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Author :
Publisher : Iulia Tomut
ISBN 13 :
Total Pages : 170 pages
Book Rating : 4./5 ( download)
Download or read book Monolithic 3D - In General written by and published by Iulia Tomut. This book was released on with total page 170 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Chuan Seng Tan
Publisher : Springer Science & Business Media
ISBN 13 : 0387765344
Total Pages : 365 pages
Book Rating : 4.3/5 (877 download)
Download or read book Wafer Level 3-D ICs Process Technology written by Chuan Seng Tan and published by Springer Science & Business Media. This book was released on 2009-06-29 with total page 365 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
Author :
Publisher : Iulia Tomut
ISBN 13 :
Total Pages : 159 pages
Book Rating : 4./5 ( download)
Download or read book MonolithIC 3D Advantage written by and published by Iulia Tomut. This book was released on with total page 159 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Masayoshi Esashi
Publisher : John Wiley & Sons
ISBN 13 : 3527823255
Total Pages : 528 pages
Book Rating : 4.5/5 (278 download)
Download or read book 3D and Circuit Integration of MEMS written by Masayoshi Esashi and published by John Wiley & Sons. This book was released on 2021-03-16 with total page 528 pages. Available in PDF, EPUB and Kindle. Book excerpt: Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.
Author : Robin Shannon
Publisher : Scientific e-Resources
ISBN 13 : 1839472413
Total Pages : 312 pages
Book Rating : 4.8/5 (394 download)
Download or read book Linear Integrated Circuits written by Robin Shannon and published by Scientific e-Resources. This book was released on 2019-03-18 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: An analog chip is a set of miniature electronic analog circuits formed on a single piece of semiconductor material. The voltage and current at specified points in the circuits of analog chips vary continuously in time. In contrast, digital chips only use and create voltages or currents at discrete levels, with no intermediate values. In addition to Transistors, analog chips often have a larger number of passive elements than digital chips typically do. Inductors tend to be avoided because of their large size and a transistor and capacitor together can do the work of an inductor. The book broadly deals with: Direct and capacitor coupled Opamp amplifiers; Frequency response and compensation to improve the performance of Opamp circuits; Voltage and current sources, instrumentation amplifiers and precision rectifiers, limiting and clamping circuits; Log and antilog amplifiers, etc. The book covers the syllabus prescribed for B.E. Care is taken to develop the subject logically so that the book could also be used by B.Sc. and diploma students. Neatly drawn diagrams, stepwise illustrations, and graded numerical examples, are included in every chapter to support the contents.
Author : Banqiu Wu
Publisher : McGraw Hill Professional
ISBN 13 : 0071741968
Total Pages : 543 pages
Book Rating : 4.0/5 (717 download)
Download or read book 3D IC Stacking Technology written by Banqiu Wu and published by McGraw Hill Professional. This book was released on 2011-10-14 with total page 543 pages. Available in PDF, EPUB and Kindle. Book excerpt: The latest advances in three-dimensional integrated circuit stacking technology With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers. 3D IC Stacking Technology covers: High density through silicon stacking (TSS) technology Practical design ecosystem for heterogeneous 3D IC products Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack Process integration for TSV manufacturing High-aspect-ratio silicon etch for TSV Dielectric deposition for TSV Barrier and seed deposition Copper electrodeposition for TSV Chemical mechanical polishing for TSV applications Temporary and permanent bonding Assembly and test aspects of TSV technology
Author : Paul D. Franzon
Publisher : John Wiley & Sons
ISBN 13 : 3527338551
Total Pages : 488 pages
Book Rating : 4.5/5 (273 download)
Download or read book Handbook of 3D Integration, Volume 4 written by Paul D. Franzon and published by John Wiley & Sons. This book was released on 2019-05-06 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt: This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
Author : Bernd Höfflinger
Publisher : Springer
ISBN 13 : 3319220934
Total Pages : 342 pages
Book Rating : 4.3/5 (192 download)
Download or read book CHIPS 2020 VOL. 2 written by Bernd Höfflinger and published by Springer. This book was released on 2015-09-19 with total page 342 pages. Available in PDF, EPUB and Kindle. Book excerpt: The release of this second volume of CHIPS 2020 coincides with the 50th anniversary of Moore’s Law, a critical year marked by the end of the nanometer roadmap and by a significantly reduced annual rise in chip performance. At the same time, we are witnessing a data explosion in the Internet, which is consuming 40% more electrical power every year, leading to fears of a major blackout of the Internet by 2020. The messages of the first CHIPS 2020, published in 2012, concerned the realization of quantum steps for improving the energy efficiency of all chip functions. With this second volume, we review these messages and amplify upon the most promising directions: ultra-low-voltage electronics, nanoscale monolithic 3D integration, relevant-data, brain- and human-vision-inspired processing, and energy harvesting for chip autonomy. The team of authors, enlarged by more world leaders in low-power, monolithic 3D, video, and Silicon brains, presents new vistas in nanoelectronics, promising Moore-like exponential growth sustainable through to the 2030s.
Author : Boris Murmann
Publisher : Springer Nature
ISBN 13 : 3030183386
Total Pages : 597 pages
Book Rating : 4.0/5 (31 download)
Download or read book NANO-CHIPS 2030 written by Boris Murmann and published by Springer Nature. This book was released on 2020-06-08 with total page 597 pages. Available in PDF, EPUB and Kindle. Book excerpt: In this book, a global team of experts from academia, research institutes and industry presents their vision on how new nano-chip architectures will enable the performance and energy efficiency needed for AI-driven advancements in autonomous mobility, healthcare, and man-machine cooperation. Recent reviews of the status quo, as presented in CHIPS 2020 (Springer), have prompted the need for an urgent reassessment of opportunities in nanoelectronic information technology. As such, this book explores the foundations of a new era in nanoelectronics that will drive progress in intelligent chip systems for energy-efficient information technology, on-chip deep learning for data analytics, and quantum computing. Given its scope, this book provides a timely compendium that hopes to inspire and shape the future of nanoelectronics in the decades to come.
Author : Katsuyuki Sakuma
Publisher : CRC Press
ISBN 13 : 1351779826
Total Pages : 211 pages
Book Rating : 4.3/5 (517 download)
Download or read book 3D Integration in VLSI Circuits written by Katsuyuki Sakuma and published by CRC Press. This book was released on 2018-04-17 with total page 211 pages. Available in PDF, EPUB and Kindle. Book excerpt: Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.
Author : Aida Todri-Sanial
Publisher : CRC Press
ISBN 13 : 1351830198
Total Pages : 409 pages
Book Rating : 4.3/5 (518 download)
Download or read book Physical Design for 3D Integrated Circuits written by Aida Todri-Sanial and published by CRC Press. This book was released on 2017-12-19 with total page 409 pages. Available in PDF, EPUB and Kindle. Book excerpt: Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Author : Lennart Bamberg
Publisher : Springer Nature
ISBN 13 : 3030982297
Total Pages : 403 pages
Book Rating : 4.0/5 (39 download)
Download or read book 3D Interconnect Architectures for Heterogeneous Technologies written by Lennart Bamberg and published by Springer Nature. This book was released on 2022-06-27 with total page 403 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow’s 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs.
Author : Beth Keser
Publisher : John Wiley & Sons
ISBN 13 : 1119793777
Total Pages : 324 pages
Book Rating : 4.1/5 (197 download)
Download or read book Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces written by Beth Keser and published by John Wiley & Sons. This book was released on 2021-12-29 with total page 324 pages. Available in PDF, EPUB and Kindle. Book excerpt: Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced application spaces being created by companies like TSMC, Deca Technologies, and ASE Group. Finally, emerging technologies from academia are explored. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research.
Author : Aida Todri-Sanial
Publisher : Springer
ISBN 13 : 3319297465
Total Pages : 340 pages
Book Rating : 4.3/5 (192 download)
Download or read book Carbon Nanotubes for Interconnects written by Aida Todri-Sanial and published by Springer. This book was released on 2016-07-09 with total page 340 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.
Author : Rasit O. Topaloglu
Publisher : Springer
ISBN 13 : 3319903853
Total Pages : 279 pages
Book Rating : 4.3/5 (199 download)
Download or read book Beyond-CMOS Technologies for Next Generation Computer Design written by Rasit O. Topaloglu and published by Springer. This book was released on 2018-08-20 with total page 279 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes the bottleneck faced soon by designers of traditional CMOS devices, due to device scaling, power and energy consumption, and variability limitations. This book aims at bridging the gap between device technology and architecture/system design. Readers will learn about challenges and opportunities presented by “beyond-CMOS devices” and gain insight into how these might be leveraged to build energy-efficient electronic systems.
Author : Tadahiro Kuroda
Publisher : Cambridge University Press
ISBN 13 : 110884121X
Total Pages : 337 pages
Book Rating : 4.1/5 (88 download)
Download or read book Wireless Interface Technologies for 3D IC and Module Integration written by Tadahiro Kuroda and published by Cambridge University Press. This book was released on 2021-09-30 with total page 337 pages. Available in PDF, EPUB and Kindle. Book excerpt: Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design.
Author : Luciano Lavagno
Publisher : CRC Press
ISBN 13 : 1482254611
Total Pages : 798 pages
Book Rating : 4.4/5 (822 download)
Download or read book Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology written by Luciano Lavagno and published by CRC Press. This book was released on 2017-02-03 with total page 798 pages. Available in PDF, EPUB and Kindle. Book excerpt: The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to transfer data of semiconductor physical layout) design flow, analog/mixed signal design, physical verification, and technology computer-aided design (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability (DFM) at the nanoscale, power supply network design and analysis, design modeling, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on 3D circuit integration and clock design Offering improved depth and modernity, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.
