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Author : Pei-Lin Pai
Publisher :
ISBN 13 :
Total Pages : 302 pages
Book Rating : 4.:/5 (29 download)
Download or read book Multilevel Interconnection Technologies written by Pei-Lin Pai and published by . This book was released on 1987 with total page 302 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Gopal K. Rao
Publisher : McGraw-Hill Companies
ISBN 13 :
Total Pages : 250 pages
Book Rating : 4.3/5 (91 download)
Download or read book Multilevel Interconnect Technology written by Gopal K. Rao and published by McGraw-Hill Companies. This book was released on 1993 with total page 250 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first book on a key topic in IC technology. Table of Contents: Multilevel Interconnection Design; Multilevel Interconnect Processing; Manufacturing; Reliability; Index. 100 illustrations.
Author : Christoph Steinbruchel
Publisher : SPIE Press
ISBN 13 : 9780819438973
Total Pages : 138 pages
Book Rating : 4.4/5 (389 download)
Download or read book Copper Interconnect Technology written by Christoph Steinbruchel and published by SPIE Press. This book was released on 2001 with total page 138 pages. Available in PDF, EPUB and Kindle. Book excerpt: A textbook designed to accompany The Society of Photo-Optical Instrumentation Engineers' short course on improving interconnect performance for increased speed in overall circuit performance authored by Steinbrnchel (materials science and engineering, Renselaer Polytechnic Institute) and Chin (senio
Author :
Publisher :
ISBN 13 :
Total Pages : 206 pages
Book Rating : 4.3/5 (91 download)
Download or read book Multilevel Interconnect Technology written by and published by . This book was released on 1999 with total page 206 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : James William Peterson
Publisher :
ISBN 13 :
Total Pages : 56 pages
Book Rating : 4.:/5 (142 download)
Download or read book Low Temperature Multilevel Interconnection Technology Employing a Polyimide written by James William Peterson and published by . This book was released on 1985 with total page 56 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : L. B. Rothman
Publisher :
ISBN 13 :
Total Pages : 288 pages
Book Rating : 4.:/5 (44 download)
Download or read book Proceedings of the Symposium on Multilevel Metallization, Interconnection, and Contact Technologies written by L. B. Rothman and published by . This book was released on 1987 with total page 288 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 :
Total Pages : 414 pages
Book Rating : 4.3/5 (91 download)
Download or read book Microelectronic Device and Multilevel Interconnection Technology written by and published by . This book was released on 1996 with total page 414 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 :
Total Pages : 342 pages
Book Rating : 4.3/5 (91 download)
Download or read book Microelectronic Device and Multilevel Interconnection Technology written by and published by . This book was released on 1995 with total page 342 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Hoang H. Hoang
Publisher :
ISBN 13 :
Total Pages : 244 pages
Book Rating : 4.3/5 (91 download)
Download or read book Multilevel Interconnection written by Hoang H. Hoang and published by . This book was released on 1993 with total page 244 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : David Charles Thomas
Publisher :
ISBN 13 :
Total Pages : 490 pages
Book Rating : 4.E/5 ( download)
Download or read book A Multilevel Planar Interconnect Technology Utilizing the Selective Deposition of Tungsten written by David Charles Thomas and published by . This book was released on 1990 with total page 490 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Multilevel Interconnect Technology II written by and published by . This book was released on 1998 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Jeffrey A. Davis
Publisher : Springer Science & Business Media
ISBN 13 : 1461504619
Total Pages : 417 pages
Book Rating : 4.4/5 (615 download)
Download or read book Interconnect Technology and Design for Gigascale Integration written by Jeffrey A. Davis and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 417 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in-depth exploration into interconnect-aware computer architectures.
Author : Harzara S. Rathore
Publisher :
ISBN 13 :
Total Pages : 516 pages
Book Rating : 4.F/5 ( download)
Download or read book Proceedings of the Symposia on Reliability of Semiconductor Devices and Interconnection and Multilevel Metallization, Interconnection, and Contact Technologies written by Harzara S. Rathore and published by . This book was released on 1989 with total page 516 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : L B. Rothman
Publisher :
ISBN 13 :
Total Pages : 272 pages
Book Rating : 4.:/5 (664 download)
Download or read book Proceedings of the Symposium on Multilevel Metallization, Interconnection, and Contact Technologies written by L B. Rothman and published by . This book was released on 1987 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : L. B. Rothman
Publisher :
ISBN 13 :
Total Pages : 272 pages
Book Rating : 4.:/5 (917 download)
Download or read book Multilevel Metallization, Interconnection, and Contact Technologies written by L. B. Rothman and published by . This book was released on 1987 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Tapan Gupta
Publisher : Springer Science & Business Media
ISBN 13 : 1441900764
Total Pages : 433 pages
Book Rating : 4.4/5 (419 download)
Download or read book Copper Interconnect Technology written by Tapan Gupta and published by Springer Science & Business Media. This book was released on 2010-01-22 with total page 433 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology. Because metallic conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials is now prevalent in the international microelectronics industry. As the feature size of the Cu-lines forming interconnects is scaled, resistivity of the lines increases. At the same time electromigration and stress-induced voids due to increased current density become significant reliability issues. Although copper/low-k technology has become fairly mature, there is no single book available on the promise and challenges of these next-generation technologies. In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology.
Author : Syd R. Wilson
Publisher : William Andrew
ISBN 13 :
Total Pages : 922 pages
Book Rating : 4.3/5 (91 download)
Download or read book Handbook of Multilevel Metallization for Integrated Circuits written by Syd R. Wilson and published by William Andrew. This book was released on 1993 with total page 922 pages. Available in PDF, EPUB and Kindle. Book excerpt: It is widely recognized that the successful design, development, and integration of multilevel metallization (MLM) systems is and will continue to be key to current and future VLSI technologies. All major semiconductor companies have significant ongoing research teams focused in this area. These teams must view multilevel metallization as a system rather than a collection of isolated process modules.
