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Author : Charles Eric Jowett
Publisher : Random House Business
ISBN 13 :
Total Pages : 224 pages
Book Rating : 4.:/5 (89 download)
Download or read book Reliable Electronic Assembly Production written by Charles Eric Jowett and published by Random House Business. This book was released on 1970 with total page 224 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Cheryl Tulkoff
Publisher : John Wiley & Sons
ISBN 13 : 1119109388
Total Pages : 400 pages
Book Rating : 4.1/5 (191 download)
Download or read book Design for Excellence in Electronics Manufacturing written by Cheryl Tulkoff and published by John Wiley & Sons. This book was released on 2021-03-22 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt: An authoritative guide to optimizing design for manufacturability and reliability from a team of experts Design for Excellence in Electronics Manufacturing is a comprehensive, state-of-the-art book that covers design and reliability of electronics. The authors—noted experts on the topic—explain how using the DfX concepts of design for reliability, design for manufacturability, design for environment, design for testability, and more, reduce research and development costs and decrease time to market and allow companies to confidently issue warranty coverage. By employing the concepts outlined in Design for Excellence in Electronics Manufacturing, engineers and managers can increase customer satisfaction, market share, and long-term profits. In addition, the authors describe the best practices regarding product design and show how the practices can be adapted for different manufacturing processes, suppliers, use environments, and reliability expectations. This important book: Contains a comprehensive review of the design and reliability of electronics Covers a range of topics: establishing a reliability program, design for the use environment, design for manufacturability, and more Includes technical information on electronic packaging, discrete components, and assembly processes Shows how aspects of electronics can fail under different environmental stresses Written for reliability engineers, electronics engineers, design engineers, component engineers, and others, Design for Excellence in Electronics Manufacturing is a comprehensive book that reveals how to get product design right the first time.
Author : Frank Riley
Publisher : Springer Science & Business Media
ISBN 13 : 3662131617
Total Pages : 576 pages
Book Rating : 4.6/5 (621 download)
Download or read book The Electronics Assembly Handbook written by Frank Riley and published by Springer Science & Business Media. This book was released on 2013-06-29 with total page 576 pages. Available in PDF, EPUB and Kindle. Book excerpt: The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in "Assembly Engineering" and "Electronic Packaging and Production", will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.
Author : Thomas L. Landers
Publisher : Pearson Education
ISBN 13 :
Total Pages : 584 pages
Book Rating : 4.F/5 ( download)
Download or read book Electronics Manufacturing Processes written by Thomas L. Landers and published by Pearson Education. This book was released on 1994 with total page 584 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume provides a comprehensive introduction to electronic technology, products, and manufacturing processes.Reviews principles of production and electronics fundamentals (electronic components, interconnections, printed wiring boards, soldering and solderability); explains automatic assembly (automation, leaded component insertion, and surface-mount device placement); discusses life-cycle engineering (design for assembly, quality and reliability, testability, and environmental stress screening); and explores manufacturing systems (facilities and materials handling, production and inventory control, production economics).For electrical or industrial engineers interested in electronics manufacturing.
Author : Eugene R. Hnatek
Publisher : CRC Press
ISBN 13 : 0824743547
Total Pages : 433 pages
Book Rating : 4.8/5 (247 download)
Download or read book Practical Reliability Of Electronic Equipment And Products written by Eugene R. Hnatek and published by CRC Press. This book was released on 2002-10-25 with total page 433 pages. Available in PDF, EPUB and Kindle. Book excerpt: Practical Reliability of Electronic Equipment and Products will help electrical, electronics, manufacturing, mechanical, systems design, and reliability engineers; electronics production managers; electronic circuit designers; and upper-level undergraduate and graduate students in these disciplines.
Author : Titu I. Bajenescu
Publisher : Springer Science & Business Media
ISBN 13 : 3642585051
Total Pages : 547 pages
Book Rating : 4.6/5 (425 download)
Download or read book Reliability of Electronic Components written by Titu I. Bajenescu and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 547 pages. Available in PDF, EPUB and Kindle. Book excerpt: This application-oriented professional book explains why components fail, addressing the needs of engineers who apply reliability principles in design, manufacture, testing and field service. A detailed index, a glossary, acronym lists, reliability dictionaries and a rich specific bibliography complete the book.
Author : Shen Liu
Publisher : John Wiley & Sons
ISBN 13 : 0470827807
Total Pages : 586 pages
Book Rating : 4.4/5 (78 download)
Download or read book Modeling and Simulation for Microelectronic Packaging Assembly written by Shen Liu and published by John Wiley & Sons. This book was released on 2011-05-17 with total page 586 pages. Available in PDF, EPUB and Kindle. Book excerpt: Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging
Author : Wilfried Sauer
Publisher : Springer Science & Business Media
ISBN 13 : 184628354X
Total Pages : 493 pages
Book Rating : 4.8/5 (462 download)
Download or read book Electronics Process Technology written by Wilfried Sauer and published by Springer Science & Business Media. This book was released on 2007-04-21 with total page 493 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a systemized presentation of new techniques and methods in electronics manufacture. It helps the reader reduce the cost and increase the reliability of electronic products by employing up-to-date technology. It also details the latest ideas for reducing the scale of electronic components and products to the nano-scale by organizing all the elements of the complicated modern electronics manufacturing process showing how they affect each other.
Author : Y.C. Lee
Publisher : Springer Science & Business Media
ISBN 13 : 1461558034
Total Pages : 270 pages
Book Rating : 4.4/5 (615 download)
Download or read book Manufacturing Challenges in Electronic Packaging written by Y.C. Lee and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 270 pages. Available in PDF, EPUB and Kindle. Book excerpt: About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging.
Author : John H. Lau
Publisher : Springer Nature
ISBN 13 : 9811539200
Total Pages : 545 pages
Book Rating : 4.8/5 (115 download)
Download or read book Assembly and Reliability of Lead-Free Solder Joints written by John H. Lau and published by Springer Nature. This book was released on 2020-05-29 with total page 545 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
Author : Elissa M. Bumiller
Publisher : CRC Press
ISBN 13 : 1420040065
Total Pages : 236 pages
Book Rating : 4.4/5 (2 download)
Download or read book Contamination of Electronic Assemblies written by Elissa M. Bumiller and published by CRC Press. This book was released on 2002-11-12 with total page 236 pages. Available in PDF, EPUB and Kindle. Book excerpt: Contamination problems have become a major factor in determining the manufacturability, quality, and reliability of electronic assemblies. Understanding the mechanics and chemistry of contamination has become necessary for improving quality and reliability and reducing costs of electronic assemblies. Designed as a practical guide, Contamination of
Author : Charles A. Harper
Publisher : McGraw Hill Professional
ISBN 13 : 9780071378826
Total Pages : 692 pages
Book Rating : 4.3/5 (788 download)
Download or read book Electronic Assembly Fabrication written by Charles A. Harper and published by McGraw Hill Professional. This book was released on 2002-04-10 with total page 692 pages. Available in PDF, EPUB and Kindle. Book excerpt: Printed circuit history and overview. Development and fabrication of IC chips. Packaging of IC chips. Printed circuit board fabrication.
Author : V T Harikumar
Publisher : Harikumar V T
ISBN 13 :
Total Pages : 0 pages
Book Rating : 4.2/5 (274 download)
Download or read book Circuit Design Laws written by V T Harikumar and published by Harikumar V T. This book was released on 2024-07 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Circuit Design Laws: A Handbook for Electronic Assembly" is an essential guide for anyone involved in the design, assembly, and production of electronic circuits. This comprehensive book serves as a one-stop resource, providing readers with a deep understanding of the fundamental principles, best practices, and industry standards related to circuit design and electronic assembly. The book begins with an introduction to the basic concepts of circuit design, including an overview of electronic components, circuit analysis, and common design techniques. It emphasizes the importance of adhering to design laws and industry standards to ensure the safety, functionality, and reliability of electronic assemblies. As readers navigate through the chapters, they will delve into the different types of circuit design laws and how they apply to specific aspects of electronic assembly. This includes laws pertaining to power distribution, signal integrity, electromagnetic compatibility (EMC), thermal management, and safety considerations. Each law is explained in detail, along with practical examples and case studies that illustrate their application in real-world scenarios. The handbook also covers essential topics such as component selection and placement, soldering techniques, trace routing guidelines, and manufacturing processes. It emphasizes the importance of design for manufacturability (DFM) and provides valuable insights on how to optimize circuit designs for efficient and cost-effective assembly. One of the key strengths of "Circuit Design Laws" is its practical approach. Throughout the book, readers will find step-by-step instructions, design checklists, and troubleshooting tips to help them apply these design laws effectively in their own projects. The book also includes a comprehensive set of design templates and tools that can be used as a starting point for various types of circuit designs. "Circuit Design Laws: A Handbook for Electronic Assembly" is not just a reference book but also a valuable tool for professionals and enthusiasts alike. With its clear explanations, practical examples, and comprehensive coverage of circuit design laws, this handbook empowers readers to create robust and reliable electronic assemblies that meet industry standards and perform optimally in their intended applications. By having this book by their side, designers, engineers, hobbyists, and students alike will be well-equipped to turn their circuit designs into successful, market-ready products while adhering to the essential laws and principles of electronic assembly.
Author : Joseph Fjelstad
Publisher :
ISBN 13 : 9780979618970
Total Pages : 60 pages
Book Rating : 4.6/5 (189 download)
Download or read book Solderless Assembly for Electronics written by Joseph Fjelstad and published by . This book was released on 2017-04 with total page 60 pages. Available in PDF, EPUB and Kindle. Book excerpt: Solder has been a loyal servant of the electronics manufacturing industry for years; however, like any aging servant, the efficacy of solder has been waning as the industry looks to make products increasingly dense. Solder has always been the weak link in the electronics manufacturing process, where a substantial number of defects are created and solder joints remain the most common site of failure in electronic systems. With that in mind, an alternative approach to manufacturing electronic assemblies without the use of solder is discussed in this short book. In most fundamental terms, the process is one where, instead of building PCBs and placing and soldering components to them, a component board is assembled and the terminations on the components are interconnected using traditional PCB processes and bypassing, completely, the high-temperature soldering process. The reader will be shown the numerous prospective advantages and benefits--economic, technical and environmental--of this important alternative approach, including rapid prototyping, which was first suggested 10 years ago and is just now beginning to be appreciated.
Author : William Greig
Publisher : Springer Science & Business Media
ISBN 13 : 0387339132
Total Pages : 312 pages
Book Rating : 4.3/5 (873 download)
Download or read book Integrated Circuit Packaging, Assembly and Interconnections written by William Greig and published by Springer Science & Business Media. This book was released on 2007-04-24 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.
Author : P.J.W. Noble
Publisher : Springer Science & Business Media
ISBN 13 : 1468462342
Total Pages : 213 pages
Book Rating : 4.4/5 (684 download)
Download or read book Printed circuit board assembly written by P.J.W. Noble and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 213 pages. Available in PDF, EPUB and Kindle. Book excerpt: Assembly of 'difficult' components onto printed circuit boards is emerging as an important application area for small, fast industrial robots. For other robot tasks - for example paint spraying or arc welding - the applications engineer can rely on a body of published information representing decades of accumulated knowledge about the actual process being automated. But for the process of assembly relatively little systematically presented knowledge exists, mainly because so much manual assembly depends on extremely subtle co-ordination of hand, eye and brain which is hard to represent directly in engineering terms. As for the particular processes of electronic assembly, they have hardly been covered at all in the literature. Yet the design of a good PCB automation system depends crucially on the responsible engineer fully understanding every aspect of the process he or she is automating, whether working for the electronics manufacturer, an automation company, a research laboratory or a machine builder. The author of this book has had extensive practical experience in all these roles: as a source of great detail on most aspects of the electronic assembly process it will be of unique value not only to the robot specialist but well beyond that to anyone needing to understand how printed circuit boards are manufactured. P. G. Davey Acknowledgements The author is indebted to many companies and individuals from within the pcb assembly industry.
Author : John Hock Lye Pang
Publisher : Springer Science & Business Media
ISBN 13 : 1461404630
Total Pages : 184 pages
Book Rating : 4.4/5 (614 download)
Download or read book Lead Free Solder written by John Hock Lye Pang and published by Springer Science & Business Media. This book was released on 2011-10-15 with total page 184 pages. Available in PDF, EPUB and Kindle. Book excerpt: Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests.
