Integration and Packaging of Optoelectronic Devices

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Publisher :
ISBN 13 :
Total Pages : 196 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Integration and Packaging of Optoelectronic Devices by : Davis H. Hartman

Download or read book Integration and Packaging of Optoelectronic Devices written by Davis H. Hartman and published by . This book was released on 1987 with total page 196 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Optoelectronic Interconnects and Packaging ...

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Publisher :
ISBN 13 :
Total Pages : 382 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Optoelectronic Interconnects and Packaging ... by :

Download or read book Optoelectronic Interconnects and Packaging ... written by and published by . This book was released on 1997 with total page 382 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Optoelectronic Interconnects

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Publisher :
ISBN 13 :
Total Pages : 382 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Optoelectronic Interconnects by :

Download or read book Optoelectronic Interconnects written by and published by . This book was released on 1994 with total page 382 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Optoelectronic Interconnects and Packaging IV

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Publisher : SPIE-International Society for Optical Engineering
ISBN 13 :
Total Pages : 378 pages
Book Rating : 4.:/5 (318 download)

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Book Synopsis Optoelectronic Interconnects and Packaging IV by : Ray T. Chen

Download or read book Optoelectronic Interconnects and Packaging IV written by Ray T. Chen and published by SPIE-International Society for Optical Engineering. This book was released on 1997 with total page 378 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

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Publisher : Springer Science & Business Media
ISBN 13 : 0387329897
Total Pages : 1471 pages
Book Rating : 4.3/5 (873 download)

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Book Synopsis Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging by : Ephraim Suhir

Download or read book Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging written by Ephraim Suhir and published by Springer Science & Business Media. This book was released on 2007-05-26 with total page 1471 pages. Available in PDF, EPUB and Kindle. Book excerpt: This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.

Integrated Optoelectronics

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Publisher : The Electrochemical Society
ISBN 13 : 9781566773706
Total Pages : 452 pages
Book Rating : 4.7/5 (737 download)

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Book Synopsis Integrated Optoelectronics by : M. Jamal Deen

Download or read book Integrated Optoelectronics written by M. Jamal Deen and published by The Electrochemical Society. This book was released on 2002 with total page 452 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Optoelectronic Packaging

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Publisher : Wiley-Interscience
ISBN 13 : 9780471111887
Total Pages : 0 pages
Book Rating : 4.1/5 (118 download)

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Book Synopsis Optoelectronic Packaging by : Alan R. Mickelson

Download or read book Optoelectronic Packaging written by Alan R. Mickelson and published by Wiley-Interscience. This book was released on 1997-05-05 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: The missing link in a dynamically growing field--a state-of-the-artreference on optoelectronic packaging The rapidly expanding field of packaging for optoelectronic deviceschallenges electrical engineers with a host of complex and dauntingproblems. The increasing intricacy of assemblage compounds thethorny interconnection issues associated with electronicpackaging-how to assemble an array with many elements efficientlywhile maintaining thermal tolerance and simultaneously overcomingthe ensuing modulation problems that generate electrical noise.Adding to these problems has been the absence, until now, of asingle authoritative reference on the subject. Optoelectronic Packaging is the first and only comprehensivesourcebook on optoelectronic assembly techniques. Foroptoelectronic packaging experts and professionals in adjuncttechnologies, it provides an overview of today's state-of-the-arttechnologies, packages now on the drawing board, and the futuredirection of packaging types. For the novice, it lays down thefundamentals of optics and packaging. This incomparable textfeatures contributions from hands-on practitioners and,supplemented with extensive illustrations, it * Covers detector, semiconductor laser, and optical amplifierpackaging * Discusses waveguide technologies, free-space interconnects, andhybrid technologies * Examines communication system interconnection structure andfiber-optic networks in telecommunications * Explores array device packaging and flip-chip assembly for smartpixel arrays * Includes case studies of packaged subassemblies

Integrated Silicon Optoelectronics

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Publisher : Springer Science & Business Media
ISBN 13 : 3662040182
Total Pages : 338 pages
Book Rating : 4.6/5 (62 download)

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Book Synopsis Integrated Silicon Optoelectronics by : Horst Zimmermann

Download or read book Integrated Silicon Optoelectronics written by Horst Zimmermann and published by Springer Science & Business Media. This book was released on 2013-11-11 with total page 338 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book covers the entire topic from the basics of optoelectronics, device physics of photodetectors and light emitters, simulation of photodetectors, and technological aspects of optoelectronic integration in microelectronics to circuit aspects and practical applications. It summarizes the state of the art in integrated silicon optoelectronics and reviews recent publications on this topic. Results of basic research on silicon light emitters are included as well, while published results are compared with each other and with the work of the author.

Microelectronic Interconnects and Packages

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Publisher :
ISBN 13 :
Total Pages : 694 pages
Book Rating : 4.F/5 ( download)

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Book Synopsis Microelectronic Interconnects and Packages by :

Download or read book Microelectronic Interconnects and Packages written by and published by . This book was released on 1991 with total page 694 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Microelectronics Packaging Handbook

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Publisher : Springer Science & Business Media
ISBN 13 : 9780412084515
Total Pages : 662 pages
Book Rating : 4.0/5 (845 download)

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Book Synopsis Microelectronics Packaging Handbook by : Rao Tummala

Download or read book Microelectronics Packaging Handbook written by Rao Tummala and published by Springer Science & Business Media. This book was released on 1997-01-31 with total page 662 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.

Optoelectronic Interconnects, Integrated Circuits, and Packaging

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Publisher :
ISBN 13 :
Total Pages : 0 pages
Book Rating : 4.:/5 (686 download)

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Book Synopsis Optoelectronic Interconnects, Integrated Circuits, and Packaging by :

Download or read book Optoelectronic Interconnects, Integrated Circuits, and Packaging written by and published by . This book was released on 2002 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Optical Interconnects for Data Centers

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Publisher : Woodhead Publishing
ISBN 13 : 008100513X
Total Pages : 431 pages
Book Rating : 4.0/5 (81 download)

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Book Synopsis Optical Interconnects for Data Centers by : Tolga Tekin

Download or read book Optical Interconnects for Data Centers written by Tolga Tekin and published by Woodhead Publishing. This book was released on 2016-11-01 with total page 431 pages. Available in PDF, EPUB and Kindle. Book excerpt: Current data centre networks, based on electronic packet switches, are experiencing an exponential increase in network traffic due to developments such as cloud computing. Optical interconnects have emerged as a promising alternative offering high throughput and reduced power consumption. Optical Interconnects for Data Centers reviews key developments in the use of optical interconnects in data centres and the current state of the art in transforming this technology into a reality. The book discusses developments in optical materials and components (such as single and multi-mode waveguides), circuit boards and ways the technology can be deployed in data centres. Optical Interconnects for Data Centers is a key reference text for electronics designers, optical engineers, communications engineers and R&D managers working in the communications and electronics industries as well as postgraduate researchers. - Summarizes the state-of-the-art in this emerging field - Presents a comprehensive review of all the key aspects of deploying optical interconnects in data centers, from materials and components, to circuit boards and methods for integration - Contains contributions that are drawn from leading international experts on the topic

Proceedings

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Publisher :
ISBN 13 :
Total Pages : 1220 pages
Book Rating : 4.0/5 ( download)

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Book Synopsis Proceedings by :

Download or read book Proceedings written by and published by . This book was released on 2004 with total page 1220 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Wafer-Level Integrated Systems

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Publisher : Springer Science & Business Media
ISBN 13 : 1461316251
Total Pages : 456 pages
Book Rating : 4.4/5 (613 download)

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Book Synopsis Wafer-Level Integrated Systems by : Stuart K. Tewksbury

Download or read book Wafer-Level Integrated Systems written by Stuart K. Tewksbury and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 456 pages. Available in PDF, EPUB and Kindle. Book excerpt: From the perspective of complex systems, conventional Ie's can be regarded as "discrete" devices interconnected according to system design objectives imposed at the circuit board level and higher levels in the system implementation hierarchy. However, silicon monolithic circuits have progressed to such complex functions that a transition from a philosophy of integrated circuits (Ie's) to one of integrated sys tems is necessary. Wafer-scale integration has played an important role over the past few years in highlighting the system level issues which will most significantly impact the implementation of complex monolithic systems and system components. Rather than being a revolutionary approach, wafer-scale integration will evolve naturally from VLSI as defect avoidance, fault tolerance and testing are introduced into VLSI circuits. Successful introduction of defect avoidance, for example, relaxes limits imposed by yield and cost on Ie dimensions, allowing the monolithic circuit's area to be chosen according to the natural partitioning of a system into individual functions rather than imposing area limits due to defect densities. The term "wafer level" is perhaps more appropriate than "wafer-scale". A "wafer-level" monolithic system component may have dimensions ranging from conventional yield-limited Ie dimensions to full wafer dimensions. In this sense, "wafer-scale" merely represents the obvious upper practical limit imposed by wafer sizes on the area of monolithic circuits. The transition to monolithic, wafer-level integrated systems will require a mapping of the full range of system design issues onto the design of monolithic circuit.

Heterogeneous Integrations

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Publisher : Springer
ISBN 13 : 9811372241
Total Pages : 381 pages
Book Rating : 4.8/5 (113 download)

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Book Synopsis Heterogeneous Integrations by : John H. Lau

Download or read book Heterogeneous Integrations written by John H. Lau and published by Springer. This book was released on 2019-04-03 with total page 381 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.

Wafer Bonding

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Publisher : Springer Science & Business Media
ISBN 13 : 3662108275
Total Pages : 510 pages
Book Rating : 4.6/5 (621 download)

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Book Synopsis Wafer Bonding by : Marin Alexe

Download or read book Wafer Bonding written by Marin Alexe and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 510 pages. Available in PDF, EPUB and Kindle. Book excerpt: The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

Heterogeneous Optoelectronics Integration

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Publisher : SPIE Press
ISBN 13 : 9780819435712
Total Pages : 304 pages
Book Rating : 4.4/5 (357 download)

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Book Synopsis Heterogeneous Optoelectronics Integration by : Elias Towe

Download or read book Heterogeneous Optoelectronics Integration written by Elias Towe and published by SPIE Press. This book was released on 2000 with total page 304 pages. Available in PDF, EPUB and Kindle. Book excerpt: Numerous efforts are directed at investigating the use of optics at short distances--for example, at the chip-to-chip and board-to-board levels of the interconnection hierarchy. This book provides an overview of the state of the art in heterogeneous integration of electronics, optoelectronics, and micro-optics for short-distance optical interconnections.