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Multi Chip Module Conference 1996 Ieee Mcmc 96
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Book Synopsis Multi-Chip Module Conference, 1996 IEEE (MCMC-96 by : Institute of Electrical and Electronics Engineers, Inc. Staff
Download or read book Multi-Chip Module Conference, 1996 IEEE (MCMC-96 written by Institute of Electrical and Electronics Engineers, Inc. Staff and published by . This book was released on 1996 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Index of Conference Proceedings by : British Library. Document Supply Centre
Download or read book Index of Conference Proceedings written by British Library. Document Supply Centre and published by . This book was released on 1997 with total page 938 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Proceedings, 1996 International Conference on Multichip Modules by :
Download or read book Proceedings, 1996 International Conference on Multichip Modules written by and published by . This book was released on 1996 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Algorithms for VLSI Physical Design Automation by : Naveed A. Sherwani
Download or read book Algorithms for VLSI Physical Design Automation written by Naveed A. Sherwani and published by Springer Science & Business Media. This book was released on 2007-05-08 with total page 592 pages. Available in PDF, EPUB and Kindle. Book excerpt: Algorithms for VLSI Physical Design Automation, Third Edition covers all aspects of physical design. The book is a core reference for graduate students and CAD professionals. For students, concepts and algorithms are presented in an intuitive manner. For CAD professionals, the material presents a balance of theory and practice. An extensive bibliography is provided which is useful for finding advanced material on a topic. At the end of each chapter, exercises are provided, which range in complexity from simple to research level. Algorithms for VLSI Physical Design Automation, Third Edition provides a comprehensive background in the principles and algorithms of VLSI physical design. The goal of this book is to serve as a basis for the development of introductory-level graduate courses in VLSI physical design automation. It provides self-contained material for teaching and learning algorithms of physical design. All algorithms which are considered basic have been included, and are presented in an intuitive manner. Yet, at the same time, enough detail is provided so that readers can actually implement the algorithms given in the text and use them. The first three chapters provide the background material, while the focus of each chapter of the rest of the book is on each phase of the physical design cycle. In addition, newer topics such as physical design automation of FPGAs and MCMs have been included. The basic purpose of the third edition is to investigate the new challenges presented by interconnect and process innovations. In 1995 when the second edition of this book was prepared, a six-layer process and 15 million transistor microprocessors were in advanced stages of design. In 1998, six metal process and 20 million transistor designs are in production. Two new chapters have been added and new material has been included in almost allother chapters. A new chapter on process innovation and its impact on physical design has been added. Another focus of the third edition is to promote use of the Internet as a resource, so wherever possible URLs have been provided for further investigation. Algorithms for VLSI Physical Design Automation, Third Edition is an important core reference work for professionals as well as an advanced level textbook for students.
Download or read book Proceedings written by and published by . This book was released on 1998 with total page 168 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis New Directions in Terahertz Technology by : J.M. Chamberlain
Download or read book New Directions in Terahertz Technology written by J.M. Chamberlain and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 412 pages. Available in PDF, EPUB and Kindle. Book excerpt: A detailed study of the science, engineering and applications of terahertz technology, based on room-temperature solid-state devices, which are seen as the key technology for wider applications in this frequency range. The relative merits of electronic and optical devices are discussed and new device principles identified. Issues of terahertz circuit design, implementation and measurement are complemented by chapters on current and future applications in communications, sensing and remote surveillance. Audience: The unique coverage of all aspects of terahertz technology will appeal to both new and established workers in the field, as well as providing a survey for the interested reader.
Download or read book More than Moore written by Guo Qi Zhang and published by Springer Science & Business Media. This book was released on 2010-01-23 with total page 338 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the past decades, the mainstream of microelectronics progression was mainly powered by Moore's law focusing on IC miniaturization down to nano scale. However, there is a fast increasing need for "More than Moore" (MtM) products and technology that are based upon or derived from silicon technologies, but do not simply scale with Moore’s law. This book provides new vision, strategy and guidance for the future technology and business development of micro/nanoelectronics.
Download or read book AmIware written by Satyen Mukherjee and published by Springer Science & Business Media. This book was released on 2006-06-29 with total page 480 pages. Available in PDF, EPUB and Kindle. Book excerpt: Ambient Intelligence is one of the new paradigms in the development of information and communication technology, which has attracted much attention over the past years. The aim is the to integrate technology into people environment in such a way that it improves their daily lives in terms of well-being, creativity, and productivity. Ambient Intelligence is a multidisciplinary concept, which heavily builds on a number of fundamental breakthroughs that have been achieved in the development of new hardware concepts over the past years. New insights in nano and micro electronics, packaging and interconnection technology, large-area electronics, energy scavenging devices, wireless sensors, low power electronics and computing platforms enable the realization of the heaven of ambient intelligence by overcoming the hell of physics. Based on contributions from leading technical experts, this book presents a number of key topics on novel hardware developments, thus providing the reader a good insight into the physical basis of ambient intelligence. It also indicates key research challenges that must be addressed in the future.
Book Synopsis Analog Circuit Design by : Herman Casier
Download or read book Analog Circuit Design written by Herman Casier and published by Springer Science & Business Media. This book was released on 2008-03-19 with total page 362 pages. Available in PDF, EPUB and Kindle. Book excerpt: Analog Circuit Design is based on the yearly Advances in Analog Circuit Design workshop. The aim of the workshop is to bring together designers of advanced analogue and RF circuits for the purpose of studying and discussing new possibilities and future developments in this field. Selected topics for AACD 2007 were: (1) Sensors, Actuators and Power Drivers for the Automotive and Industrial Environment; (2) Integrated PA's from Wireline to RF; (3) Very High Frequency Front Ends.
Book Synopsis Proceedings of the ... Midwest Symposium on Circuits and Systems by :
Download or read book Proceedings of the ... Midwest Symposium on Circuits and Systems written by and published by . This book was released on 2003 with total page 558 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings in Print written by and published by . This book was released on 1996 with total page 508 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Heterogeneous Integration of Materials for Passive Components and Smart Systems: Volume 969 by : Juan C. Nino
Download or read book Heterogeneous Integration of Materials for Passive Components and Smart Systems: Volume 969 written by Juan C. Nino and published by . This book was released on 2007-05-30 with total page 184 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book, first published in 2007, discusses advances, the current status, and future challenges in the broad area of materials integration for passive components and smart systems.
Book Synopsis Electrical Performance of Electronic Packaging by :
Download or read book Electrical Performance of Electronic Packaging written by and published by . This book was released on 2004 with total page 372 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis The International Journal of Microcircuits and Electronic Packaging by :
Download or read book The International Journal of Microcircuits and Electronic Packaging written by and published by . This book was released on 1999 with total page 530 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Advanced Electronic Packaging: Volume 968 by : Vasudeva P. Atluri
Download or read book Advanced Electronic Packaging: Volume 968 written by Vasudeva P. Atluri and published by . This book was released on 2007-04-09 with total page 226 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic packaging architecture evolutions are being driven by silicon technology advancements and new form factors, used models and emerging technologies. High-performance mobile computer and communication systems will require higher I/O counts, greater density, lower cost, lighter weight and improved performance in the electronic package. The book focuses on silicon technology dimension scaling and performance improvement, Pb-free or 'green' assembly, and system-in-package (SIP) technologies. It explores the key thermomechanical failure modes and mitigating solutions associated with integration of silicon with weak interlayer dielectrics during the assembly process, under bump metallurgy integrity with lead-free assembly, and the impact of stress on die-cracking and transistor performance in 3D thin-die stacking. The interaction of these failures with silicon and assembly materials, processes and design features is covered and includes: system in package; advanced packaging/nanotechnology in packaging; physical behavior and mechanical behavior in packaging; electromigration and thermal behavior in packaging and thin films and adhesives in packaging.
Book Synopsis Index to IEEE Publications by : Institute of Electrical and Electronics Engineers
Download or read book Index to IEEE Publications written by Institute of Electrical and Electronics Engineers and published by . This book was released on 1997 with total page 1462 pages. Available in PDF, EPUB and Kindle. Book excerpt: Issues for 1973- cover the entire IEEE technical literature.
Book Synopsis Kokuritsu Kokkai Toshokan shozō kagaku gijutsu kankei Ōbun kaigiroku mokuroku by : Kokuritsu Kokkai Toshokan (Japan)
Download or read book Kokuritsu Kokkai Toshokan shozō kagaku gijutsu kankei Ōbun kaigiroku mokuroku written by Kokuritsu Kokkai Toshokan (Japan) and published by . This book was released on 1997 with total page 1596 pages. Available in PDF, EPUB and Kindle. Book excerpt:
