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Multilayer Interconnections For Hybrid Microcircuits
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Book Synopsis Hybrid Microcircuit Technology Handbook by : James J. Licari
Download or read book Hybrid Microcircuit Technology Handbook written by James J. Licari and published by Elsevier. This book was released on 1998-12-31 with total page 603 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, important chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines will be of value to materials and process engineers, chemists, and electrical engineers who design and test hybrid circuits.
Book Synopsis Microcircuit Reliability Bibliography by :
Download or read book Microcircuit Reliability Bibliography written by and published by . This book was released on 1978 with total page 412 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author : Publisher :Elsevier ISBN 13 :0080945074 Total Pages :409 pages Book Rating :4.0/5 (89 download)
Download or read book written by and published by Elsevier. This book was released on with total page 409 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Semiconducting Devices by : A. H. Agajanian
Download or read book Semiconducting Devices written by A. H. Agajanian and published by Ifi/Plenum. This book was released on 1976 with total page 980 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Surface Mount and Related Technologies by : Gerald L. Ginsberg
Download or read book Surface Mount and Related Technologies written by Gerald L. Ginsberg and published by CRC Press. This book was released on 1989-04-24 with total page 416 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :United States. National Aeronautics and Space Administration. Office of Reliability and Quality Assurance Publisher : ISBN 13 : Total Pages :602 pages Book Rating :4.F/5 ( download)
Book Synopsis Reliability Abstracts and Technical Reviews by : United States. National Aeronautics and Space Administration. Office of Reliability and Quality Assurance
Download or read book Reliability Abstracts and Technical Reviews written by United States. National Aeronautics and Space Administration. Office of Reliability and Quality Assurance and published by . This book was released on 1968 with total page 602 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Hybrid Assemblies and Multichip Modules by : Fred W. Kear
Download or read book Hybrid Assemblies and Multichip Modules written by Fred W. Kear and published by CRC Press. This book was released on 2020-07-25 with total page 296 pages. Available in PDF, EPUB and Kindle. Book excerpt: Providing a description of design considerations from the user's viewpoint, this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications.;Examining the current state of hybrid assembly technology, Hybrid Assemblies and Multichip Modules: provides a thorough overview of substrate materials and metals used for conductors, addressing multilayer materials and overglazes; explicates design considerations such as circuit layout, component placement, thermal management and interface problems; clarifies the manufacturing techniques used for multi-layer thick-film circuits and multilayer substrates; and explains soldering and other attachment methods for discrete components.;Focusing primarily on electronic assemblies that use ceramic substrates, Hybrid Assemblies and Multichip Modules should serve as a comprehensive resource for manufacturing, electrical and electronics, and automotive engineers; manufacturing managers; hybrid assembly designers; hybrid assembly users; printed circuit designers, fabricators and users; and graduate-level students in manufacturing engineering and electronic packaging courses.
Book Synopsis 1969 Electronic Components Conference, April 30, May 2, 1969 by :
Download or read book 1969 Electronic Components Conference, April 30, May 2, 1969 written by and published by . This book was released on 1969 with total page 476 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Handbook of Polymer Coatings for Electronics by : James J. Licari
Download or read book Handbook of Polymer Coatings for Electronics written by James J. Licari and published by William Andrew. This book was released on 1990-12-31 with total page 409 pages. Available in PDF, EPUB and Kindle. Book excerpt: This completely revised edition remains the only comprehensive treatise on polymer coatings for electronics. Since the original edition, the applications of coatings for the environmental protection of electronic systems have greatly increased, largely driven by the competitive need to reduce costs, weight and volume. The demands for high-speed circuits for the rapid processing of signals and data, high-density circuits for the storage and retrieval of megabits of memory, and the improved reliability required of electronics for guiding and controlling weapons and space vehicles have triggered the development of many new and improved coating polymers and formulations. Both the theoretical aspects of coatings (molecular structure of polymer types and their correlation with electrical and physical properties) and applied aspects (functions, deposition processes, applications, testing) are covered in the book. Over 100 proprietary coating formulations were reviewed, their properties collated, and tables of comparative properties prepared. This book is useful as both a primer and as a handbook for collecting properties data.
Book Synopsis Fine Pitch Surface Mount Technology by : Phil Marcoux
Download or read book Fine Pitch Surface Mount Technology written by Phil Marcoux and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 351 pages. Available in PDF, EPUB and Kindle. Book excerpt: Fine pitch high lead count integrated circuit packages represent a dramatic change from the conventional methods of assembling electronic components to a printed interconnect circuit board. To some, these FPTpackages appear to bean extension of the assembly technology called surface mount or SMT. Many of us who have spent a significant amount of time developing the process and design techniques for these fine pitchpackages haveconcluded that these techniquesgobeyondthose commonly useed for SMT. In 1987 the presentauthor, convincedofthe uniqueness ofthe assembly and design demands ofthese packages, chaired ajoint committee where the members agreed to use fine pitch technology (FPT) as the defining term for these demands. The committee was unique in several ways, one being that it was the first time three U. S. standards organizations, the IPC (Lincolnwood, IL), theEIA(Washington, D. C. ),and theASTM (Philadelphia),cametogether tocreate standards before a technology was in high demand. The term fine pitch technology and its acronym FPT have since become widely accepted in the electronics industry. The knowledge of the terms and demands of FPT currently exceed the usage of FPT packaged components, but this is changing rapidly because of the size, performance, and cost savings of FPT. I have resisted several past invitations to write other technical texts. However, I feel there are important advantages and significant difficulties to be encountered with FPT.
Book Synopsis High-Performance Polymer... by : Guy Rabilloud
Download or read book High-Performance Polymer... written by Guy Rabilloud and published by Editions OPHRYS. This book was released on with total page 596 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Lockheed Horizons written by and published by . This book was released on 1985 with total page 668 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Scientific and Technical Aerospace Reports by :
Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1975 with total page 978 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Index to IEEE Publications by : Institute of Electrical and Electronics Engineers
Download or read book Index to IEEE Publications written by Institute of Electrical and Electronics Engineers and published by . This book was released on 1996 with total page 1260 pages. Available in PDF, EPUB and Kindle. Book excerpt: Issues for 1973- cover the entire IEEE technical literature.
Book Synopsis Adhesives Technology for Electronic Applications by : James J. Licari
Download or read book Adhesives Technology for Electronic Applications written by James J. Licari and published by William Andrew. This book was released on 2011-06-24 with total page 415 pages. Available in PDF, EPUB and Kindle. Book excerpt: Approx.512 pagesApprox.512 pages
Book Synopsis Government reports annual index by :
Download or read book Government reports annual index written by and published by . This book was released on 199? with total page 864 pages. Available in PDF, EPUB and Kindle. Book excerpt:
