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Author : Gregory J. Balet
Publisher :
ISBN 13 :
Total Pages : 76 pages
Book Rating : 4.E/5 ( download)
Download or read book Packaging of MEMS Based Accelerometers written by Gregory J. Balet and published by . This book was released on 2000 with total page 76 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Mahmoud Rasras
Publisher : MDPI
ISBN 13 : 3038974145
Total Pages : 252 pages
Book Rating : 4.0/5 (389 download)
Download or read book MEMS Accelerometers written by Mahmoud Rasras and published by MDPI. This book was released on 2019-05-27 with total page 252 pages. Available in PDF, EPUB and Kindle. Book excerpt: Micro-electro-mechanical system (MEMS) devices are widely used for inertia, pressure, and ultrasound sensing applications. Research on integrated MEMS technology has undergone extensive development driven by the requirements of a compact footprint, low cost, and increased functionality. Accelerometers are among the most widely used sensors implemented in MEMS technology. MEMS accelerometers are showing a growing presence in almost all industries ranging from automotive to medical. A traditional MEMS accelerometer employs a proof mass suspended to springs, which displaces in response to an external acceleration. A single proof mass can be used for one- or multi-axis sensing. A variety of transduction mechanisms have been used to detect the displacement. They include capacitive, piezoelectric, thermal, tunneling, and optical mechanisms. Capacitive accelerometers are widely used due to their DC measurement interface, thermal stability, reliability, and low cost. However, they are sensitive to electromagnetic field interferences and have poor performance for high-end applications (e.g., precise attitude control for the satellite). Over the past three decades, steady progress has been made in the area of optical accelerometers for high-performance and high-sensitivity applications but several challenges are still to be tackled by researchers and engineers to fully realize opto-mechanical accelerometers, such as chip-scale integration, scaling, low bandwidth, etc. This Special Issue on "MEMS Accelerometers" seeks to highlight research papers, short communications, and review articles that focus on: Novel designs, fabrication platforms, characterization, optimization, and modeling of MEMS accelerometers. Alternative transduction techniques with special emphasis on opto-mechanical sensing. Novel applications employing MEMS accelerometers for consumer electronics, industries, medicine, entertainment, navigation, etc. Multi-physics design tools and methodologies, including MEMS-electronics co-design. Novel accelerometer technologies and 9DoF IMU integration. Multi-accelerometer platforms and their data fusion.
Author : Lee Yung-cheng
Publisher : World Scientific
ISBN 13 : 9813229373
Total Pages : 364 pages
Book Rating : 4.8/5 (132 download)
Download or read book Mems Packaging written by Lee Yung-cheng and published by World Scientific. This book was released on 2018-01-03 with total page 364 pages. Available in PDF, EPUB and Kindle. Book excerpt: MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices. This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability. Contents: Introduction to MEMS Packaging (Y C Lee, Ramesh Ramadoss and Nils Hoivik)Silex's TSV Technology: Overview of Processes and MEMS Applications (Tomas Bauer and Thorbjörn Ebefors)Vertical Interconnects for High-end MEMS (Maaike M Visser Taklo and Sigurd Moe)Using Wafer-Level Packaging to Improve Sensor Manufacturability and Cost (Paul Pickering, Collin Twanow and Dean Spicer)Nasiri Fabrication Process for Low-Cost Motion Sensors in the Consumer Market (Steven Nasiri, Ramesh Ramadoss and Sandra Winkler)PCB Based MEMS and Microfluidics (Ramesh Ramadoss, Antonio Luque and Carmen Aracil)Single Wafer Encapsulation of MEMS Resonators (Janna Rodriguez and Thomas Kenny)Heterogeneous Integration and Wafer-Level Packaging of MEMS (Masayoshi Esashi and Shuji Tanaka)Packaging of Membrane-Based Polymer Microfluidic Systems (Yu-Chuan Su)Wafer-Level Solder Bonding by Using Localized Induction Heating (Hsueh-An Yang, Chiung-Wen Lin and Weileun Fang)Localized Sealing Schemes for MEMS Packaging (Y T Cheng, Y C Su and Liwei Lin)Microsprings for High-Density Flip-Chip Packaging (Eugene M Chow and Christopher L Chua)MEMS Reliability (Chien-Ming Huang, Arvind Sai SarathiVasan, Yunhan Huang, Ravi Doraiswami, Michael Osterman and Michael Pecht) Readership: Researchers and graduate students participating in research, R&D, and manufacturing of MEMS products; professionals associated with the integration for systems represented by smartphones, AR/VR, and wearable electronics. Keywords: MEMS;Packaging;Microelectromechanical Systems;Reliability;Microstructures;Sensors;ActuatorsReview: Key Features: The book covers engineering topics critical to product development as well as research topics critical to integration for future MEMS-enabled systemsIt is a major resource for those participating in MEMS and for every professional associated with the integration for systems represented by smartphones, AR/VR and wearable electronics
Author : Markku Tilli
Publisher : Elsevier
ISBN 13 : 012817787X
Total Pages : 1028 pages
Book Rating : 4.1/5 (281 download)
Download or read book Handbook of Silicon Based MEMS Materials and Technologies written by Markku Tilli and published by Elsevier. This book was released on 2020-04-17 with total page 1028 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Silicon Based MEMS Materials and Technologies, Third Edition is a comprehensive guide to MEMS materials, technologies, and manufacturing with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, modeling, manufacturing, processing, system integration, measurement, and materials characterization techniques of MEMS structures. The third edition of this book provides an important up-to-date overview of the current and emerging technologies in MEMS making it a key reference for MEMS professionals, engineers, and researchers alike, and at the same time an essential education material for undergraduate and graduate students. Provides comprehensive overview of leading-edge MEMS manufacturing technologies through the supply chain from silicon ingot growth to device fabrication and integration with sensor/actuator controlling circuits Explains the properties, manufacturing, processing, measuring and modeling methods of MEMS structures Reviews the current and future options for hermetic encapsulation and introduces how to utilize wafer level packaging and 3D integration technologies for package cost reduction and performance improvements Geared towards practical applications presenting several modern MEMS devices including inertial sensors, microphones, pressure sensors and micromirrors
Author : Vikas Choudhary
Publisher : CRC Press
ISBN 13 : 135183228X
Total Pages : 481 pages
Book Rating : 4.3/5 (518 download)
Download or read book MEMS written by Vikas Choudhary and published by CRC Press. This book was released on 2017-12-19 with total page 481 pages. Available in PDF, EPUB and Kindle. Book excerpt: The microelectromechanical systems (MEMS) industry has experienced explosive growth over the last decade. Applications range from accelerometers and gyroscopes used in automotive safety to high-precision on-chip integrated oscillators for reference generation and mobile phones. MEMS: Fundamental Technology and Applications brings together groundbreaking research in MEMS technology and explores an eclectic set of novel applications enabled by the technology. The book features contributions by top experts from industry and academia from around the world. The contributors explain the theoretical background and supply practical insights on applying the technology. From the historical evolution of nano micro systems to recent trends, they delve into topics including: Thin-film integrated passives as an alternative to discrete passives The possibility of piezoelectric MEMS Solutions for MEMS gyroscopes Advanced interconnect technologies Ambient energy harvesting Bulk acoustic wave resonators Ultrasonic receiver arrays using MEMS sensors Optical MEMS-based spectrometers The integration of MEMS resonators with conventional circuitry A wearable inertial and magnetic MEMS sensor assembly to estimate rigid body movement patterns Wireless microactuators to enable implantable MEMS devices for drug delivery MEMS technologies for tactile sensing and actuation in robotics MEMS-based micro hot-plate devices Inertial measurement units with integrated wireless circuitry to enable convenient, continuous monitoring Sensors using passive acousto-electric devices in wired and wireless systems Throughout, the contributors identify challenges and pose questions that need to be resolved, paving the way for new applications. Offering a wide view of the MEMS landscape, this is an invaluable resource for anyone working to develop and commercialize MEMS applications.
Author : Jerome P. Lynch
Publisher : Woodhead Publishing
ISBN 13 : 0081026978
Total Pages : 678 pages
Book Rating : 4.0/5 (81 download)
Download or read book Sensor Technologies for Civil Infrastructures written by Jerome P. Lynch and published by Woodhead Publishing. This book was released on 2022-07-19 with total page 678 pages. Available in PDF, EPUB and Kindle. Book excerpt: Sensor Technologies for Civil Infrastructure, Volume 1: Sensing Hardware and Data Collection Methods for Performance Assessment, Second Edition, provides an overview of sensor hardware and its use in data collection. The first chapters provide an introduction to sensing for structural performance assessment and health monitoring, and an overview of commonly used sensors and their data acquisition systems. Further chapters address different types of sensor including piezoelectric transducers, fiber optic sensors, acoustic emission sensors, and electromagnetic sensors, and the use of these sensors for assessing and monitoring civil infrastructures. The new edition now includes chapters on machine learning methods and reliability analysis for structural health monitoring. All chapters have been revised to include the latest advances in materials (such as piezoelectric and mechanoluminescent materials), technologies (such as LIDAR), and applications. Describes sensing hardware and data collection, covering a variety of sensors including LIDAR Examines fiber optic systems, acoustic emission, piezoelectric sensors, electromagnetic sensors, terahertz technologies, ultrasonic methods, and radar and millimeter wave technology Covers strain gauges, micro-electro-mechanical systems (MEMS), multifunctional materials and nanotechnology for sensing, and vision-based sensing and lasers Includes new chapters on machine learning methods and reliability analysis
Author : Committee on Advanced Materials and Fabrication Methods for Microelectromechanical Systems
Publisher : National Academies Press
ISBN 13 : 0309591511
Total Pages : 76 pages
Book Rating : 4.3/5 (95 download)
Download or read book Microelectromechanical Systems written by Committee on Advanced Materials and Fabrication Methods for Microelectromechanical Systems and published by National Academies Press. This book was released on 1997-12-15 with total page 76 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectromenchanical systems (MEMS) is a revolutionary field that adapts for new uses a technology already optimized to accomplish a specific set of objectives. The silicon-based integrated circuits process is so highly refined it can produce millions of electrical elements on a single chip and define their critical dimensions to tolerances of 100-billionths of a meter. The MEMS revolution harnesses the integrated circuitry know-how to build working microsystems from micromechanical and microelectronic elements. MEMS is a multidisciplinary field involving challenges and opportunites for electrical, mechanical, chemical, and biomedical engineering as well as physics, biology, and chemistry. As MEMS begin to permeate more and more industrial procedures, society as a whole will be strongly affected because MEMS provide a new design technology that could rival--perhaps surpass--the societal impact of integrated circuits.
Author : Volker Kempe
Publisher : Cambridge University Press
ISBN 13 : 1139494821
Total Pages : 497 pages
Book Rating : 4.1/5 (394 download)
Download or read book Inertial MEMS written by Volker Kempe and published by Cambridge University Press. This book was released on 2011-02-17 with total page 497 pages. Available in PDF, EPUB and Kindle. Book excerpt: A practical and systematic overview of the design, fabrication and test of MEMS-based inertial sensors, this comprehensive and rigorous guide shows you how to analyze and transform application requirements into practical designs, and helps you to avoid potential pitfalls and to cut design time. With this book you'll soon be up to speed on the relevant basics, including MEMS technologies, packaging, kinematics and mechanics, and transducers. You'll also get a thorough evaluation of different approaches and architectures for design and an overview of key aspects of testing and calibration. Unique insights into the practical difficulties of making sensors for real-world applications make this up-to-date description of the state of the art in inertial MEMS an ideal resource for professional engineers in industry as well as students looking for a complete introduction to the area.
Author : Shen Liu
Publisher : John Wiley & Sons
ISBN 13 : 0470828412
Total Pages : 586 pages
Book Rating : 4.4/5 (78 download)
Download or read book Modeling and Simulation for Microelectronic Packaging Assembly written by Shen Liu and published by John Wiley & Sons. This book was released on 2011-08-24 with total page 586 pages. Available in PDF, EPUB and Kindle. Book excerpt: Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging
Author : Jiri Marek
Publisher : John Wiley & Sons
ISBN 13 : 352760507X
Total Pages : 584 pages
Book Rating : 4.5/5 (276 download)
Download or read book Sensors for Automotive Applications written by Jiri Marek and published by John Wiley & Sons. This book was released on 2006-03-06 with total page 584 pages. Available in PDF, EPUB and Kindle. Book excerpt: Taken as a whole, this series covers all major fields of application for commercial sensors, as well as their manufacturing techniques and major types. As such the series does not treat bulk sensors, but rather places strong emphasis on microsensors, microsystems and integrated electronic sensor packages. Each of the individual volumes is tailored to the needs and queries of readers from the relevant branch of industry. An international team of experts from the leading companies in this field gives a detailed picture of existing as well as future applications. They discuss in detail current technologies, design and construction concepts, market considerations and commercial developments. Topics covered include vehicle safety, fuel consumption, air conditioning, emergency control, traffic control systems, and electronic guidance using radar and video.
Author : John H. Lau
Publisher : McGraw Hill Professional
ISBN 13 : 0071627928
Total Pages : 577 pages
Book Rating : 4.0/5 (716 download)
Download or read book Advanced MEMS Packaging written by John H. Lau and published by McGraw Hill Professional. This book was released on 2009-10-22 with total page 577 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to 3D MEMS packaging methods and solutions Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenges created by the ever-increasing interest in MEMS devices and packaging. This authoritative guide presents cutting-edge MEMS (microelectromechanical systems) packaging techniques, such as low-temperature C2W and W2W bonding and 3D packaging. This definitive resource helps you select reliable, creative, high-performance, robust, and cost-effective packaging techniques for MEMS devices. The book will also aid in stimulating further research and development in electrical, optical, mechanical, and thermal designs as well as materials, processes, manufacturing, testing, and reliability. Among the topics explored: Advanced IC and MEMS packaging trends MEMS devices, commercial applications, and markets More than 360 MEMS packaging patents and 10 3D MEMS packaging designs TSV for 3D MEMS packaging MEMS wafer thinning, dicing, and handling Low-temperature C2C, C2W, and W2W bonding Reliability of RoHS-compliant MEMS packaging Micromachining and water bonding techniques Actuation mechanisms and integrated micromachining Bubble switch, optical switch, and VOA MEMS packaging Bolometer and accelerameter MEMS packaging Bio-MEMS and biosensor MEMS packaging RF MEMS switches, tunable circuits, and packaging
Author : Seonho Seok
Publisher : Springer
ISBN 13 : 3319778722
Total Pages : 115 pages
Book Rating : 4.3/5 (197 download)
Download or read book Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering written by Seonho Seok and published by Springer. This book was released on 2018-04-27 with total page 115 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films – a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure. Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load–displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.
Author : Suzanne Costello
Publisher : Artech House
ISBN 13 : 1608075273
Total Pages : 197 pages
Book Rating : 4.6/5 (8 download)
Download or read book Hermeticity Testing of MEMS and Microelectronic Packages written by Suzanne Costello and published by Artech House. This book was released on 2013-10-01 with total page 197 pages. Available in PDF, EPUB and Kindle. Book excerpt: Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mechanical System (MEMS) whereby interactions with the external environment are, in some cases, required. This resource is a rapid, definitive reference on hermetic packaging for the MEMS and microelectronics industry, giving practical guidance on traditional and newly developed test methods. This book includes up-to-date and applicable test methods for today’s package types. The authors cover the history and development of packaging, along with a view to understanding initial hermeticity testing requirements and the subsequent limitations of these methods when applied to new package types.
Author : Gerald Gerlach
Publisher : Springer Science & Business Media
ISBN 13 : 3642285228
Total Pages : 619 pages
Book Rating : 4.6/5 (422 download)
Download or read book Bio and Nano Packaging Techniques for Electron Devices written by Gerald Gerlach and published by Springer Science & Business Media. This book was released on 2012-07-16 with total page 619 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses future trends and developments in electron device packaging and the opportunities of nano and bio techniques as future solutions. It describes the effect of nano-sized particles and cell-based approaches for packaging solutions with their diverse requirements. It offers a comprehensive overview of nano particles and nano composites and their application as packaging functions in electron devices. The importance and challenges of three-dimensional design and computer modeling in nano packaging is discussed; also ways for implementation are described. Solutions for unconventional packaging solutions for metallizations and functionalized surfaces as well as new packaging technologies with high potential for industrial applications are discussed. The book brings together a comprehensive overview of nano scale components and systems comprising electronic, mechanical and optical structures and serves as important reference for industrial and academic researchers.
Author : D. Yogi Goswami
Publisher : CRC Press
ISBN 13 : 1420041584
Total Pages : 2690 pages
Book Rating : 4.4/5 (2 download)
Download or read book The CRC Handbook of Mechanical Engineering written by D. Yogi Goswami and published by CRC Press. This book was released on 2004-09-29 with total page 2690 pages. Available in PDF, EPUB and Kindle. Book excerpt: The second edition of this standard-setting handbook provides and all-encompassing reference for the practicing engineer in industry, government, and academia, with relevant background and up-to-date information on the most important topics of modern mechanical engineering. These topics include modern manufacturing and design, robotics, computer engineering, environmental engineering, economics, patent law, and communication/information systems. The final chapter and appendix provide information regarding physical properties and mathematical and computational methods. New topics include nanotechnology, MEMS, electronic packaging, global climate change, electric and hybrid vehicles, and bioengineering.
Author : Tan Tran Duc
Publisher : GRIN Verlag
ISBN 13 : 3640249682
Total Pages : 90 pages
Book Rating : 4.6/5 (42 download)
Download or read book Modeling and Simulation of the Capacitive Accelerometer written by Tan Tran Duc and published by GRIN Verlag. This book was released on 2009 with total page 90 pages. Available in PDF, EPUB and Kindle. Book excerpt: Diploma Thesis from the year 2005 in the subject Electrotechnology, grade: Master 9.8/10, 28 entries in the bibliography, language: English, abstract: Microelectromechanical systems (MEMS) are collection of microsensors and actuators that have the ability to sense its environment and react to changes in that environment with the use of a microcircuit control. They also include the conventional microelectronics packaging, integrating antenna structures for command signals into microelectromechanical structures for desired sensing and actuating functions. The system may also need micropower supply, microrelay, and microsignal processing units. Microcomponents make the system faster, more reliable, cheaper, and capable of incorporating more complex functions. In the beginning of 1990s, MEMS appeared with the aid of the development of integrated circuit fabrication processes, in which sensors, actuators, and control functions are co-fabricated in silicon 1]. Since then, remarkable research progresses have been achieved in MEMS under the strong promotions from both government and industries. In addition to the commercialization of some less integrated MEMS devices, such as microaccelerometers, inkjet printer head, micromirrors for projection, etc., the concepts and feasibility of more complex MEMS devices have been proposed and demonstrated for the applications in such varied fields as microfluidics, aerospace, biomedical, chemical analysis, wireless communications, data storage, display, optics, etc. Some branches of MEMS, appearing as microoptoelectromechanical systems (MOEMS), micro total analysis systems, etc., have attracted a great research since their potential applications' market.
Author : Tai-Ran Hsu
Publisher : IET
ISBN 13 : 9780863413353
Total Pages : 310 pages
Book Rating : 4.4/5 (133 download)
Download or read book MEMS Packaging written by Tai-Ran Hsu and published by IET. This book was released on 2004 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers the entire spectrum of assembly, packaging and testing of MEMs (microelectro-mechanical systems) and microsystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering.
