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Author : Dongkeun Thomas Oh
Publisher :
ISBN 13 :
Total Pages : 94 pages
Book Rating : 4.:/5 (784 download)
Download or read book Numerical Algorithm of Thermal Analysis in 3D IC written by Dongkeun Thomas Oh and published by . This book was released on 2011 with total page 94 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Jianyong Xie
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (88 download)
Download or read book Electrical-thermal Modeling and Simulation for Three-dimensional Integrated Systems written by Jianyong Xie and published by . This book was released on 2013 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The continuous miniaturization of electronic systems using the three-dimensional (3D) integration technique has brought in new challenges for the computer-aided design and modeling of 3D integrated circuits (ICs) and systems. The major challenges for the modeling and analysis of 3D integrated systems mainly stem from four aspects: (a) the interaction between the electrical and thermal domains in an integrated system, (b) the increasing modeling complexity arising from 3D systems requires the development of multiscale techniques for the modeling and analysis of DC voltage drop, thermal gradients, and electromagnetic behaviors, (c) efficient modeling of microfluidic cooling, and (d) the demand of performing fast thermal simulation with varying design parameters. Addressing these challenges for the electrical/thermal modeling and analysis of 3D systems necessitates the development of novel numerical modeling methods. This dissertation mainly focuses on developing efficient electrical and thermal numerical modeling and co-simulation methods for 3D integrated systems. The developed numerical methods can be classified into three categories. The first category aims to investigate the interaction between electrical and thermal characteristics for power delivery networks (PDNs) in steady state and the thermal effect on characteristics of through-silicon via (TSV) arrays at high frequencies. The steady-state electrical-thermal interaction for PDNs is addressed by developing a voltage drop-thermal co-simulation method while the thermal effect on TSV characteristics is studied by proposing a thermal-electrical analysis approach for TSV arrays. The second category of numerical methods focuses on developing multiscale modeling approaches for the voltage drop and thermal analysis. A multiscale modeling method based on the finite-element non-conformal domain decomposition technique has been developed for the voltage drop and thermal analysis of 3D systems. The proposed method allows the modeling of a 3D multiscale system using independent mesh grids in sub-domains. As a result, the system unknowns can be greatly reduced. In addition, to improve the simulation efficiency, the cascadic multigrid solving approach has been adopted for the voltage drop-thermal co-simulation with a large number of unknowns. The focus of the last category is to develop fast thermal simulation methods using compact models and model order reduction (MOR). To overcome the computational cost using the computational fluid dynamics simulation, a finite-volume compact thermal model has been developed for the microchannel-based fluidic cooling. This compact thermal model enables the fast thermal simulation of 3D ICs with a large number of microchannels for early-stage design. In addition, a system-level thermal modeling method using domain decomposition and model order reduction is developed for both the steady-state and transient thermal analysis. The proposed approach can efficiently support thermal modeling with varying design parameters without using parameterized MOR techniques.
Author : Sung Kyu Lim
Publisher : Springer Science & Business Media
ISBN 13 : 1441995420
Total Pages : 573 pages
Book Rating : 4.4/5 (419 download)
Download or read book Design for High Performance, Low Power, and Reliable 3D Integrated Circuits written by Sung Kyu Lim and published by Springer Science & Business Media. This book was released on 2012-11-27 with total page 573 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.
Author : Rohit Sharma
Publisher : CRC Press
ISBN 13 : 1351831593
Total Pages : 328 pages
Book Rating : 4.3/5 (518 download)
Download or read book Design of 3D Integrated Circuits and Systems written by Rohit Sharma and published by CRC Press. This book was released on 2018-09-03 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.
Author : Satish P. Ketkar
Publisher : American Society of Mechanical Engineers
ISBN 13 :
Total Pages : 120 pages
Book Rating : 4.3/5 (91 download)
Download or read book Numerical Thermal Analysis written by Satish P. Ketkar and published by American Society of Mechanical Engineers. This book was released on 1999 with total page 120 pages. Available in PDF, EPUB and Kindle. Book excerpt: This reference for engineers who use computerized thermal analysis tools covers the basics of finite difference, finite element, and control volume methods. The author also presents a hybrid method that combines features of finite element modeling with the computational efficiency of finite difference network solution techniques. Annotation copyrighted by Book News, Inc., Portland, OR
Author : Paul D. Franzon
Publisher : John Wiley & Sons
ISBN 13 : 3527697063
Total Pages : 582 pages
Book Rating : 4.5/5 (276 download)
Download or read book Handbook of 3D Integration, Volume 4 written by Paul D. Franzon and published by John Wiley & Sons. This book was released on 2019-01-25 with total page 582 pages. Available in PDF, EPUB and Kindle. Book excerpt: This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
Author : Madhavan Swaminathan
Publisher : World Scientific
ISBN 13 : 9814508608
Total Pages : 379 pages
Book Rating : 4.8/5 (145 download)
Download or read book Design and Modeling for 3D ICs and Interposers written by Madhavan Swaminathan and published by World Scientific. This book was released on 2013-11-05 with total page 379 pages. Available in PDF, EPUB and Kindle. Book excerpt: 3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.
Author : Aida Todri-Sanial
Publisher : CRC Press
ISBN 13 : 1498710379
Total Pages : 397 pages
Book Rating : 4.4/5 (987 download)
Download or read book Physical Design for 3D Integrated Circuits written by Aida Todri-Sanial and published by CRC Press. This book was released on 2017-12-19 with total page 397 pages. Available in PDF, EPUB and Kindle. Book excerpt: Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Author : Brajesh Kumar Kaushik
Publisher : Springer
ISBN 13 : 9811074704
Total Pages : 820 pages
Book Rating : 4.8/5 (11 download)
Download or read book VLSI Design and Test written by Brajesh Kumar Kaushik and published by Springer. This book was released on 2017-12-21 with total page 820 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the refereed proceedings of the 21st International Symposium on VLSI Design and Test, VDAT 2017, held in Roorkee, India, in June/July 2017. The 48 full papers presented together with 27 short papers were carefully reviewed and selected from 246 submissions. The papers were organized in topical sections named: digital design; analog/mixed signal; VLSI testing; devices and technology; VLSI architectures; emerging technologies and memory; system design; low power design and test; RF circuits; architecture and CAD; and design verification.
Author :
Publisher :
ISBN 13 :
Total Pages : 368 pages
Book Rating : 4.3/5 (91 download)
Download or read book International Conference on Simulation of Semiconductor Processes and Devices written by and published by . This book was released on 2005 with total page 368 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Yuan Xie
Publisher : Springer Science & Business Media
ISBN 13 : 144190784X
Total Pages : 292 pages
Book Rating : 4.4/5 (419 download)
Download or read book Three-Dimensional Integrated Circuit Design written by Yuan Xie and published by Springer Science & Business Media. This book was released on 2009-12-02 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt: We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore’s law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef?ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).
Author : Philip Garrou
Publisher : John Wiley & Sons
ISBN 13 : 352762306X
Total Pages : 798 pages
Book Rating : 4.5/5 (276 download)
Download or read book Handbook of 3D Integration, Volume 1 written by Philip Garrou and published by John Wiley & Sons. This book was released on 2011-09-22 with total page 798 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.
Author : W. Minkowycz
Publisher : Routledge
ISBN 13 : 1351468251
Total Pages : 245 pages
Book Rating : 4.3/5 (514 download)
Download or read book Advances in Numerical Heat Transfer, Volume 2 written by W. Minkowycz and published by Routledge. This book was released on 2018-12-13 with total page 245 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume discusses the advances in numerical heat transfer modeling by applying high-performance computing resources, striking a balance between generic fundamentals, specific fundamentals, generic applications, and specific applications.
Author : Zheng Xu (Of Shanghai da xue)
Publisher : Springer Nature
ISBN 13 : 3031318609
Total Pages : 591 pages
Book Rating : 4.0/5 (313 download)
Download or read book Cyber Security Intelligence and Analytics written by Zheng Xu (Of Shanghai da xue) and published by Springer Nature. This book was released on 2023 with total page 591 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides the proceedings of the 5th International Conference on Cyber Security Intelligence and Analytics. The 5th International Conference on Cyber Security Intelligence and Analytics (CSIA 2023) is an international conference dedicated to promoting novel theoretical and applied research advances in the interdisciplinary agenda of cyber security, particularly focusing on threat intelligence and analytics and countering cybercrime. Cyber security experts, including those in data analytics, incident response and digital forensics, need to be able to rapidly detect, analyze and defend against a diverse range of cyber threats in near real-time conditions. We are organizing the CSIA 2023 at Radisson Blu Shanghai Pudong Jinqiao Hotel. It will feature a technical program of refereed papers selected by the international program committee, keynote address.
Author : Khaled Salah
Publisher : Springer
ISBN 13 : 3319076116
Total Pages : 181 pages
Book Rating : 4.3/5 (19 download)
Download or read book Arbitrary Modeling of TSVs for 3D Integrated Circuits written by Khaled Salah and published by Springer. This book was released on 2014-08-21 with total page 181 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.
Author :
Publisher :
ISBN 13 :
Total Pages : 348 pages
Book Rating : 4.3/5 (243 download)
Download or read book Applied Mechanics Reviews written by and published by . This book was released on 1992 with total page 348 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : O. C. Zienkiewicz
Publisher : Elsevier
ISBN 13 : 008045559X
Total Pages : 457 pages
Book Rating : 4.0/5 (84 download)
Download or read book The Finite Element Method for Fluid Dynamics written by O. C. Zienkiewicz and published by Elsevier. This book was released on 2005-12-08 with total page 457 pages. Available in PDF, EPUB and Kindle. Book excerpt: Dealing with general problems in fluid mechanics, convection diffusion, compressible and incompressible laminar and turbulent flow, shallow water flows and waves, this is the leading text and reference for engineers working with fluid dynamics in fields including aerospace engineering, vehicle design, thermal engineering and many other engineering applications. The new edition is a complete fluids text and reference in its own right. Along with its companion volumes it forms part of the indispensable Finite Element Method series. New material in this edition includes sub-grid scale modelling; artificial compressibility; full new chapters on turbulent flows, free surface flows and porous medium flows; expanded shallow water flows plus long, medium and short waves; and advances in parallel computing. A complete, stand-alone reference on fluid mechanics applications of the FEM for mechanical, aeronautical, automotive, marine, chemical and civil engineers. Extensive new coverage of turbulent flow and free surface treatments
