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Author : Willem Dirk van Driel
Publisher : Springer Nature
ISBN 13 : 3031593618
Total Pages : 405 pages
Book Rating : 4.0/5 (315 download)
Download or read book Recent Advances in Microelectronics Reliability written by Willem Dirk van Driel and published by Springer Nature. This book was released on with total page 405 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Arun Kumar Sinha
Publisher : World Scientific
ISBN 13 : 9814704849
Total Pages : 675 pages
Book Rating : 4.8/5 (147 download)
Download or read book Recent Advances In Mathematics, Statistics And Computer Science 2015 - International Conference written by Arun Kumar Sinha and published by World Scientific. This book was released on 2016-06-09 with total page 675 pages. Available in PDF, EPUB and Kindle. Book excerpt: This unique volume presents the scientific achievements, significant discoveries and pioneering contributions of various academicians, industrialist and research scholars. The book is an essential source of reference and provides a comprehensive overview of the author's work in the field of mathematics, statistics and computer science.
Author : Mohd Arif Anuar Mohd Salleh
Publisher : Springer Nature
ISBN 13 : 3030934411
Total Pages : 332 pages
Book Rating : 4.0/5 (39 download)
Download or read book Recent Progress in Lead-Free Solder Technology written by Mohd Arif Anuar Mohd Salleh and published by Springer Nature. This book was released on 2022-03-01 with total page 332 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials’ development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.
Author : Rajesh Gomatam
Publisher : BRILL
ISBN 13 : 9004165924
Total Pages : 434 pages
Book Rating : 4.0/5 (41 download)
Download or read book Electrically Conductive Adhesives written by Rajesh Gomatam and published by BRILL. This book was released on 2008-12-23 with total page 434 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is based on two Special Issues of the Journal of Adhesion Science and Technology (JAST vol. 22, no. 8-9 and vol. 22, no. 14) dedicated to the logic of electrically conductive adhesives. The contains a total of 21 papers (reflecting overviews and original research).
Author : Esteban Tlelo-Cuautle
Publisher : BoD – Books on Demand
ISBN 13 : 9533073233
Total Pages : 384 pages
Book Rating : 4.5/5 (33 download)
Download or read book Advances in Analog Circuits written by Esteban Tlelo-Cuautle and published by BoD – Books on Demand. This book was released on 2011-02-02 with total page 384 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book highlights key design issues and challenges to guarantee the development of successful applications of analog circuits. Researchers around the world share acquired experience and insights to develop advances in analog circuit design, modeling and simulation. The key contributions of the sixteen chapters focus on recent advances in analog circuits to accomplish academic or industrial target specifications.
Author : K. L. Mittal
Publisher : John Wiley & Sons
ISBN 13 : 1119407516
Total Pages : 458 pages
Book Rating : 4.1/5 (194 download)
Download or read book Progress in Adhesion and Adhesives, Volume 2 written by K. L. Mittal and published by John Wiley & Sons. This book was released on 2017-06-23 with total page 458 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the ever-increasing amount of research being published it is a Herculean task to be fully conversant with the latest research developments in any field, and the arena of adhesion and adhesives is no exception. Thus, topical review articles provide an alternate and very efficient way to stay abreast of the state-of-the-art in may subjects representing the field of adhesion science and adheisves. Based on the success and the warm reception accorded to the premier volume in this series “Progress in Adhesion and Adhesives” (containing the review articles published in Volume 2 (2014) of the journal Reviews of Adhesion and Adhesives (RAA)), volume 2 comprises 14 review articles published in Volume 4 (2016) of RAA. The subjects of these 14 reviews fall into the following general areas: 1. Surface modification of polymers for a variety of purposes. 2. Adhesion aspects in reinforced composites 3. Thin films/coatings and their adhesion measurement 4. Bioadhesion and bio-implants 5. Adhesives and adhesive joints 6. General adhesion aspects The topics covered include: surface modification of natural fibers for reinforced polymer composites; adhesion of submicrometer thin metals films; surface treatments to modulate bioadhesion; hot-melt adhesives from renewable resources; particulate-polymer composites; functionally graded adhesively bonded joints; fabrication of nano-biodevices; effects of particulates on contact angles , thermal stresses in adhesively bonded joints and ways to mitigate these; laser-assisted electroless metallization of polymer materials; adhesion measurement of coatings on biodevices/implants; cyanoacrylate adhesives; and adhesion of green flame retardant coatings onto polyolefins.
Author :
Publisher : ScholarlyEditions
ISBN 13 : 1464963916
Total Pages : 1976 pages
Book Rating : 4.4/5 (649 download)
Download or read book Issues in Electronics Research and Application: 2011 Edition written by and published by ScholarlyEditions. This book was released on 2012-01-09 with total page 1976 pages. Available in PDF, EPUB and Kindle. Book excerpt: Issues in Electronics Research and Application: 2011 Edition is a ScholarlyEditions™ eBook that delivers timely, authoritative, and comprehensive information about Electronics Research and Application. The editors have built Issues in Electronics Research and Application: 2011 Edition on the vast information databases of ScholarlyNews.™ You can expect the information about Electronics Research and Application in this eBook to be deeper than what you can access anywhere else, as well as consistently reliable, authoritative, informed, and relevant. The content of Issues in Electronics Research and Application: 2011 Edition has been produced by the world’s leading scientists, engineers, analysts, research institutions, and companies. All of the content is from peer-reviewed sources, and all of it is written, assembled, and edited by the editors at ScholarlyEditions™ and available exclusively from us. You now have a source you can cite with authority, confidence, and credibility. More information is available at http://www.ScholarlyEditions.com/.
Author : Thunshun Warren Liao
Publisher : World Scientific
ISBN 13 : 981277985X
Total Pages : 816 pages
Book Rating : 4.8/5 (127 download)
Download or read book Recent Advances in Data Mining of Enterprise Data written by Thunshun Warren Liao and published by World Scientific. This book was released on 2008 with total page 816 pages. Available in PDF, EPUB and Kindle. Book excerpt: The main goal of the new field of data mining is the analysis of large and complex datasets. Some very important datasets may be derived from business and industrial activities. This kind of data is known as ?enterprise data?. The common characteristic of such datasets is that the analyst wishes to analyze them for the purpose of designing a more cost-effective strategy for optimizing some type of performance measure, such as reducing production time, improving quality, eliminating wastes, or maximizing profit. Data in this category may describe different scheduling scenarios in a manufacturing environment, quality control of some process, fault diagnosis in the operation of a machine or process, risk analysis when issuing credit to applicants, management of supply chains in a manufacturing system, or data for business related decision-making.
Author : John H. Lau
Publisher : Springer
ISBN 13 : 9811088845
Total Pages : 319 pages
Book Rating : 4.8/5 (11 download)
Download or read book Fan-Out Wafer-Level Packaging written by John H. Lau and published by Springer. This book was released on 2018-04-05 with total page 319 pages. Available in PDF, EPUB and Kindle. Book excerpt: This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP – such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. – are not well understood. Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.
Author : Mikhail Baklanov
Publisher : John Wiley & Sons
ISBN 13 : 0470065419
Total Pages : 508 pages
Book Rating : 4.4/5 (7 download)
Download or read book Dielectric Films for Advanced Microelectronics written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2007-04-04 with total page 508 pages. Available in PDF, EPUB and Kindle. Book excerpt: The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and diagnostics are a few examples of the miniaturized device technologies that depend on the utilization of thin film materials. This book presents an in-depth overview of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. It contains clear, concise explanations of material science of dielectric films and their problem for device operation, including high-k, low-k, medium-k dielectric films and also specific features and requirements for dielectric films used in the packaging technology. A broad range of related topics are covered, from physical principles to design, fabrication, characterization, and applications of novel dielectric films.
Author : Isaac M. Daniel
Publisher : Springer Science & Business Media
ISBN 13 : 1402006837
Total Pages : 834 pages
Book Rating : 4.4/5 (2 download)
Download or read book Recent Advances in Experimental Mechanics written by Isaac M. Daniel and published by Springer Science & Business Media. This book was released on 2002-06-30 with total page 834 pages. Available in PDF, EPUB and Kindle. Book excerpt: This state-of-the-art volume covers a wide range of subjects in experimental mechanics including optical methods of stress analysis (photoelasticity, moirè, etc.), composite materials, sandwich construction, fracture mechanics, fatigue and damage, nondestructive evaluation, dynamic problems, foam, materials, fiber optic sensors, speckle metrology, digital image processing, nanotechnology, neutron diffraction and synchrotron radiation methods. Written by leading scientists in the field, the book contains 71 papers presented at the Symposium on "Recent Advances in Experimental Mechanics", which was organized in honor of Professor I.M. Daniel at Virginia Tech, on June 23-28, 2002. The book presents a thorough review of the latest problems of experimental mechanics. It is a vital supplement and reference source for researchers, practicing engineers and students.
