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Proceedings Of The Second International Symposium On Corrosion And Reliability Of Electronic Materials And Devices
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Book Synopsis Proceedings of the Second International Symposium on Corrosion and Reliability of Electronic Materials and Devices by : Robert B. Comizzoli
Download or read book Proceedings of the Second International Symposium on Corrosion and Reliability of Electronic Materials and Devices written by Robert B. Comizzoli and published by . This book was released on 1993 with total page 604 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Proceedings of the Third International Symposium on Corrosion and Reliability of Electronic Materials and Devices by : Robert B. Comizzoli
Download or read book Proceedings of the Third International Symposium on Corrosion and Reliability of Electronic Materials and Devices written by Robert B. Comizzoli and published by The Electrochemical Society. This book was released on 1994 with total page 436 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Corrosion and Reliability of Electronic Materials and Devices by : Robert B. Comizzoli
Download or read book Corrosion and Reliability of Electronic Materials and Devices written by Robert B. Comizzoli and published by The Electrochemical Society. This book was released on 1999 with total page 308 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Corrosion and Reliability of Electronic Materials and Devices by : Electrochemical Society. Corrosion Division
Download or read book Corrosion and Reliability of Electronic Materials and Devices written by Electrochemical Society. Corrosion Division and published by . This book was released on 1999 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis National Semiconductor Metrology Program, Semiconductor Electronics Division, NIST List Of Publications, LP 103, March 1999 by :
Download or read book National Semiconductor Metrology Program, Semiconductor Electronics Division, NIST List Of Publications, LP 103, March 1999 written by and published by . This book was released on 1999 with total page 148 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Semiconductor Measurement Technology by : National Institute of Standards and Technology (U.S.)
Download or read book Semiconductor Measurement Technology written by National Institute of Standards and Technology (U.S.) and published by . This book was released on with total page 72 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis National Semiconductor Metrology Program by : National Semiconductor Metrology Program (U.S.)
Download or read book National Semiconductor Metrology Program written by National Semiconductor Metrology Program (U.S.) and published by . This book was released on 1997 with total page 120 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis National Semiconductor Metrology Program, NIST List OF Publications, LP 103, May 2000 by :
Download or read book National Semiconductor Metrology Program, NIST List OF Publications, LP 103, May 2000 written by and published by . This book was released on 2000 with total page 160 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis National Semiconductor Metrology Program by : National Institute of Standards and Technology (U.S.)
Download or read book National Semiconductor Metrology Program written by National Institute of Standards and Technology (U.S.) and published by . This book was released on 2000 with total page 160 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Electronic Packaging Materials Science by :
Download or read book Electronic Packaging Materials Science written by and published by . This book was released on 1995 with total page 320 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Electronic Packaging Materials Science VIII: Volume 390 by : Robert C. Sundahl
Download or read book Electronic Packaging Materials Science VIII: Volume 390 written by Robert C. Sundahl and published by . This book was released on 1995-09-26 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: The dynamic nature of the microelectronics industry, in particular within the area of packaging, requires a continuous updating and revision of priorities. In an effort to communicate these priorities to researchers and engineers in the field, the National Technology Road Map was developed. This proceedings volume, the eighth in a series on electronic packaging, focuses on the materials research, development and processing issues identified in the road map. Topics include: an overview of the National Technology Road Map for Semiconductors; institutional and industrial perspectives; impact on materials needs and materials science issues; and research responses. Technical subtopics include polymers, ceramics, solder and composites.
Book Synopsis Proceedings of the Second International Symposium on Diamond Materials by : A. J. Purdes
Download or read book Proceedings of the Second International Symposium on Diamond Materials written by A. J. Purdes and published by . This book was released on 1991 with total page 698 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis American Book Publishing Record by :
Download or read book American Book Publishing Record written by and published by . This book was released on 2001 with total page 2740 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Resilient Power Electronic Systems by : Shahriyar Kaboli
Download or read book Resilient Power Electronic Systems written by Shahriyar Kaboli and published by John Wiley & Sons. This book was released on 2022-08-15 with total page 388 pages. Available in PDF, EPUB and Kindle. Book excerpt: Resilient Power Electronic Systems Discover an advanced reference offering a powerful novel approach to the design and use of reliable and fault-tolerant power electronic systems In Resilient Power Electronic Systems, a team of accomplished researchers deliver an insightful treatment of the challenges faced by practitioners and researchers working with power electronic converters and attempting to analyze internal and external failure mechanisms. The authors expertly present advanced techniques for reducing noise effects on fault detection and prognosis. Comprised of thirteen chapters, the authors discuss the concepts of resilience and effective operative life in the context of power electronics. The differences between reliable and efficient systems are discussed, as well as the nature of these differences in complex systems. Finally, the book explores various methods to improve the resilience of power converters. Resilient Power Electronic Systems is packed with features, including illustrations, practice problems, and PowerPoint presentations. The book also includes: A thorough introduction to the application of power electronics in various industries, as well as the concept of resilience in a power converter Comprehensive explorations of resilience against fault tolerance, including fault-tolerant power converters and resilient power converters Practical discussions of the state-of-the-art in resilient power converters, including examinations of mission-critical applications In-depth examinations of internal and external fault in power converters with mission-critical applications Resilient Power Electronic Systems is an indispensable resource for researchers, professionals, and postgraduate students studying power electronics. It’s also an ideal reference for research and development engineers working with the design and development of power electronic converters.
Book Synopsis Electrical Contacts by : Paul G. Slade
Download or read book Electrical Contacts written by Paul G. Slade and published by CRC Press. This book was released on 2017-12-19 with total page 1311 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covering the theory, application, and testing of contact materials, Electrical Contacts: Principles and Applications, Second Edition introduces a thorough discussion on making electric contact and contact interface conduction; presents a general outline of, and measurement techniques for, important corrosion mechanisms; considers the results of contact wear when plug-in connections are made and broken; investigates the effect of thin noble metal plating on electronic connections; and relates crucial considerations for making high- and low-power contact joints. It examines contact use in switching devices, including the interruption of AC and DC circuits with currents in the range 10mA to 100kA and circuits up to 1000V, and describes arc formation between open contacts and between opening contacts. Arcing effects on contacts such as erosion, welding, and contamination are also addressed. Containing nearly 3,000 references, tables, equations, figures, drawings, and photographs, the book provides practical examples encompassing everything from electronic circuits to high power circuits, or microamperes to mega amperes. The new edition: Reflects the latest advances in electrical contact science and technology Examines current research on contact corrosion, materials, and switching Includes updates and revisions in each chapter, as well as up-to-date references and new figures and examples throughout Delivers three new chapters on the effects of dust contamination, electronic sensing for switching systems, and contact phenomena for micro-electronic systems (MEMS) applications With contributions from recognized experts in the field, Electrical Contacts: Principles and Applications, Second Edition assists practicing scientists and engineers in the prevention of costly system failures, as well as offers a comprehensive introduction to the subject for technology graduate students, by expanding their knowledge of electrical contact phenomena.
Book Synopsis Influence of Temperature on Microelectronics and System Reliability by : Pradeep Lall
Download or read book Influence of Temperature on Microelectronics and System Reliability written by Pradeep Lall and published by CRC Press. This book was released on 2020-07-09 with total page 332 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The
Book Synopsis Corrosion Science by : Gerald S. Frankel
Download or read book Corrosion Science written by Gerald S. Frankel and published by The Electrochemical Society. This book was released on 2002 with total page 630 pages. Available in PDF, EPUB and Kindle. Book excerpt:
