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Proceedings Of The Ieee International Interconnect Technology Conferece
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Book Synopsis Proceedings of the IEEE 2007 International Interconnect Technology Conference : Burlingame, CA, June 4-6, 2007 by : International Interconnect Technology Conference
Download or read book Proceedings of the IEEE 2007 International Interconnect Technology Conference : Burlingame, CA, June 4-6, 2007 written by International Interconnect Technology Conference and published by . This book was released on 2007 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Proceedings of the IEEE International Interconnect Technology Conference by :
Download or read book Proceedings of the IEEE International Interconnect Technology Conference written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 2006-01-01 with total page 232 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Proceedings of the IEEE 2000 International Interconnect Technology Conference, Hyatt Regency Hotel, San Francisco Airport, Burlingame, California, June 5-7, 2000 by : IEEE Electron Devices Society
Download or read book Proceedings of the IEEE 2000 International Interconnect Technology Conference, Hyatt Regency Hotel, San Francisco Airport, Burlingame, California, June 5-7, 2000 written by IEEE Electron Devices Society and published by IEEE Standards Office. This book was released on 2000 with total page 277 pages. Available in PDF, EPUB and Kindle. Book excerpt: This work constitutes the proceedings of the 2000 International Interconnect Technology Conference (IITC). It should be useful to process engineers, processing equipment engineers, and engineers and scientists in research and development.
Book Synopsis Oral history interview with Alice Haratunian by :
Download or read book Oral history interview with Alice Haratunian written by and published by . This book was released on 1976 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Born in Tokav, Turkey 1899.
Book Synopsis Proceedings of the IEEE 1998 International Interconnect Technology Conference, Hyatt Regency Hotel, San Francisco, CA, June 1-3, 1998 by :
Download or read book Proceedings of the IEEE 1998 International Interconnect Technology Conference, Hyatt Regency Hotel, San Francisco, CA, June 1-3, 1998 written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1998-01-01 with total page 303 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume is based on a conference designed to provide a forum for profesionals in semiconductor processing, academia and equipment development to present new science and technology. Topics include: interconnect technology trends; interconnect reliability; and more.
Book Synopsis Proceedings of the IEEE 2003 International Interconnect Technology Conference : Hyatt Regency Hotel, Burlingame, CA, June 2-4, 2003 by : IEEE International Interconnect Technology Conference
Download or read book Proceedings of the IEEE 2003 International Interconnect Technology Conference : Hyatt Regency Hotel, Burlingame, CA, June 2-4, 2003 written by IEEE International Interconnect Technology Conference and published by . This book was released on 2003 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Proceedings of the 2013 IEEE International Interconnect Technology Conference by :
Download or read book Proceedings of the 2013 IEEE International Interconnect Technology Conference written by and published by . This book was released on 2013 with total page 161 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Proceedings of the IEEE 2007 International Interconnect Technology Conference by :
Download or read book Proceedings of the IEEE 2007 International Interconnect Technology Conference written by and published by IEEE Computer Society Press. This book was released on 2007-01-01 with total page 215 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :IEEE Electron Devices Society Publisher :Institute of Electrical & Electronics Engineers(IEEE) ISBN 13 :9780780366787 Total Pages :300 pages Book Rating :4.3/5 (667 download)
Book Synopsis Proceedings of the IEEE 2001 International Interconnect Technology Conference by : IEEE Electron Devices Society
Download or read book Proceedings of the IEEE 2001 International Interconnect Technology Conference written by IEEE Electron Devices Society and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 2001 with total page 300 pages. Available in PDF, EPUB and Kindle. Book excerpt: Topics covered in this volume include: silicide/salicide; dielectrics; planarization; metallization; process integration; process control/modelling; reliability; and interconnect systems.
Book Synopsis Proceedings of the IEEE ... International Interconnect Technology Conferece by :
Download or read book Proceedings of the IEEE ... International Interconnect Technology Conferece written by and published by . This book was released on 2004 with total page 288 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :IEEE Electron Devices Society Publisher :Institute of Electrical & Electronics Engineers(IEEE) ISBN 13 :9780780351745 Total Pages :295 pages Book Rating :4.3/5 (517 download)
Book Synopsis Proceedings of the IEEE 1999 International Interconnect Technology Conference, Hyatt Regency Hotel, San Francisco, CA, May 24-26, 1999 by : IEEE Electron Devices Society
Download or read book Proceedings of the IEEE 1999 International Interconnect Technology Conference, Hyatt Regency Hotel, San Francisco, CA, May 24-26, 1999 written by IEEE Electron Devices Society and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1999 with total page 295 pages. Available in PDF, EPUB and Kindle. Book excerpt: The second annual IITC is a premier conference for interconnect technology. The IITC provides a forum for professionals in semiconductor processing, academia and equipment development to present and discuss exciting new science and technology.
Book Synopsis Proceedings of the IEEE 2004 International Interconnect Technology Conference by :
Download or read book Proceedings of the IEEE 2004 International Interconnect Technology Conference written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 2004-01-01 with total page 253 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Proceedings of the IEEE 2002 International Interconnect Technology Conference by :
Download or read book Proceedings of the IEEE 2002 International Interconnect Technology Conference written by and published by . This book was released on 2002 with total page 294 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Proceedings of the IEEE 2001 International Interconnect Technology Conference by :
Download or read book Proceedings of the IEEE 2001 International Interconnect Technology Conference written by and published by . This book was released on 2001 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Advanced Interconnects for ULSI Technology by : Mikhail Baklanov
Download or read book Advanced Interconnects for ULSI Technology written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2012-02-17 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
Book Synopsis Proceedings of the IEEE 1998 International Interconnect Technology Conference by :
Download or read book Proceedings of the IEEE 1998 International Interconnect Technology Conference written by and published by . This book was released on 2002 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications by : Yosi Shacham-Diamand
Download or read book Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications written by Yosi Shacham-Diamand and published by Springer Science & Business Media. This book was released on 2009-09-19 with total page 545 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.