Author : Hoang Pham
Publisher : Springer Science & Business Media
ISBN 13 : 1848001134
Total Pages : 524 pages
Book Rating : 4.8/5 (48 download)
Download or read book Recent Advances in Reliability and Quality in Design written by Hoang Pham and published by Springer Science & Business Media. This book was released on 2008-05-20 with total page 524 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the latest theories and methods of reliability and quality, with emphasis on reliability and quality in design and modelling. Each chapter is written by active researchers and professionals with international reputations, providing material which bridges the gap between theory and practice to trigger new practices and research challenges. The book therefore provides a state-of-the-art survey of reliability and quality in design and practices.
Author : Krishna B. Misra
Publisher : Springer Nature
ISBN 13 : 3030557324
Total Pages : 811 pages
Book Rating : 4.0/5 (35 download)
Download or read book Handbook of Advanced Performability Engineering written by Krishna B. Misra and published by Springer Nature. This book was released on 2020-11-16 with total page 811 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book considers all aspects of performability engineering, providing a holistic view of the activities associated with a product throughout its entire life cycle of the product, as well as the cost of minimizing the environmental impact at each stage, while maximizing the performance. Building on the editor's previous Handbook of Performability Engineering, it explains how performability engineering provides us with a framework to consider both dependability and sustainability in the optimal design of products, systems and services, and explores the role of performability in energy and waste minimization, raw material selection, increased production volume, and many other areas of engineering and production. The book discusses a range of new ideas, concepts, disciplines, and applications in performability, including smart manufacturing and Industry 4.0; cyber-physical systems and artificial intelligence; digital transformation of railways; and asset management. Given its broad scope, it will appeal to researchers, academics, industrial practitioners and postgraduate students involved in manufacturing, engineering, and system and product development.
Author :
Publisher :
ISBN 13 :
Total Pages : 412 pages
Book Rating : 4.3/5 (91 download)
Download or read book Microcircuit Reliability Bibliography written by and published by . This book was released on 1978 with total page 412 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Dongkai Shangguan
Publisher : CRC Press
ISBN 13 : 1040028640
Total Pages : 463 pages
Book Rating : 4.0/5 (4 download)
Download or read book Direct Copper Interconnection for Advanced Semiconductor Technology written by Dongkai Shangguan and published by CRC Press. This book was released on 2024-06-28 with total page 463 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.
Author : Alberto Adriano Cavalheiro
Publisher : BoD – Books on Demand
ISBN 13 : 1803556811
Total Pages : 129 pages
Book Rating : 4.8/5 (35 download)
Download or read book New Advances in Semiconductors written by Alberto Adriano Cavalheiro and published by BoD – Books on Demand. This book was released on 2022-06-15 with total page 129 pages. Available in PDF, EPUB and Kindle. Book excerpt: New Advances in Semiconductors brings together contributions from important researchers around the world on semiconductor materials and their applications. It includes seven chapters in two sections: “Calculations and Simulations in Semiconductors” and “Semiconductor Materials.” The world will emerge different after the social and economic reorganizations caused by the COVID-19 pandemic and will be even more dependent on semiconductors than ever before. New Advances in Semiconductors is a book that brings together the contributions of important researchers around the world and is able to give an idea about the different characteristics of semiconductor materials and their applications. There is a section dedicated to theory, calculations and logic and another dedicated to the development and characterization of semiconductor materials of great future interest. I really hope that this book will help to spread knowledge about this research field to other researchers and students working in this area or even to those interested in starting their more advanced studies.
Author : M O Alam
Publisher : Elsevier
ISBN 13 : 0857092898
Total Pages : 279 pages
Book Rating : 4.8/5 (57 download)
Download or read book Advanced Adhesives in Electronics written by M O Alam and published by Elsevier. This book was released on 2011-05-25 with total page 279 pages. Available in PDF, EPUB and Kindle. Book excerpt: Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties.The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics.With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. - Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications - Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems - Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques
