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Book Synopsis Physical Design for 3D Integrated Circuits by : Aida Todri-Sanial
Download or read book Physical Design for 3D Integrated Circuits written by Aida Todri-Sanial and published by CRC Press. This book was released on 2017-12-19 with total page 409 pages. Available in PDF, EPUB and Kindle. Book excerpt: Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Download or read book 3D Printing in Space written by Yun Li and published by Springer Nature. This book was released on with total page 163 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Advances In 3d Integrated Circuits And Systems by : Hao Yu
Download or read book Advances In 3d Integrated Circuits And Systems written by Hao Yu and published by World Scientific. This book was released on 2015-08-28 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt: 3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.
Book Synopsis Textbook of Perinatal Medicine by : Asim Kurjak
Download or read book Textbook of Perinatal Medicine written by Asim Kurjak and published by CRC Press. This book was released on 2006-09-25 with total page 2272 pages. Available in PDF, EPUB and Kindle. Book excerpt: Pregnancy, childbirth and being a newborn are not diseases - they are special periods in human life when the risk of death or disability can be very high. Recognizing this, the last decade has brought enormous progress in science and technology into improving maternal and newborn health, such as the treatment of genetic diseases, intra-uterine surg
Book Synopsis 3D Interconnect Architectures for Heterogeneous Technologies by : Lennart Bamberg
Download or read book 3D Interconnect Architectures for Heterogeneous Technologies written by Lennart Bamberg and published by Springer Nature. This book was released on 2022-06-27 with total page 403 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow’s 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs.
Download or read book Data Science written by Chengzhong Xu and published by Springer Nature. This book was released on with total page 346 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis 3D Image Processing by : D. Caramella
Download or read book 3D Image Processing written by D. Caramella and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 329 pages. Available in PDF, EPUB and Kindle. Book excerpt: Few fields have witnessed such impressive advances as the application of computer technology to radiology. The progress achieved has revolutionized diagnosis and greatly facilitated treatment selection and accurate planning of procedures. This book, written by leading experts from many different countries, provides a comprehensive and up-to-date overview of the role of 3D image processing. The first section covers a wide range of technical aspects in an informative way. This is followed by the main section, in which the principal clinical applications are described and discussed in depth. To complete the picture, the final section focuses on recent developments in functional imaging and computer-aided surgery. This book will prove invaluable to all who have an interest in this complex but vitally important field.
Book Synopsis 3D Integration in VLSI Circuits by : Katsuyuki Sakuma
Download or read book 3D Integration in VLSI Circuits written by Katsuyuki Sakuma and published by CRC Press. This book was released on 2018-04-17 with total page 211 pages. Available in PDF, EPUB and Kindle. Book excerpt: Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.
Book Synopsis The Gas Works Directory and Statistics ... by :
Download or read book The Gas Works Directory and Statistics ... written by and published by . This book was released on 1899 with total page 476 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Elements of Arithmetic by : Horace Mann
Download or read book Elements of Arithmetic written by Horace Mann and published by . This book was released on 1855 with total page 268 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Annual Report by : Sydney. Town Clerk
Download or read book Annual Report written by Sydney. Town Clerk and published by . This book was released on 1903 with total page 1044 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology by : Luciano Lavagno
Download or read book Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology written by Luciano Lavagno and published by CRC Press. This book was released on 2017-02-03 with total page 893 pages. Available in PDF, EPUB and Kindle. Book excerpt: The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to transfer data of semiconductor physical layout) design flow, analog/mixed signal design, physical verification, and technology computer-aided design (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability (DFM) at the nanoscale, power supply network design and analysis, design modeling, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on 3D circuit integration and clock design Offering improved depth and modernity, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.
Book Synopsis Handbook Of Solid State Batteries (Second Edition) by : Nancy J Dudney
Download or read book Handbook Of Solid State Batteries (Second Edition) written by Nancy J Dudney and published by World Scientific. This book was released on 2015-07-09 with total page 835 pages. Available in PDF, EPUB and Kindle. Book excerpt: Solid-state batteries hold the promise of providing energy storage with high volumetric and gravimetric energy densities at high power densities, yet with far less safety issues relative to those associated with conventional liquid or gel-based lithium-ion batteries. Solid-state batteries are envisioned to be useful for a broad spectrum of energy storage applications, including powering automobiles and portable electronic devices, as well as stationary storage and load-leveling of renewably generated energy. This comprehensive handbook covers a wide range of topics related to solid-state batteries, including advanced enabling characterization techniques, fundamentals of solid-state systems, novel solid electrolyte systems, interfaces, cell-level studies, and three-dimensional architectures. It is directed at physicists, chemists, materials scientists, electrochemists, electrical engineers, battery technologists, and evaluators of present and future generations of power sources. This handbook serves as a reference text providing state-of-the-art reviews on solid-state battery technologies, as well as providing insights into likely future developments in the field. It is extensively annotated with comprehensive references useful to the student and practitioners in the field.
Book Synopsis Universal Access in Human-Computer Interaction: User and Context Diversity by : Constantine Stephanidis
Download or read book Universal Access in Human-Computer Interaction: User and Context Diversity written by Constantine Stephanidis and published by Springer. This book was released on 2013-07-03 with total page 751 pages. Available in PDF, EPUB and Kindle. Book excerpt: The three-volume set LNCS 8009-8011 constitutes the refereed proceedings of the 7th International Conference on Universal Access in Human-Computer Interaction, UAHCI 2013, held as part of the 15th International Conference on Human-Computer Interaction, HCII 2013, held in Las Vegas, USA in July 2013, jointly with 12 other thematically similar conferences. The total of 1666 papers and 303 posters presented at the HCII 2013 conferences was carefully reviewed and selected from 5210 submissions. These papers address the latest research and development efforts and highlight the human aspects of design and use of computing systems. The papers accepted for presentation thoroughly cover the entire field of human-computer interaction, addressing major advances in knowledge and effective use of computers in a variety of application areas. The total of 230 contributions included in the UAHCI proceedings were carefully reviewed and selected for inclusion in this three-volume set. The 78 papers included in this volume are organized in the following topical sections: age-related issues, human vision in universal access, emotions and persuasion in universal access, design for autistic spectrum disorders, cognitive issues for universal access, universal access to the Web and social communities.
Book Synopsis Handbook of 3D Integration, Volume 4 by : Paul D. Franzon
Download or read book Handbook of 3D Integration, Volume 4 written by Paul D. Franzon and published by John Wiley & Sons. This book was released on 2019-05-06 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt: This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
Book Synopsis 3D Microelectronic Packaging by : Yan Li
Download or read book 3D Microelectronic Packaging written by Yan Li and published by Springer Nature. This book was released on 2020-11-23 with total page 629 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
Book Synopsis Ambient Intelligence: Impact on Embedded System Design by : Twan Basten
Download or read book Ambient Intelligence: Impact on Embedded System Design written by Twan Basten and published by Springer Science & Business Media. This book was released on 2003-11-30 with total page 360 pages. Available in PDF, EPUB and Kindle. Book excerpt: Hugo de Man Professor Katholieke Universiteit Leuven Senior Research Fellow IMEC The steady evolution of hardware, software and communications technology is rapidly transforming the PC- and dot.com world into the world of Ambient Intelligence (AmI). This next wave of information technology is fundam- tally different in that it makes distributed wired and wireless computing and communication disappear to the background and puts users to the foreground. AmI adapts to people instead of the other way around. It will augment our consciousness, monitor our health and security, guide us through traffic etc. In short, its ultimate goal is to improve the quality of our life by a quiet, reliable and secure interaction with our social and material environment. What makes AmI engineering so fascinating is that its design starts from studying person to world interactions that need to be implemented as an int- ligent and autonomous interplay of virtually all necessary networked electronic intelligence on the globe. This is a new and exciting dimension for most elect- cal and software engineers and may attract more creative talent to engineering than pure technology does. Development of the leading technology for AmI will only succeed if the engineering research community is prepared to join forces in order to make Mark Weiser’s dream of 1991 come true. This will not be business as usual by just doubling transistor count or clock speed in a microprocessor or increasing the bandwidth of communication.
