comprehensive guide. Coverage includes: Basic device physics Process flow for MOS manufacturing Measurements useful for device reliability characterization Hot carrier injection Gate-oxide integrity (GOI) and time-dependent dielectric breakdown (TDDB) Negative bias temperature instability Plasma-induced damage Electrostatic discharge protection of integrated circuits Electromigration Stress migration Intermetal dielectric breakdown
Book Synopsis Guidebook for Managing Silicon Chip Reliability by : Michael Pecht
Download or read book Guidebook for Managing Silicon Chip Reliability written by Michael Pecht and published by CRC Press. This book was released on 2017-11-22 with total page 228 pages. Available in PDF, EPUB and Kindle. Book excerpt: Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future? Chapters discuss: failure sites, operational loads, and failure mechanism intrinsic device sensitivities electromigration hot carrier aging time dependent dielectric breakdown mechanical stress induced migration alpha particle sensitivity electrostatic discharge (ESD) and electrical overstress latch-up qualification screening guidelines for designing reliability Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.
Book Synopsis Semiconductor Reliability by : John E. Shwop
Download or read book Semiconductor Reliability written by John E. Shwop and published by . This book was released on 1961 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Physics-of-Failure Based Handbook of Microelectronic Systems by : Shahrzad Salemi
Download or read book Physics-of-Failure Based Handbook of Microelectronic Systems written by Shahrzad Salemi and published by RIAC. This book was released on 2008 with total page 271 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Sharp Semiconductor Reliability Handbook by : Shāpu Kabushiki Kaisha
Download or read book Sharp Semiconductor Reliability Handbook written by Shāpu Kabushiki Kaisha and published by . This book was released on 1991 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis The Reliability Handbook by : National Semiconductor Corporation
Download or read book The Reliability Handbook written by National Semiconductor Corporation and published by . This book was released on 1982 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis The Reliability Handbook by : National Semiconductor Corporation
Download or read book The Reliability Handbook written by National Semiconductor Corporation and published by . This book was released on 1982 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis The Reliability Handbook by : National Semiconductor Corporation (U.S.). Military/Aerospace Products Division
Download or read book The Reliability Handbook written by National Semiconductor Corporation (U.S.). Military/Aerospace Products Division and published by . This book was released on 1986 with total page 281 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Semiconductor Reliability Handbook by : Sharp Corporation
Download or read book Semiconductor Reliability Handbook written by Sharp Corporation and published by . This book was released on 1993 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Components Quality/reliability Handbook by : Intel Corporation
Download or read book Components Quality/reliability Handbook written by Intel Corporation and published by . This book was released on 1985 with total page 276 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :Santa Clara NATIONAL SEMICONDUCTOR CORPORATION (CA, Estados Unidos) Publisher : ISBN 13 : Total Pages :286 pages Book Rating :4.:/5 (71 download)
Book Synopsis The Reliability Handbook by : Santa Clara NATIONAL SEMICONDUCTOR CORPORATION (CA, Estados Unidos)
Download or read book The Reliability Handbook written by Santa Clara NATIONAL SEMICONDUCTOR CORPORATION (CA, Estados Unidos) and published by . This book was released on 1982 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reliability and the die; Reliability and internal construction; MIL-STD-883; MIL-M-38510; Reliability and the hybrid device; Reliability and VLSI/VHSIC devices; Reliability and the radiation environment; Reliability and the discrete device; Reliability and standardization; Quality assurance and reliability engineering; reliability and documentation; Reliability and the commercial grade device; European reliability programs; Reliability and the cost of semiconductor; The total military/aerospace standadization program; 883B/RETS tm products from National Semiconductor; 883S/RETS tm products from National Semicondutor; 883S/RETS tm hybrids from national semiconductor; MIL-M-38510 class B products from National Semiconductor; Radiation hardened technology from National Semiconductor; Military leadless chip carriers from National Semiconductor; Appendix: Wafer fabrication; Semiconductor assembly and packaging; Glossary of terms; Key governement agencies; AN/NUMBERS and acronyms; Bibbliography; MIL-M-38510 cross reference.
Book Synopsis Reliability and Failure of Electronic Materials and Devices by : Milton Ohring
Download or read book Reliability and Failure of Electronic Materials and Devices written by Milton Ohring and published by Academic Press. This book was released on 2014-10-14 with total page 759 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
