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Download or read book Semiconductor Thermal Measurement and Management Symposium, 2010. SEMI-THERM 2010. 26th Annual IEEE. written by and published by . This book was released on 2010 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 : 9781424464579
Total Pages : 310 pages
Book Rating : 4.4/5 (645 download)
Download or read book 2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 2010) written by and published by . This book was released on 2010 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Alhussein Albarbar
Publisher : Springer
ISBN 13 : 3319598287
Total Pages : 224 pages
Book Rating : 4.3/5 (195 download)
Download or read book Thermal Analysis of Power Electronic Devices Used in Renewable Energy Systems written by Alhussein Albarbar and published by Springer. This book was released on 2017-07-19 with total page 224 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book analyzes the thermal characteristics of power electronic devices (PEDs) with a focus on those used in wind and solar energy systems. The authors focus on the devices used in such applications, for example boost converters and inverters under different operating conditions. The book explains in detail finite element modeling techniques, setting up measuring systems, data analysis, and PEDs’ lifetime calculations. It is appropriate reading for graduate students and researchers who focus on the design and reliability of power electronic devices.
Author : Marta Rencz
Publisher : Springer Nature
ISBN 13 : 3030861740
Total Pages : 389 pages
Book Rating : 4.0/5 (38 download)
Download or read book Theory and Practice of Thermal Transient Testing of Electronic Components written by Marta Rencz and published by Springer Nature. This book was released on 2023-01-23 with total page 389 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses the significant aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book presents the theoretical background of creating structure functions from the measured results with mathematical details. It then shows how the method can be used for thermal qualification, structure integrity testing, determining material parameters, and calibrating simulation models. General practical questions about measurements are discussed to help beginners carry out thermal transient testing. The particular problems and tricks of measuring with various electronic components, such as Si diodes, bipolar transistors, MOS transistors, IGBT devices, resistors, capacitors, wide bandgap materials, and LEDs, are covered in detail with the help of various use cases. This hands-on book will enable readers to accomplish thermal transient testing on any new type of electronics and provides the theoretical details needed to understand the opportunities and limitations offered by the methodology. The book will be an invaluable reference for practicing engineers, students, and researchers.
Author : Clemens J.M. Lasance
Publisher : Springer Science & Business Media
ISBN 13 : 1461450918
Total Pages : 550 pages
Book Rating : 4.4/5 (614 download)
Download or read book Thermal Management for LED Applications written by Clemens J.M. Lasance and published by Springer Science & Business Media. This book was released on 2013-09-17 with total page 550 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thermal Management for LED Applications provides state-of-the-art information on recent developments in thermal management as it relates to LEDs and LED-based systems and their applications. Coverage begins with an overview of the basics of thermal management including thermal design for LEDs, thermal characterization and testing of LEDs, and issues related to failure mechanisms and reliability and performance in harsh environments. Advances and recent developments in thermal management round out the book with discussions on advances in TIMs (thermal interface materials) for LED applications, advances in forced convection cooling of LEDs, and advances in heat sinks for LED assemblies.
Author : Jutta Kühn
Publisher : KIT Scientific Publishing
ISBN 13 : 3866446152
Total Pages : 264 pages
Book Rating : 4.8/5 (664 download)
Download or read book AlGaN/GaN-HEMT power amplifiers with optimized power-added efficiency for X-band applications written by Jutta Kühn and published by KIT Scientific Publishing. This book was released on 2011 with total page 264 pages. Available in PDF, EPUB and Kindle. Book excerpt: This work has arisen out of the strong demand for a superior power-added efficiency (PAE) of AlGaN/GaN high electron mobility transistor (HEMT) high-power amplifiers (HPAs) that are part of any advanced wireless multifunctional RF-system with limited prime energy. Different concepts and approaches on device and design level for PAE improvements are analyzed, e.g. structural and layout changes of the GaN transistor and advanced circuit design techniques for PAE improvements of GaN HEMT HPAs.
Author : Yogendra Joshi
Publisher : Springer Science & Business Media
ISBN 13 : 1441971246
Total Pages : 635 pages
Book Rating : 4.4/5 (419 download)
Download or read book Energy Efficient Thermal Management of Data Centers written by Yogendra Joshi and published by Springer Science & Business Media. This book was released on 2012-03-20 with total page 635 pages. Available in PDF, EPUB and Kindle. Book excerpt: Energy Efficient Thermal Management of Data Centers examines energy flow in today's data centers. Particular focus is given to the state-of-the-art thermal management and thermal design approaches now being implemented across the multiple length scales involved. The impact of future trends in information technology hardware, and emerging software paradigms such as cloud computing and virtualization, on thermal management are also addressed. The book explores computational and experimental characterization approaches for determining temperature and air flow patterns within data centers. Thermodynamic analyses using the second law to improve energy efficiency are introduced and used in proposing improvements in cooling methodologies. Reduced-order modeling and robust multi-objective design of next generation data centers are discussed.
Author :
Publisher : World Scientific
ISBN 13 : 9811209642
Total Pages : 1079 pages
Book Rating : 4.8/5 (112 download)
Download or read book Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set) written by and published by World Scientific. This book was released on 2019-08-27 with total page 1079 pages. Available in PDF, EPUB and Kindle. Book excerpt: Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories.The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging 'learning curve,' the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications.
Author : ETCMOS
Publisher : CMOS Emerging Technologies Research
ISBN 13 : 1927500729
Total Pages : 545 pages
Book Rating : 4.9/5 (275 download)
Download or read book ETCMOS 2016 Vol.2: Devices, Circuits and Systems Track written by ETCMOS and published by CMOS Emerging Technologies Research. This book was released on 2016-05-26 with total page 545 pages. Available in PDF, EPUB and Kindle. Book excerpt: Presentation slides from the Devices, Circuits and Systems track at the ETCMOS 2016 conference in Montreal, May 25-27, 2016
Author : L.L Vasiliev
Publisher : CRC Press
ISBN 13 : 1466564148
Total Pages : 539 pages
Book Rating : 4.4/5 (665 download)
Download or read book Heat Pipes and Solid Sorption Transformations written by L.L Vasiliev and published by CRC Press. This book was released on 2013-05-08 with total page 539 pages. Available in PDF, EPUB and Kindle. Book excerpt: Developing clean energy and utilizing waste energy has become increasingly vital. Research targeting the advancement of thermally powered adsorption cooling technologies has progressed in the past few decades, and the awareness of fuel cells and thermally activated (heat pipe heat exchangers) adsorption systems using natural refrigerants and/or alternatives to hydrofluorocarbon-based refrigerants is becoming ever more important. Heat Pipes and Solid Sorption Transformations: Fundamentals and Practical Applications concentrates on state-of-the-art adsorption research and technologies for relevant applications based on the use of efficient heat transfer devices—heat pipe and two-phase thermosyphons—with the objectives of energy efficiency and sustainability. This book also discusses heat pipe thermal control as it relates to spacecraft applications. The first few chapters of Heat Pipes and Solid Sorption Transformations: Fundamentals and Practical Applications focus on heating and cooling, the principles of adsorption, adsorption dynamics, and the availability of three-phase boundaries. Other chapters cover successful heat pipe applications and heat-pipe-based thermal control of fuel cells, solid sorption transformers, and electronic components and air-condition devices. The final chapters summarize the achievements in the field of heat and mass transfer study in heat pipes with variable properties such as gas loaded heat pipes. Several configurations of thermosyphons are showcased, with suggested applications. A number of examples of equipment using the thermosyphon technology are presented and, in the final chapter, the concept of flow boiling and flow condensation heat transfer in micochannels is analyzed in detail.
Author :
Publisher : World Scientific
ISBN 13 : 9814520241
Total Pages : 1397 pages
Book Rating : 4.8/5 (145 download)
Download or read book Encyclopedia Of Thermal Packaging, Set 2: Thermal Packaging Tools (A 4-volume Set) written by and published by World Scientific. This book was released on 2014-10-23 with total page 1397 pages. Available in PDF, EPUB and Kindle. Book excerpt: remove This Encyclopedia comes in 3 sets. To check out Set 1 and Set 3, please visit Set 1: Thermal Packaging Techniques and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 2: Thermal Packaging ToolsThe second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order “compact” thermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve “correct by design” thermal packaging solutions.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.
Author : Yan Li
Publisher : Springer
ISBN 13 : 3319445863
Total Pages : 465 pages
Book Rating : 4.3/5 (194 download)
Download or read book 3D Microelectronic Packaging written by Yan Li and published by Springer. This book was released on 2017-01-20 with total page 465 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.
