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Author :
Publisher :
ISBN 13 :
Total Pages : 256 pages
Book Rating : 4.3/5 (91 download)
Download or read book Materials, Integration and Packaging Issues for High-frequency Devices written by and published by . This book was released on 2003 with total page 256 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : P. Muralt
Publisher : Cambridge University Press
ISBN 13 : 9781558997219
Total Pages : 0 pages
Book Rating : 4.9/5 (972 download)
Download or read book Materials, Integration and Packaging Issues for High-Frequency Devices: Volume 783 written by P. Muralt and published by Cambridge University Press. This book was released on 2004-04-05 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book, first published in 2004, focuses on the materials technologies that are key to the advancement of high-frequency devices. The competition for better-performing mobile phones is the main driving factor in this field. In mobile phones, passive components constitute 70-90% of the number of components, volume, and costs. The spirit of the volume is to bring together scientists in the processing, characterization, packaging, device design and applications of passive devices, to gain insight into the various paths along which technology of passive components is progressing. Topics include: improvements in low-temperature co-fired ceramics; microstructure - property relationships in perovskites for new materials compositions, with lower firing temperatures, for microwave dielectrics with high-quality factors; tunable ferroelectrics allowing low-cost solutions for frequency tuning and phase shifters; new integration platforms and packaging concepts; embedded capacitors; integration of RF switches based on MEMS technology; bulk acoustic wave resonators and above-chip integration.
Author : Chuan Seng Tan
Publisher : Springer Science & Business Media
ISBN 13 : 0387765344
Total Pages : 365 pages
Book Rating : 4.3/5 (877 download)
Download or read book Wafer Level 3-D ICs Process Technology written by Chuan Seng Tan and published by Springer Science & Business Media. This book was released on 2009-06-29 with total page 365 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
Author : James E. Morris
Publisher : Springer Science & Business Media
ISBN 13 : 0387473262
Total Pages : 553 pages
Book Rating : 4.3/5 (874 download)
Download or read book Nanopackaging written by James E. Morris and published by Springer Science & Business Media. This book was released on 2008-12-30 with total page 553 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.
Author : Yosi Shacham-Diamand
Publisher : Springer Science & Business Media
ISBN 13 : 0387958681
Total Pages : 545 pages
Book Rating : 4.3/5 (879 download)
Download or read book Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications written by Yosi Shacham-Diamand and published by Springer Science & Business Media. This book was released on 2009-09-19 with total page 545 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.
Author : Winston O. Soboyejo
Publisher : CRC Press
ISBN 13 : 1420017462
Total Pages : 526 pages
Book Rating : 4.4/5 (2 download)
Download or read book Advanced Structural Materials written by Winston O. Soboyejo and published by CRC Press. This book was released on 2006-12-21 with total page 526 pages. Available in PDF, EPUB and Kindle. Book excerpt: A snapshot of the central ideas used to control fracture properties of engineered structural metallic materials, Advanced Structural Materials: Properties, Design Optimization, and Applications illustrates the critical role that advanced structural metallic materials play in aerospace, biomedical, automotive, sporting goods, and other indust
Author : Satyen Mukherjee
Publisher : Springer Science & Business Media
ISBN 13 : 1402041985
Total Pages : 480 pages
Book Rating : 4.4/5 (2 download)
Download or read book AmIware written by Satyen Mukherjee and published by Springer Science & Business Media. This book was released on 2006-06-29 with total page 480 pages. Available in PDF, EPUB and Kindle. Book excerpt: Ambient Intelligence is one of the new paradigms in the development of information and communication technology, which has attracted much attention over the past years. The aim is the to integrate technology into people environment in such a way that it improves their daily lives in terms of well-being, creativity, and productivity. Ambient Intelligence is a multidisciplinary concept, which heavily builds on a number of fundamental breakthroughs that have been achieved in the development of new hardware concepts over the past years. New insights in nano and micro electronics, packaging and interconnection technology, large-area electronics, energy scavenging devices, wireless sensors, low power electronics and computing platforms enable the realization of the heaven of ambient intelligence by overcoming the hell of physics. Based on contributions from leading technical experts, this book presents a number of key topics on novel hardware developments, thus providing the reader a good insight into the physical basis of ambient intelligence. It also indicates key research challenges that must be addressed in the future.
Author : Debatosh Guha
Publisher : John Wiley & Sons
ISBN 13 : 1119972981
Total Pages : 512 pages
Book Rating : 4.1/5 (199 download)
Download or read book Microstrip and Printed Antennas written by Debatosh Guha and published by John Wiley & Sons. This book was released on 2011-02-02 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on new techniques, analysis, applications and future trends of microstrip and printed antenna technologies, with particular emphasis to recent advances from the last decade Attention is given to fundamental concepts and techniques, their practical applications and the future scope of developments. Several topics, essayed as individual chapters include reconfigurable antenna, ultra-wideband (UWB) antenna, reflectarrays, antennas for RFID systems and also those for body area networks. Also included are antennas using metamaterials and defected ground structures (DGSs). Essential aspects including advanced design, analysis and optimization techniques based on the recent developments have also been addressed. Key Features: Addresses emerging hot topics of research and applications in microstrip and printed antennas Considers the fundamental concepts, techniques, applications and future scope of such technologies Discusses modern applications such as wireless base station to mobile handset, satellite earth station to airborne communication systems, radio frequency identification (RFID) to body area networks, etc. Contributions from highly regarded experts and pioneers from the US, Europe and Asia This book provides a reference for R&D researchers, professors, practicing engineers, and scientists working in these fields. Graduate students studying/working on related subjects will find this book as a comprehensive literature for understanding the present and future trends in microstrip and printed antennas.
Author : Zheng Cui
Publisher : John Wiley & Sons
ISBN 13 : 1118920945
Total Pages : 360 pages
Book Rating : 4.1/5 (189 download)
Download or read book Printed Electronics written by Zheng Cui and published by John Wiley & Sons. This book was released on 2016-04-13 with total page 360 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides an overview of the newly emerged and highly interdisciplinary field of printed electronics • Provides an overview of the latest developments and research results in the field of printed electronics • Topics addressed include: organic printable electronic materials, inorganic printable electronic materials, printing processes and equipments for electronic manufacturing, printable transistors, printable photovoltaic devices, printable lighting and display, encapsulation and packaging of printed electronic devices, and applications of printed electronics • Discusses the principles of the above topics, with support of examples and graphic illustrations • Serves both as an advanced introductory to the topic and as an aid for professional development into the new field • Includes end of chapter references and links to further reading
Author : Lee Yung-cheng
Publisher : World Scientific
ISBN 13 : 9813229373
Total Pages : 364 pages
Book Rating : 4.8/5 (132 download)
Download or read book Mems Packaging written by Lee Yung-cheng and published by World Scientific. This book was released on 2018-01-03 with total page 364 pages. Available in PDF, EPUB and Kindle. Book excerpt: MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices. This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability. Contents: Introduction to MEMS Packaging (Y C Lee, Ramesh Ramadoss and Nils Hoivik)Silex's TSV Technology: Overview of Processes and MEMS Applications (Tomas Bauer and Thorbjörn Ebefors)Vertical Interconnects for High-end MEMS (Maaike M Visser Taklo and Sigurd Moe)Using Wafer-Level Packaging to Improve Sensor Manufacturability and Cost (Paul Pickering, Collin Twanow and Dean Spicer)Nasiri Fabrication Process for Low-Cost Motion Sensors in the Consumer Market (Steven Nasiri, Ramesh Ramadoss and Sandra Winkler)PCB Based MEMS and Microfluidics (Ramesh Ramadoss, Antonio Luque and Carmen Aracil)Single Wafer Encapsulation of MEMS Resonators (Janna Rodriguez and Thomas Kenny)Heterogeneous Integration and Wafer-Level Packaging of MEMS (Masayoshi Esashi and Shuji Tanaka)Packaging of Membrane-Based Polymer Microfluidic Systems (Yu-Chuan Su)Wafer-Level Solder Bonding by Using Localized Induction Heating (Hsueh-An Yang, Chiung-Wen Lin and Weileun Fang)Localized Sealing Schemes for MEMS Packaging (Y T Cheng, Y C Su and Liwei Lin)Microsprings for High-Density Flip-Chip Packaging (Eugene M Chow and Christopher L Chua)MEMS Reliability (Chien-Ming Huang, Arvind Sai SarathiVasan, Yunhan Huang, Ravi Doraiswami, Michael Osterman and Michael Pecht) Readership: Researchers and graduate students participating in research, R&D, and manufacturing of MEMS products; professionals associated with the integration for systems represented by smartphones, AR/VR, and wearable electronics. Keywords: MEMS;Packaging;Microelectromechanical Systems;Reliability;Microstructures;Sensors;ActuatorsReview: Key Features: The book covers engineering topics critical to product development as well as research topics critical to integration for future MEMS-enabled systemsIt is a major resource for those participating in MEMS and for every professional associated with the integration for systems represented by smartphones, AR/VR and wearable electronics
Author : Jeremy A. Theil
Publisher :
ISBN 13 :
Total Pages : 192 pages
Book Rating : 4.3/5 (91 download)
Download or read book Materials, Integration and Technology for Monolithic Instruments: Volume 869 written by Jeremy A. Theil and published by . This book was released on 2005-07-28 with total page 192 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author : Yangyuan Wang
Publisher : Springer Nature
ISBN 13 : 9819928362
Total Pages : 2006 pages
Book Rating : 4.8/5 (199 download)
Download or read book Handbook of Integrated Circuit Industry written by Yangyuan Wang and published by Springer Nature. This book was released on 2023-12-29 with total page 2006 pages. Available in PDF, EPUB and Kindle. Book excerpt: Written by hundreds experts who have made contributions to both enterprise and academics research, these excellent reference books provide all necessary knowledge of the whole industrial chain of integrated circuits, and cover topics related to the technology evolution trends, fabrication, applications, new materials, equipment, economy, investment, and industrial developments of integrated circuits. Especially, the coverage is broad in scope and deep enough for all kind of readers being interested in integrated circuit industry. Remarkable data collection, update marketing evaluation, enough working knowledge of integrated circuit fabrication, clear and accessible category of integrated circuit products, and good equipment insight explanation, etc. can make general readers build up a clear overview about the whole integrated circuit industry. This encyclopedia is designed as a reference book for scientists and engineers actively involved in integrated circuit research and development field. In addition, this book provides enough guide lines and knowledges to benefit enterprisers being interested in integrated circuit industry.
