Materials Reliability in Microelectronics III: Volume 309

Download Materials Reliability in Microelectronics III: Volume 309 PDF Online Free

Author :
Publisher :
ISBN 13 :
Total Pages : 520 pages
Book Rating : 4.:/5 (318 download)

DOWNLOAD NOW!


Book Synopsis Materials Reliability in Microelectronics III: Volume 309 by : Kenneth P. Rodbell

Download or read book Materials Reliability in Microelectronics III: Volume 309 written by Kenneth P. Rodbell and published by . This book was released on 1993-08-31 with total page 520 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Materials Reliability in Microelectronics

Download Materials Reliability in Microelectronics PDF Online Free

Author :
Publisher :
ISBN 13 :
Total Pages : 488 pages
Book Rating : 4.3/5 (91 download)

DOWNLOAD NOW!


Book Synopsis Materials Reliability in Microelectronics by :

Download or read book Materials Reliability in Microelectronics written by and published by . This book was released on 1997 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Materials Reliability in Microelectronics II: Volume 265

Download Materials Reliability in Microelectronics II: Volume 265 PDF Online Free

Author :
Publisher :
ISBN 13 :
Total Pages : 352 pages
Book Rating : 4.:/5 (318 download)

DOWNLOAD NOW!


Book Synopsis Materials Reliability in Microelectronics II: Volume 265 by : C. V. Thompson

Download or read book Materials Reliability in Microelectronics II: Volume 265 written by C. V. Thompson and published by . This book was released on 1992-09-30 with total page 352 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Materials Reliability in Microelectronics V: Volume 391

Download Materials Reliability in Microelectronics V: Volume 391 PDF Online Free

Author :
Publisher :
ISBN 13 :
Total Pages : 552 pages
Book Rating : 4.:/5 (318 download)

DOWNLOAD NOW!


Book Synopsis Materials Reliability in Microelectronics V: Volume 391 by : Anthony S. Oates

Download or read book Materials Reliability in Microelectronics V: Volume 391 written by Anthony S. Oates and published by . This book was released on 1995-10-24 with total page 552 pages. Available in PDF, EPUB and Kindle. Book excerpt: This long-standing proceedings series is highly regarded as a premier forum for the discussion of microelectronics reliability issues. In this fifth book, emphasis is on the fundamental understanding of failure phenomena in thin-film materials. Special attention is given to electromigration and mechanical stress effects. The reliability of thin dielectrics and hot carrier degradation of transistors are also featured. Topics include: modeling and simulation of failure mechanisms; reliability issues for submicron IC technologies and packaging; stresses in thin films/lines; gate oxides; barrier layers; electromigration mechanisms; reliability issues for Cu metallizations; electromigration and microstructure; electromigration and stress voiding in circuit interconnects; and resistance measurements of electromigration damage.

Reliability and Failure of Electronic Materials and Devices

Download Reliability and Failure of Electronic Materials and Devices PDF Online Free

Author :
Publisher : Academic Press
ISBN 13 : 0080575528
Total Pages : 759 pages
Book Rating : 4.0/5 (85 download)

DOWNLOAD NOW!


Book Synopsis Reliability and Failure of Electronic Materials and Devices by : Milton Ohring

Download or read book Reliability and Failure of Electronic Materials and Devices written by Milton Ohring and published by Academic Press. This book was released on 2014-10-14 with total page 759 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites

Chemical Perspectives of Microelectronic Materials III: Volume 282

Download Chemical Perspectives of Microelectronic Materials III: Volume 282 PDF Online Free

Author :
Publisher : Mrs Proceedings
ISBN 13 :
Total Pages : 760 pages
Book Rating : 4.3/5 (91 download)

DOWNLOAD NOW!


Book Synopsis Chemical Perspectives of Microelectronic Materials III: Volume 282 by : C. R. Abernathy

Download or read book Chemical Perspectives of Microelectronic Materials III: Volume 282 written by C. R. Abernathy and published by Mrs Proceedings. This book was released on 1993-03-23 with total page 760 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

Download Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging PDF Online Free

Author :
Publisher : Springer Science & Business Media
ISBN 13 : 0387329897
Total Pages : 1471 pages
Book Rating : 4.3/5 (873 download)

DOWNLOAD NOW!


Book Synopsis Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging by : Ephraim Suhir

Download or read book Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging written by Ephraim Suhir and published by Springer Science & Business Media. This book was released on 2007-05-26 with total page 1471 pages. Available in PDF, EPUB and Kindle. Book excerpt: This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.

Materials Reliability in Microelectronics VI: Volume 428

Download Materials Reliability in Microelectronics VI: Volume 428 PDF Online Free

Author :
Publisher :
ISBN 13 :
Total Pages : 616 pages
Book Rating : 4.:/5 (318 download)

DOWNLOAD NOW!


Book Synopsis Materials Reliability in Microelectronics VI: Volume 428 by : William F. Filter

Download or read book Materials Reliability in Microelectronics VI: Volume 428 written by William F. Filter and published by . This book was released on 1996-11-18 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: MRS books on materials reliability in microelectronics have become the snapshot of progress in this field. Reduced feature size, increased speed, and larger area are all factors contributing to the continual performance and functionality improvements in integrated circuit technology. These same factors place demands on the reliability of the individual components that make up the IC. Achieving increased reliability requires an improved understanding of both thin-film and patterned-feature materials properties and their degradation mechanisms, how materials and processes used to fabricate ICs interact, and how they may be tailored to enable reliability improvements. This book focuses on the physics and materials science of microelectronics reliability problems rather than the traditional statistical, accelerated electrical testing aspects. Studies are grouped into three large sections covering electromigration, gate oxide reliability and mechanical stress behavior. Topics include: historical summary; reliability issues for Cu metallization; characterization of electromigration phenomena; modelling; microstructural evolution and influences; oxide and device reliability; thin oxynitride dielectrics; noncontact diagnostics; stress effects in thin films and interconnects and microbeam X-ray techniques for stress measurements.

Defects in Microelectronic Materials and Devices

Download Defects in Microelectronic Materials and Devices PDF Online Free

Author :
Publisher : CRC Press
ISBN 13 : 1420043773
Total Pages : 772 pages
Book Rating : 4.4/5 (2 download)

DOWNLOAD NOW!


Book Synopsis Defects in Microelectronic Materials and Devices by : Daniel M. Fleetwood

Download or read book Defects in Microelectronic Materials and Devices written by Daniel M. Fleetwood and published by CRC Press. This book was released on 2008-11-19 with total page 772 pages. Available in PDF, EPUB and Kindle. Book excerpt: Uncover the Defects that Compromise Performance and ReliabilityAs microelectronics features and devices become smaller and more complex, it is critical that engineers and technologists completely understand how components can be damaged during the increasingly complicated fabrication processes required to produce them.A comprehensive survey of defe

Die-Attach Materials for High Temperature Applications in Microelectronics Packaging

Download Die-Attach Materials for High Temperature Applications in Microelectronics Packaging PDF Online Free

Author :
Publisher : Springer
ISBN 13 : 3319992562
Total Pages : 292 pages
Book Rating : 4.3/5 (199 download)

DOWNLOAD NOW!


Book Synopsis Die-Attach Materials for High Temperature Applications in Microelectronics Packaging by : Kim S. Siow

Download or read book Die-Attach Materials for High Temperature Applications in Microelectronics Packaging written by Kim S. Siow and published by Springer. This book was released on 2019-01-29 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.

Materials Reliability in Microelectronics IV

Download Materials Reliability in Microelectronics IV PDF Online Free

Author :
Publisher :
ISBN 13 :
Total Pages : 666 pages
Book Rating : 4.:/5 (318 download)

DOWNLOAD NOW!


Book Synopsis Materials Reliability in Microelectronics IV by : Materials Research Society. Spring Meeting

Download or read book Materials Reliability in Microelectronics IV written by Materials Research Society. Spring Meeting and published by . This book was released on 1994 with total page 666 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Materials Reliability in Microelectronics VII: Volume 473

Download Materials Reliability in Microelectronics VII: Volume 473 PDF Online Free

Author :
Publisher :
ISBN 13 :
Total Pages : 488 pages
Book Rating : 4.:/5 (318 download)

DOWNLOAD NOW!


Book Synopsis Materials Reliability in Microelectronics VII: Volume 473 by : J. Joseph Clement

Download or read book Materials Reliability in Microelectronics VII: Volume 473 written by J. Joseph Clement and published by . This book was released on 1997-10-20 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt: The inexorable drive for increased integrated circuit functionality and performance places growing demands on the metal and dielectric thin films used in fabricating these circuits, as well as spurring demand for new materials applications and processes. This book directly addresses issues of widespread concern in the microelectronics industry - smaller feature sizes, new materials and new applications that challenge the reliability of new technologies. While the book continues the focus on issues related to interconnect reliability, such as electromigration and stress, particular emphasis is placed on the effects of microstructure. An underlying theme is understanding the importance of interactions among different materials and associated interfaces comprising a single structure with dimensions near or below the micrometer scale. Topics include: adhesion and fracture; gate oxide growth and oxide interfaces; surface preparation and gate oxide reliability; oxide degradation and defects; micro-structure, texture and reliability; novel measurement techniques; interconnect performance and reliability modeling; electromigration and interconnect reliability and stress and stress relaxation.

Electromigration in Metals

Download Electromigration in Metals PDF Online Free

Author :
Publisher : Cambridge University Press
ISBN 13 : 1107032385
Total Pages : 433 pages
Book Rating : 4.1/5 (7 download)

DOWNLOAD NOW!


Book Synopsis Electromigration in Metals by : Paul S. Ho

Download or read book Electromigration in Metals written by Paul S. Ho and published by Cambridge University Press. This book was released on 2022-05-12 with total page 433 pages. Available in PDF, EPUB and Kindle. Book excerpt: Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. Through a detailed review on the role of microstructure, interfaces and processing on electromigration reliability, as well as characterisation, testing and analysis, the book follows the development of on-chip interconnects from microscale to nanoscale. Practical modeling methodologies for statistical analysis, from simple 1D approximation to complex 3D description, can be used for step-by-step development of reliable on-chip wiring stacks and industrial-grade power/ground grids. This is an ideal resource for materials scientists and reliability and chip design engineers.

Influence of Temperature on Microelectronics and System Reliability

Download Influence of Temperature on Microelectronics and System Reliability PDF Online Free

Author :
Publisher : CRC Press
ISBN 13 : 0429605595
Total Pages : 332 pages
Book Rating : 4.4/5 (296 download)

DOWNLOAD NOW!


Book Synopsis Influence of Temperature on Microelectronics and System Reliability by : Pradeep Lall

Download or read book Influence of Temperature on Microelectronics and System Reliability written by Pradeep Lall and published by CRC Press. This book was released on 2020-07-09 with total page 332 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The

Reliability and Quality in Microelectronic Manufacturing

Download Reliability and Quality in Microelectronic Manufacturing PDF Online Free

Author :
Publisher : RIAC
ISBN 13 : 1933904151
Total Pages : 410 pages
Book Rating : 4.9/5 (339 download)

DOWNLOAD NOW!


Book Synopsis Reliability and Quality in Microelectronic Manufacturing by : A. Christou

Download or read book Reliability and Quality in Microelectronic Manufacturing written by A. Christou and published by RIAC. This book was released on 2006 with total page 410 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Chemical Perspectives of Microelectronic Materials

Download Chemical Perspectives of Microelectronic Materials PDF Online Free

Author :
Publisher :
ISBN 13 :
Total Pages : 762 pages
Book Rating : 4.X/5 (2 download)

DOWNLOAD NOW!


Book Synopsis Chemical Perspectives of Microelectronic Materials by :

Download or read book Chemical Perspectives of Microelectronic Materials written by and published by . This book was released on 1992 with total page 762 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Advanced Manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging

Download Advanced Manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging PDF Online Free

Author :
Publisher : Emerald Group Publishing
ISBN 13 : 184663010X
Total Pages : 72 pages
Book Rating : 4.8/5 (466 download)

DOWNLOAD NOW!


Book Synopsis Advanced Manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging by :

Download or read book Advanced Manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging written by and published by Emerald Group Publishing. This book was released on 2006 with total page 72 pages. Available in PDF, EPUB and Kindle. Book excerpt: This issue of Soldering & Surface Mount Technology (SSMT) presents a number of papers from the 7th High Density Microsystems Design, Packaging and Failure Analysis (HDP'05) conference held in 2005 in the dynamic city of Shanghai, China. With over 100 high quality technical papers and presentation this annual conference brings together scholars and industrialists from Asia, Europe and the Americas to discuss the challenges and latest advances in high density packaging. This e-book contains six papers from the HDP conference, plus one additional contribution, which discuss the behaviour of key i.