Author : Márta Rencz
Publisher : MDPI
ISBN 13 : 303943831X
Total Pages : 310 pages
Book Rating : 4.0/5 (394 download)
Download or read book Thermal and Electro-thermal System Simulation 2020 written by Márta Rencz and published by MDPI. This book was released on 2021-01-12 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.
Author : Willem Dirk van Driel
Publisher : Springer
ISBN 13 : 3319581759
Total Pages : 603 pages
Book Rating : 4.3/5 (195 download)
Download or read book Solid State Lighting Reliability Part 2 written by Willem Dirk van Driel and published by Springer. This book was released on 2017-07-11 with total page 603 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the past four years we have witnessed rapid development in technology and significant market penetration in many applications for LED systems. New processes and new materials have been introduced; new standards and new testing methods have been developed; new driver, control and sensing technologies have been integrated; and new and unknown failure modes have also been presented. In this book, Solid State Lighting Reliability Part 2, we invited the experts from industry and academia to present the latest developments and findings in the LED system reliability arena. Topics in this book cover the early failures and critical steps in LED manufacturing; advances in reliability testing and standards; quality of colour and colour stability; degradation of optical materials and the associated chromaticity maintenance; characterization of thermal interfaces; LED solder joint testing and prediction; common failure modes in LED drivers; root causes for lumen depreciation; corrosion sensitivity of LED packages; reliability management for automotive LEDs, and lightning effects on LEDs. This book is a continuation of Solid State Lighting Reliability: Components to Systems (published in 2013), which covers reliability aspects ranging from the LED to the total luminaire or system of luminaires. Together, these two books are a full set of reference books for Solid State Lighting reliability from the performance of the (sub-) components to the total system, regardless its complexity.
Author : Weiqiang Liu
Publisher : Springer Nature
ISBN 13 : 3030983471
Total Pages : 607 pages
Book Rating : 4.0/5 (39 download)
Download or read book Approximate Computing written by Weiqiang Liu and published by Springer Nature. This book was released on 2022-08-22 with total page 607 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explores the technological developments at various levels of abstraction, of the new paradigm of approximate computing. The authors describe in a single-source the state-of-the-art, covering the entire spectrum of research activities in approximate computing, bridging device, circuit, architecture, and system levels. Content includes tutorials, reviews and surveys of current theoretical/experimental results, design methodologies and applications developed in approximate computing for a wide scope of readership and specialists. Serves as a single-source reference to state-of-the-art of approximate computing; Covers broad range of topics, from circuits to applications; Includes contributions by leading researchers, from academia and industry.
Author : Hana Kubatova
Publisher : Springer
ISBN 13 : 3642364241
Total Pages : 365 pages
Book Rating : 4.6/5 (423 download)
Download or read book Architecture of Computing Systems -- ARCS 2013 written by Hana Kubatova and published by Springer. This book was released on 2013-02-12 with total page 365 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the refereed proceedings of the 26th International Conference on Architecture of Computing Systems, ARCS 2013, held in Prague, Czech Republic, in February 2013. The 29 papers presented were carefully reviewed and selected from 73 submissions. The topics covered are computer architecture topics such as multi-cores, memory systems, and parallel computing, adaptive system architectures such as reconfigurable systems in hardware and software, customization and application specific accelerators in heterogeneous architectures, organic and autonomic computing including both theoretical and practical results on self-organization, self-configuration, self-optimization, self-healing, and self-protection techniques, operating systems including but not limited to scheduling, memory management, power management, RTOS, energy-awareness, and green computing.
Author : David Reay
Publisher : Butterworth-Heinemann
ISBN 13 : 0080982794
Total Pages : 280 pages
Book Rating : 4.0/5 (89 download)
Download or read book Heat Pipes written by David Reay and published by Butterworth-Heinemann. This book was released on 2013-10-01 with total page 280 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heat Pipes, Sixth Edition, takes a highly practical approach to the design and selection of heat pipes, making it an essential guide for practicing engineers and an ideal text for postgraduate students.This new edition has been revised to include new information on the underlying theory of heat pipes and heat transfer, and features fully updated applications, new data sections, and updated chapters on design and electronics cooling. The book is a useful reference for those with experience and an accessible introduction for those approaching the topic for the first time. Contains all information required to design and manufacture a heat pipe Suitable for use as a professional reference and graduate text Revised with greater coverage of key electronic cooling applications