Author :
Publisher :
ISBN 13 :
Total Pages : 282 pages
Book Rating : 4.3/5 (91 download)
Download or read book Sci-tech News written by and published by . This book was released on 2004 with total page 282 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Materials Research Society. Meeting
Publisher :
ISBN 13 :
Total Pages : 328 pages
Book Rating : 4.3/5 (91 download)
Download or read book High-Mobility Group-IV Materials and Devices: Volume 809 written by Materials Research Society. Meeting and published by . This book was released on 2004-08-18 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book, first published in 2004, brings together researchers interested in strained SiGe, strain-relaxed buffers, strained Si on bulk Si and on SOI, SiGe on SOI, Ge substrates, and Ge on insulator.
Author : Vijay K. Varadan
Publisher : John Wiley & Sons
ISBN 13 : 0470846194
Total Pages : 406 pages
Book Rating : 4.4/5 (78 download)
Download or read book RF MEMS and Their Applications written by Vijay K. Varadan and published by John Wiley & Sons. This book was released on 2003-07-25 with total page 406 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectromechanical systems (MEMS) refer to a collection of micro-sensors and actuators, which can react to environmental change under micro- circuit control. The integration of MEMS into traditional Radio Frequency (RF) circuits has resulted in systems with superior performance levels and lower manufacturing costs. The incorporation of MEMS based fabrication technologies into micro and millimeter wave systems offers viable routes to ICs with MEMS actuators, antennas, switches and transmission lines. The resultant systems operate with an increased bandwidth and increased radiation efficiency and have considerable scope for implementation within the expanding area of wireless personal communication devices. This text provides leading edge coverage of this increasingly important area and highlights the overlapping information requirements of the RF and MEMS research and development communities. * Provides an introduction to micromachining techniques and their use in the fabrication of micro switches, capacitors and inductors * Includes coverage of MEMS devices for wireless and Bluetooth enabled systems Essential reading for RF Circuit design practitioners and researchers requiring an introduction to MEMS technologies, as well as practitioners and researchers in MEMS and silicon technology requiring an introduction to RF circuit design.
Author : Materials Research Society. Meeting
Publisher :
ISBN 13 :
Total Pages : 192 pages
Book Rating : 4.3/5 (91 download)
Download or read book Critical Interfacial Issues in Thin-Film Optoelectronic and Energy Conversion Devices: Volume 796 written by Materials Research Society. Meeting and published by . This book was released on 2004-04-09 with total page 192 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author : Materials Research Society. Meeting
Publisher :
ISBN 13 :
Total Pages : 288 pages
Book Rating : 4.3/5 (91 download)
Download or read book Biological and Bioinspired Materials and Devices written by Materials Research Society. Meeting and published by . This book was released on 2004 with total page 288 pages. Available in PDF, EPUB and Kindle. Book excerpt: The special interest afforded biological and bioinspired materials and devices lies in the fact that many biological materials, as diverse as bone and teeth and spider silk, have highly refined and sophisticated platforms of structure that are well organized at hierarchical levels spanning nanoscale to microscale measures. There is absolutely strict and precise control of materials synthesis exerted by these natural systems, and vigorous study and advancement in the fields of biomineralization, molecular biology, and DNA technology, for instance, have brought increasing understanding of such control in ever expanding fashion. This knowledge has been quickly transferred into the design and development of synthetic materials that mimic their biological counterparts. In this context, an explosion in research in the past few years has centered on the identification and synthesis of 1) unique ceramics or composites for biomaterials, magnetic and optical use, 2) self-assembled biopolymeric systems for biomaterials and biosensor application, and 3) colloidal and amphiphilic systems for relevance in biomedicine, nanotechnology, and biosensor fabrication. Therefore, new nanocrystalline composites, nanofibers, biosteel fibers, novel biosensors, distinctive drug-delivery systems, exceptional tissue engineering scaffolds, exclusive molecular imprinting matrices, and innovative photonic crystals are suddenly available. Given this backdrop, the papers in this volume involve biology, medicine, engineering, physics, chemistry, and materials science. Topics include biomineralization and the structure and mechanical, magnetic, and optical properties of biominerals; implant materials for dental, maxillofacial, orthopaedic, urological, and ophthalmic applications; tissue adhesives and cements; material degradation and implant failure; organic modification of surfaces and their biocompatibility; tissue engineering with cells and scaffolding to generate extracellular matrices for tissue regeneration; emerging technologies in tissue engineering, including application of stem cells and gene therapy; in situ and ex situ characterization techniques and imaging of biomaterials; pharmaceutical crystallization and materials for drug and gene delivery; supramolecular and biological self assembly; and structure and dynamics of organic/inorganic interfaces.
