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Proceedings Of The Ieee 2007 International Interconnect Technology Conference Burlingame Ca June 4 6 2007
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Book Synopsis Proceedings of the IEEE 2007 International Interconnect Technology Conference by :
Download or read book Proceedings of the IEEE 2007 International Interconnect Technology Conference written by and published by IEEE Computer Society Press. This book was released on 2007-01-01 with total page 215 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Proceedings of the IEEE 2007 International Interconnect Technology Conference : Burlingame, CA, June 4-6, 2007 by : International Interconnect Technology Conference
Download or read book Proceedings of the IEEE 2007 International Interconnect Technology Conference : Burlingame, CA, June 4-6, 2007 written by International Interconnect Technology Conference and published by . This book was released on 2007 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Proceedings of the IEEE 2007 International Interconnect Technology Conference by :
Download or read book Proceedings of the IEEE 2007 International Interconnect Technology Conference written by and published by . This book was released on 2007 with total page 215 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Micro- and Nanoelectronics by : Tomasz Brozek
Download or read book Micro- and Nanoelectronics written by Tomasz Brozek and published by CRC Press. This book was released on 2017-12-19 with total page 388 pages. Available in PDF, EPUB and Kindle. Book excerpt: Micro- and Nanoelectronics: Emerging Device Challenges and Solutions presents a comprehensive overview of the current state of the art of micro- and nanoelectronics, covering the field from fundamental science and material properties to novel ways of making nanodevices. Containing contributions from experts in both industry and academia, this cutting-edge text: Discusses emerging silicon devices for CMOS technologies, fully depleted device architectures, characteristics, and scaling Explains the specifics of silicon compound devices (SiGe, SiC) and their unique properties Explores various options for post-CMOS nanoelectronics, such as spintronic devices and nanoionic switches Describes the latest developments in carbon nanotubes, iii-v devices structures, and more Micro- and Nanoelectronics: Emerging Device Challenges and Solutions provides an excellent representation of a complex engineering field, examining emerging materials and device architecture alternatives with the potential to shape the future of nanotechnology.
Book Synopsis Proceedings of the IEEE International Interconnect Technology Conference by :
Download or read book Proceedings of the IEEE International Interconnect Technology Conference written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 2006-01-01 with total page 232 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Fan-Out Wafer-Level Packaging by : John H. Lau
Download or read book Fan-Out Wafer-Level Packaging written by John H. Lau and published by Springer. This book was released on 2018-04-05 with total page 319 pages. Available in PDF, EPUB and Kindle. Book excerpt: This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP – such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. – are not well understood. Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.
Book Synopsis Springer Handbook of Semiconductor Devices by : Massimo Rudan
Download or read book Springer Handbook of Semiconductor Devices written by Massimo Rudan and published by Springer Nature. This book was released on 2022-11-10 with total page 1680 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Springer Handbook comprehensively covers the topic of semiconductor devices, embracing all aspects from theoretical background to fabrication, modeling, and applications. Nearly 100 leading scientists from industry and academia were selected to write the handbook's chapters, which were conceived for professionals and practitioners, material scientists, physicists and electrical engineers working at universities, industrial R&D, and manufacturers. Starting from the description of the relevant technological aspects and fabrication steps, the handbook proceeds with a section fully devoted to the main conventional semiconductor devices like, e.g., bipolar transistors and MOS capacitors and transistors, used in the production of the standard integrated circuits, and the corresponding physical models. In the subsequent chapters, the scaling issues of the semiconductor-device technology are addressed, followed by the description of novel concept-based semiconductor devices. The last section illustrates the numerical simulation methods ranging from the fabrication processes to the device performances. Each chapter is self-contained, and refers to related topics treated in other chapters when necessary, so that the reader interested in a specific subject can easily identify a personal reading path through the vast contents of the handbook.
Book Synopsis Semiconductor Wafer Bonding 10: Science, Technology, and Applications by :
Download or read book Semiconductor Wafer Bonding 10: Science, Technology, and Applications written by and published by The Electrochemical Society. This book was released on 2008-10 with total page 588 pages. Available in PDF, EPUB and Kindle. Book excerpt: This issue of ECS Transactions on Semiconductor Wafer Bonding will cover the state-of-the-art R&D results of the last 2 years in the field of semiconductor wafer bonding technology. Wafer Bonding is an Enabling Technology that can be used to create novel composite materials systems and devices that would otherwise be unattainable. Wafer Bonding today is rapidly expanding into new applications in such diverse fields as photonics, sensors, MEMS. X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI) and Nanotechnologies.
Book Synopsis Proceedings of the IEEE 2003 International Interconnect Technology Conference : Hyatt Regency Hotel, Burlingame, CA, June 2-4, 2003 by : IEEE International Interconnect Technology Conference
Download or read book Proceedings of the IEEE 2003 International Interconnect Technology Conference : Hyatt Regency Hotel, Burlingame, CA, June 2-4, 2003 written by IEEE International Interconnect Technology Conference and published by . This book was released on 2003 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Proceedings of the IEEE 2001 International Interconnect Technology Conference by :
Download or read book Proceedings of the IEEE 2001 International Interconnect Technology Conference written by and published by . This book was released on 2001 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Proceedings of the IEEE 2000 International Interconnect Technology Conference, Hyatt Regency Hotel, San Francisco Airport, Burlingame, California, June 5-7, 2000 by : IEEE Electron Devices Society
Download or read book Proceedings of the IEEE 2000 International Interconnect Technology Conference, Hyatt Regency Hotel, San Francisco Airport, Burlingame, California, June 5-7, 2000 written by IEEE Electron Devices Society and published by IEEE Standards Office. This book was released on 2000 with total page 277 pages. Available in PDF, EPUB and Kindle. Book excerpt: This work constitutes the proceedings of the 2000 International Interconnect Technology Conference (IITC). It should be useful to process engineers, processing equipment engineers, and engineers and scientists in research and development.
Book Synopsis Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Inter-level Dielectrics by : G. Mathad
Download or read book Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Inter-level Dielectrics written by G. Mathad and published by The Electrochemical Society. This book was released on 2009-03 with total page 71 pages. Available in PDF, EPUB and Kindle. Book excerpt: The papers included in this issue of ECS Transactions were originally presented in the symposium ¿Low k Inter-Level Metal Dielectrics and New Contact and Barrier Metallurgies/Structures¿, held during the PRiME 2008 joint international meeting of The Electrochemical Society and The Electrochemical Society of Japan, with the technical cosponsorship of the Japan Society of Applied Physics, the Korean Electrochemical Society, the Electrochemistry Division of the Royal Australian Chemical Institute, and the Chinese Society of Electrochemistry. This meeting was held in Honolulu, Hawaii, from October 12 to 17, 2008.
Book Synopsis Proceedings of the IEEE 2005 International Interconnect Technology Conference Hyatt Regency Hotel, Burlingame, CA, June 6-8, 2005 by : International Interconnect Technology Conference
Download or read book Proceedings of the IEEE 2005 International Interconnect Technology Conference Hyatt Regency Hotel, Burlingame, CA, June 6-8, 2005 written by International Interconnect Technology Conference and published by . This book was released on 2004 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Interconnect Technology Conference, 2004. Proceedings of the IEEE 2004 International by :
Download or read book Interconnect Technology Conference, 2004. Proceedings of the IEEE 2004 International written by and published by . This book was released on 2004 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Physical Design for 3D Integrated Circuits by : Aida Todri-Sanial
Download or read book Physical Design for 3D Integrated Circuits written by Aida Todri-Sanial and published by CRC Press. This book was released on 2017-12-19 with total page 409 pages. Available in PDF, EPUB and Kindle. Book excerpt: Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Book Synopsis Proceedings of 3rd International Conference on the Industry 4.0 Model for Advanced Manufacturing by : Jun Ni
Download or read book Proceedings of 3rd International Conference on the Industry 4.0 Model for Advanced Manufacturing written by Jun Ni and published by Springer. This book was released on 2018-05-08 with total page 321 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the proceedings of the 3rd International Conference on the Industry 4.0 Model for Advanced Manufacturing (AMP 2018), held in Belgrade, Serbia, on 5–7 June 2018, the latest in a series of high-level conferences that brings together experts from academia and industry to exchange knowledge, ideas, experiences, research findings, and information in the field of manufacturing. The book addresses a wide range of topics, including, for example, design of smart and intelligent products, developments in CAD/CAM technologies, rapid prototyping and reverse engineering, multistage manufacturing processes, manufacturing automation in the Industry 4.0 model, cloud-based products, and cyber-physical and reconfigurable manufacturing systems. By providing updates on key issues and recent advances in manufacturing engineering and technologies, it aids the transfer of vital knowledge to the next generation of academics and practitioners. It appeals to anyone working or conducting research in this rapidly evolving field.
Book Synopsis Proceedings of the IEEE 2002 International Interconnect Technology Conference by :
Download or read book Proceedings of the IEEE 2002 International Interconnect Technology Conference written by and published by . This book was released on 2002 with total page 294 pages. Available in PDF, EPUB and Kindle. Book excerpt:
