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Qpedia Thermal Management Electronics Cooling Book Volume 2
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Book Synopsis Qpedia Thermal Management – Electronics Cooling Book, Volume 2 by : Advanced Thermal Solutions
Download or read book Qpedia Thermal Management – Electronics Cooling Book, Volume 2 written by Advanced Thermal Solutions and published by Advanced Thermal Solutions. This book was released on 2008 with total page 206 pages. Available in PDF, EPUB and Kindle. Book excerpt: The complete editorial contents of Qpedia Thermal eMagazine, Volume 2, Issues 1 - 12 features in-depth, technical articles on the most critical topics in the thermal management of electronics.
Book Synopsis Qpedia Thermal Management – Electronics Cooling Book, Volume 1 by :
Download or read book Qpedia Thermal Management – Electronics Cooling Book, Volume 1 written by and published by Advanced Thermal Solutions. This book was released on with total page 186 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Qpedia Thermal Management – Electronics Cooling Book, Volume 3 by : Advanced Thermal Solutions
Download or read book Qpedia Thermal Management – Electronics Cooling Book, Volume 3 written by Advanced Thermal Solutions and published by Advanced Thermal Solutions. This book was released on 2009 with total page 204 pages. Available in PDF, EPUB and Kindle. Book excerpt: The complete editorial contents of Qpedia Thermal eMagazine, Volume 3, Issues 1 - 12 features in-depth, technical articles covering the most critical areas of electronics cooling.
Book Synopsis Electronics Cooling by : S. M. Sohel Murshed
Download or read book Electronics Cooling written by S. M. Sohel Murshed and published by BoD – Books on Demand. This book was released on 2016-06-15 with total page 184 pages. Available in PDF, EPUB and Kindle. Book excerpt: Featuring contributions from the renowned researchers and academicians in the field, this book covers key conventional and emerging cooling techniques and coolants for electronics cooling. It includes following thematic topics: - Cooling approaches and coolants - Boiling and phase change-based technologies - Heat pipes-based cooling - Microchannels cooling systems - Heat loop cooling technology - Nanofluids as coolants - Theoretical development for the junction temperature of package chips. This book is intended to be a reference source and guide to researchers, engineers, postgraduate students, and academicians in the fields of thermal management and cooling technologies as well as for people in the electronics and semiconductors industries.
Book Synopsis Cooling of Electronic Systems by : Sadik Kakaç
Download or read book Cooling of Electronic Systems written by Sadik Kakaç and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 953 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.
Book Synopsis Thermal Management Research Studies. Volume 1. Electronics Cooling by :
Download or read book Thermal Management Research Studies. Volume 1. Electronics Cooling written by and published by . This book was released on 1996 with total page 152 pages. Available in PDF, EPUB and Kindle. Book excerpt: An innovative cooling concept called 'venturi flow cooling' has been introduced and developed for potential use in the thermal management of the advanced high power electronic devices. Single phase cooling medium is effectively used to create very high velocities in localized region of interest to improve heat transfer. Several different test apparatus have been built to investigate the heat transfer and flow phenomena. Using the venturi flow system and water, power devices, such as MCT and IGBT, were successfully tested at their rated current and frequency levels never possible with other cooling methods. Heat flux up to 257 W/(sq. cm) and heat transfer coefficient up to 13 W/(sq. cm). deg C were demonstrated in this cooling system. This cooling technique is highly recommended for the future electronic cooling applications of the emerging more electric airplane systems involving very high intensity localized heat dissipation devices. This report presents the detailed descriptions of all aspects of this project.
Book Synopsis Advances in Mechanical and Materials Technology by : Kannan Govindan
Download or read book Advances in Mechanical and Materials Technology written by Kannan Govindan and published by Springer Nature. This book was released on 2022-01-01 with total page 1422 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents select papers from the International Conference on Energy, Material Sciences and Mechanical Engineering (EMSME) - 2020. The book covers the three core areas of energy, material sciences and mechanical engineering. The topics covered include non-conventional energy resources, energy harvesting, polymers, composites, 2D materials, systems engineering, materials engineering, micro-machining, renewable energy, industrial engineering and additive manufacturing. This book will be useful to researchers and professionals working in the areas of mechanical and industrial engineering, materials applications, and energy technology.
Book Synopsis Cooling Of Microelectronic And Nanoelectronic Equipment: Advances And Emerging Research by : Madhusudan Iyengar
Download or read book Cooling Of Microelectronic And Nanoelectronic Equipment: Advances And Emerging Research written by Madhusudan Iyengar and published by World Scientific. This book was released on 2014-08-25 with total page 471 pages. Available in PDF, EPUB and Kindle. Book excerpt: To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.
Book Synopsis Air Cooling Technology for Electronic Equipment by : Sung Jin Kim
Download or read book Air Cooling Technology for Electronic Equipment written by Sung Jin Kim and published by CRC Press. This book was released on 2020-07-24 with total page 260 pages. Available in PDF, EPUB and Kindle. Book excerpt: Clear your bookcase of references containing bits and pieces of useful information and replace them with this thorough, single-volume guide to thermal analysis. Air Cooling Technology for Electronic Equipment is a helpful, practical resource that answers questions frequently asked by thermal and packaging engineers grappling with today's demand for increased thermal control in electronics. Superbly organized for quick reference, the book dedicates each chapter to answering fundamental questions, such as: What is the optimal spacing between the printed circuit boards? What is a good estimate of the heat transfer coefficient and the associate pressure drop for forced convection over package arrays? How are heat transfer and fluid flow characteristics in the entrance region different from those in the fully developed region? What is the effect of substrate conduction on convection cooling? The chapters, written by engineers and engineering educators who are experts in electronic cooling, are packed with details and present the latest developments in air cooling techniques and thermal design guidelines. They provide problem-solving analyses that are jargon-free, straightforward, and easy to understand. Air Cooling Technology for Electronic Equipment is a handy source of technical information for anyone who wants to get the most out of air cooling.
Book Synopsis Liquid Cooling of Electronic Devices by Single-Phase Convection by : Frank P. Incropera
Download or read book Liquid Cooling of Electronic Devices by Single-Phase Convection written by Frank P. Incropera and published by Wiley-Interscience. This book was released on 1999-05-31 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Liquid Cooling of Electronic Devices by Single-Phase Convection offers the first comprehensive and in-depth coverage of liquid convection as it applies to state-of-the-art thermal management systems. In this book, Dr. Incropera culls ten years of research results, clarifies the physical mechanisms associated with single-phase convection in the context of electronic cooling, and provides working engineers with a solid foundation for the design and development of rational liquid cooling systems. For those involved in designing these products - mechanical and electrical engineers, electronic packaging engineers, technical staff, and others - this book provides an invaluable road map to meet the challenge.
Book Synopsis Embedded Cooling Of Electronic Devices: Conduction, Evaporation, And Single- And Two-phase Convection by : Madhusudan Iyengar
Download or read book Embedded Cooling Of Electronic Devices: Conduction, Evaporation, And Single- And Two-phase Convection written by Madhusudan Iyengar and published by World Scientific. This book was released on 2024-01-10 with total page 479 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues.The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics.This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required.
Book Synopsis Thermal Measurements in Electronics Cooling by : Kaveh Azar
Download or read book Thermal Measurements in Electronics Cooling written by Kaveh Azar and published by CRC Press. This book was released on 2020-08-26 with total page 496 pages. Available in PDF, EPUB and Kindle. Book excerpt: Filled with careful explanations, step-by-step instructions, and useful examples, this handbook focuses on real-world considerations and applications of thermal measurement methods in electronics cooling. Fifteen experts in thermal engineering combine their expertise to create a complete guide to this complex topic. This practical reference covers all aspects of thermal characterization in electronics cooling and thermal management. The first part of the book introduces the concept of electronics cooling and its associated thermal phenomenon and explains why experimental investigation is required. Subsequent chapters explain methods of measuring different parameters and introduce relevant examples. Sources for locating needed equipment, tables, checklists, and to-do lists are included. Sample calculations and methodologies for error analysis ensure that you can put this valuable information to use in your work.
Book Synopsis Cooling of Electronic Equipment by : Allan W. Scott
Download or read book Cooling of Electronic Equipment written by Allan W. Scott and published by Wiley-Interscience. This book was released on 1974 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Cooling Techniques for Electronic Equipment by : Dave S. Steinberg
Download or read book Cooling Techniques for Electronic Equipment written by Dave S. Steinberg and published by Wiley-Interscience. This book was released on 1991-10-22 with total page 518 pages. Available in PDF, EPUB and Kindle. Book excerpt: Details infallible techniques for designing electronic hardware to withstand severe thermal environments. Using both SI and English units throughout, it presents methods for the development of various reliable electronic systems without the need of high-speed computers. It also offers mathematical modeling applications, using analog resistor networks, to provide the breakup of complex systems into numerous individual thermal resistors and nodes for those who prefer high-speed digital computer solutions to thermal problems.
Book Synopsis Optimized Thermoelectric Cooling Strategies for High Performance Electronics by : Ali-Reza Asarizadeh
Download or read book Optimized Thermoelectric Cooling Strategies for High Performance Electronics written by Ali-Reza Asarizadeh and published by . This book was released on 2015 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Thermoelectric components (TECs) and other electronic cooling components such as micro-heat sinks have been shown to provide effective cooling for integrated circuits (ICs). A review of available literature has shown effective temperature control using these components separately, and to a lesser extent, using configurations containing multiple approaches for cooling to sub-ambient levels. However, little data are available for sizing thermal management packages focusing on shrinking the device footprint. This suggests that more experimental data of multi-component cooling strategies are needed to leverage the advantages and demonstrate superior cooling performance on a smaller scale. In some electronics devices, such as spectrometers or photodetectors, the quality of spectral data obtained is adversely affected by increases in device temperature. Physically speaking, this is due to the fact that, at higher temperatures, the charged particles are stimulated and released from the boundary region, a process known as thermionic emission. Reducing the local temperature will help minimize the effects of heat generation and the overall noise associated with this heat buildup. The thesis sets out to assess the feasibility and practicality of implementing a TEC-based thermal management system for use in electronic packaging and in particular, for spectrometers in the nanophotonics industry. A heat sink and fan were used as auxiliary components to aid the heat dissipation process. The key areas that needed to be addressed include surface temperature stability, sub-ambient cooling capability, and scale down potential of the overall device. Cooling of surfaces down to at least -10°C (from ambient) was conducted using several heat sink and thermoelectric device configurations. Temperature stability was demonstrated through low temperature fluctuations (0.2°C/h surface warm up rate) for a 5 hour timeframe. Preliminary results demonstrate a 78% reduction of heat sink size down to 57 cm3 (surface area 172 cm2) while maintaining a -10°C surface temperature. Maximum surface cooling down to -22.4°C was achieved using 254 cm3 heat sink volume (surface area 1443 cm2). The results also show a strong correlation between available heat sink surface area and cooling performance. Continuing improvements such as introducing a phase change liquid and further size reductions to key components (fans, TEC, heat sinks, etc.) can potentially help scale down the thermal management system even more.
Book Synopsis Reciprocating Mechanism-Driven Heat Loop (RMDHL) Cooling Technology for Power Electronic Systems by : Olubunmi Popoola
Download or read book Reciprocating Mechanism-Driven Heat Loop (RMDHL) Cooling Technology for Power Electronic Systems written by Olubunmi Popoola and published by . This book was released on 2016 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The most significant hindrances to the technological advances in high power electronics (HPE) and digital computational devices (DCD) has always been the issue of effective thermal management. Energy losses during operation cause heat to build up in these components, resulting in temperature rise. Finding effective thermal solutions will become a major constraint for the reduction of cost and time-to-market, two governing factors between success and failure in commercial evolution of technology. Even when high temperatures are not reached, high thermal stresses because of temperature variations are major causes of failure in electronic components mounted on circuit boards. An effective electronic cooling technique, which is based on reciprocating heat pipe, is the so-called reciprocating mechanism-driven heat loop (RMDHL) that has a heat transfer mechanism different from those of traditional heat pipes. Experimental results show that the heat loop worked very effectively and a heat flux as high as 300 W/cm2 in the evaporator section could be handled. In addition to eliminating the cavitation problem associated with traditional two-phase heat loops, the RMDHL also provides superior cooling advantage with respect to temperature uniformity. Considering the other advantages of coolant leakage free and the absence of cavitation problems for aerospace-related applications, the single phase RMDHL could be an alternative of a conventional liquid cooling system (LCS) for electronic cooling applications. This chapter will provide insight into experimental, numerical and analytical study undertaken for RMDHL in connection with high heat and high heat flux thermal management applications and electronic cooling. In addition to clarifying the fundamental physics behind the working mechanism of RMDHLs, a working criterion has also been derived, which could provide a guidance for the design of a reciprocating mechanism-driven heat loop.
Download or read book More Hot Air written by Tony Kordyban and published by ASME Press. This book was released on 2005-01-01 with total page 291 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Each case study, told as an anecdote, is designed to teach a basic concept of heat transfer, as applied to keeping electronics from overheating. Many people not trained in the basics of heat transfer have been roped into doing this job out of necessity. For those who lack any formal training in heat transfer, the case studies explode many of the myths about cooling electronics and replace these flawed practices with sound engineering, based on actual heat transfer theory. The case studies and humor in this book are also entertaining to those well versed in electronics cooling."--BOOK JACKET.
