Processing Materials Of 3d Interconnects Damascene And Electronics Packaging 6

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Processing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6

Author : K. Kondo
Publisher : The Electrochemical Society
ISBN 13 : 1607686201
Total Pages : 140 pages
Book Rating : 4.6/5 (76 download)

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Book Synopsis Processing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6 by : K. Kondo

Download or read book Processing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6 written by K. Kondo and published by The Electrochemical Society. This book was released on 2015-04-30 with total page 140 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 7

Author : K. Kondo
Publisher : The Electrochemical Society
ISBN 13 : 1607686716
Total Pages : 119 pages
Book Rating : 4.6/5 (76 download)

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Book Synopsis Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 7 by : K. Kondo

Download or read book Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 7 written by K. Kondo and published by The Electrochemical Society. This book was released on 2015 with total page 119 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Processing, Materials, and Integration of Damascene and 3D Interconnects

Author : J. C. Flake
Publisher : The Electrochemical Society
ISBN 13 : 1566778123
Total Pages : 171 pages
Book Rating : 4.5/5 (667 download)

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Book Synopsis Processing, Materials, and Integration of Damascene and 3D Interconnects by : J. C. Flake

Download or read book Processing, Materials, and Integration of Damascene and 3D Interconnects written by J. C. Flake and published by The Electrochemical Society. This book was released on 2010-04 with total page 171 pages. Available in PDF, EPUB and Kindle. Book excerpt: This issue focuses on recent advances in damascene interconnects and 3D interconnects.

Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 7

Author : K. Kondi
Publisher :
ISBN 13 : 9781623323134
Total Pages : pages
Book Rating : 4.3/5 (231 download)

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Book Synopsis Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 7 by : K. Kondi

Download or read book Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 7 written by K. Kondi and published by . This book was released on 2015 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Wafer Level 3-D ICs Process Technology

Author : Chuan Seng Tan
Publisher : Springer Science & Business Media
ISBN 13 : 0387765344
Total Pages : 365 pages
Book Rating : 4.3/5 (877 download)

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Book Synopsis Wafer Level 3-D ICs Process Technology by : Chuan Seng Tan

Download or read book Wafer Level 3-D ICs Process Technology written by Chuan Seng Tan and published by Springer Science & Business Media. This book was released on 2009-06-29 with total page 365 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.

Thin Film Materials, Processes, and Reliability

Author : G. S. Mathad
Publisher : The Electrochemical Society
ISBN 13 : 9781566773935
Total Pages : 438 pages
Book Rating : 4.7/5 (739 download)

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Book Synopsis Thin Film Materials, Processes, and Reliability by : G. S. Mathad

Download or read book Thin Film Materials, Processes, and Reliability written by G. S. Mathad and published by The Electrochemical Society. This book was released on 2003 with total page 438 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Handbook of Wafer Bonding

Author : Peter Ramm
Publisher : John Wiley & Sons
ISBN 13 : 3527644237
Total Pages : 435 pages
Book Rating : 4.5/5 (276 download)

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Book Synopsis Handbook of Wafer Bonding by : Peter Ramm

Download or read book Handbook of Wafer Bonding written by Peter Ramm and published by John Wiley & Sons. This book was released on 2011-11-17 with total page 435 pages. Available in PDF, EPUB and Kindle. Book excerpt: The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.

Heterogeneous Integrations

Author : John H. Lau
Publisher : Springer
ISBN 13 : 9811372241
Total Pages : 381 pages
Book Rating : 4.8/5 (113 download)

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Book Synopsis Heterogeneous Integrations by : John H. Lau

Download or read book Heterogeneous Integrations written by John H. Lau and published by Springer. This book was released on 2019-04-03 with total page 381 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.

Dielectrics for Nanosystems

Author :
Publisher : The Electrochemical Society
ISBN 13 : 9781566774178
Total Pages : 508 pages
Book Rating : 4.7/5 (741 download)

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Book Synopsis Dielectrics for Nanosystems by :

Download or read book Dielectrics for Nanosystems written by and published by The Electrochemical Society. This book was released on 2004 with total page 508 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Semiconductor Wafer Bonding VII : Science, Technology, and Applications

Author :
Publisher : The Electrochemical Society
ISBN 13 : 9781566774024
Total Pages : 408 pages
Book Rating : 4.7/5 (74 download)

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Book Synopsis Semiconductor Wafer Bonding VII : Science, Technology, and Applications by :

Download or read book Semiconductor Wafer Bonding VII : Science, Technology, and Applications written by and published by The Electrochemical Society. This book was released on 2003 with total page 408 pages. Available in PDF, EPUB and Kindle. Book excerpt:

ULSI Process Integration 5

Author : Cor L. Claeys
Publisher : The Electrochemical Society
ISBN 13 : 1566775728
Total Pages : 509 pages
Book Rating : 4.5/5 (667 download)

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Book Synopsis ULSI Process Integration 5 by : Cor L. Claeys

Download or read book ULSI Process Integration 5 written by Cor L. Claeys and published by The Electrochemical Society. This book was released on 2007 with total page 509 pages. Available in PDF, EPUB and Kindle. Book excerpt: The symposium provided a forum for reviewing and discussing all aspects of process integration, with special focus on nanoscaled technologies, 65 nm and beyond on DRAM, SRAM, flash memory, high density logic-low power, RF, mixed analog-digital, process integration yield, CMP chemistries, low-k processes, gate stacks, metal gates, rapid thermal processing, silicides, copper interconnects, carbon nanotubes, novel materials, high mobility substrates (SOI, sSi, SiGe, GeOI), strain engineering, and hybrid integration.

Handbook of 3D Integration, Volume 3

Author : Philip Garrou
Publisher : John Wiley & Sons
ISBN 13 : 3527334661
Total Pages : 484 pages
Book Rating : 4.5/5 (273 download)

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Book Synopsis Handbook of 3D Integration, Volume 3 by : Philip Garrou

Download or read book Handbook of 3D Integration, Volume 3 written by Philip Garrou and published by John Wiley & Sons. This book was released on 2014-07-21 with total page 484 pages. Available in PDF, EPUB and Kindle. Book excerpt: Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers.

3D Microelectronic Packaging

Author : Yan Li
Publisher : Springer Nature
ISBN 13 : 9811570906
Total Pages : 629 pages
Book Rating : 4.8/5 (115 download)

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Book Synopsis 3D Microelectronic Packaging by : Yan Li

Download or read book 3D Microelectronic Packaging written by Yan Li and published by Springer Nature. This book was released on 2020-11-23 with total page 629 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.

Materials for Information Technology

Author : Ehrenfried Zschech
Publisher : Springer Science & Business Media
ISBN 13 : 1846282357
Total Pages : 498 pages
Book Rating : 4.8/5 (462 download)

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Book Synopsis Materials for Information Technology by : Ehrenfried Zschech

Download or read book Materials for Information Technology written by Ehrenfried Zschech and published by Springer Science & Business Media. This book was released on 2006-07-02 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries.

Materials and Technologies for 3-D Integration

Author : Fred Roozeboom
Publisher :
ISBN 13 :
Total Pages : 304 pages
Book Rating : 4.:/5 (318 download)

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Book Synopsis Materials and Technologies for 3-D Integration by : Fred Roozeboom

Download or read book Materials and Technologies for 3-D Integration written by Fred Roozeboom and published by . This book was released on 2009 with total page 304 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Semiconductor Packaging

Author : Andrea Chen
Publisher : CRC Press
ISBN 13 : 1439862079
Total Pages : 216 pages
Book Rating : 4.4/5 (398 download)

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Book Synopsis Semiconductor Packaging by : Andrea Chen

Download or read book Semiconductor Packaging written by Andrea Chen and published by CRC Press. This book was released on 2016-04-19 with total page 216 pages. Available in PDF, EPUB and Kindle. Book excerpt: In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.

Electronic Packaging Science and Technology

Author : King-Ning Tu
Publisher : John Wiley & Sons
ISBN 13 : 1119418313
Total Pages : 340 pages
Book Rating : 4.1/5 (194 download)

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Book Synopsis Electronic Packaging Science and Technology by : King-Ning Tu

Download or read book Electronic Packaging Science and Technology written by King-Ning Tu and published by John Wiley & Sons. This book was released on 2021-12-29 with total page 340 pages. Available in PDF, EPUB and Kindle. Book excerpt: Must-have reference on electronic packaging technology! The electronics industry is shifting towards system packaging technology due to the need for higher chip circuit density without increasing production costs. Electronic packaging, or circuit integration, is seen as a necessary strategy to achieve a performance growth of electronic circuitry in next-generation electronics. With the implementation of novel materials with specific and tunable electrical and magnetic properties, electronic packaging is highly attractive as a solution to achieve denser levels of circuit integration. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology.