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Material Characterization And Failure Analysis For Microelectronics Assembly Processes
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Book Synopsis Material Characterization and Failure Analysis for Microelectronics Assembly Processes by : Chien-Yi Huang
Download or read book Material Characterization and Failure Analysis for Microelectronics Assembly Processes written by Chien-Yi Huang and published by . This book was released on 2011 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Material Characterization and Failure Analysis for Microelectronics Assembly Processes.
Book Synopsis Wide Spectra of Quality Control by : Isin Akyar
Download or read book Wide Spectra of Quality Control written by Isin Akyar and published by IntechOpen. This book was released on 2011-11-09 with total page 546 pages. Available in PDF, EPUB and Kindle. Book excerpt: Quality control is a standard which certainly has become a style of living. With the improvement of technology every day, we meet new and complicated devices and methods in different fields. Quality control explains the directed use of testing to measure the achievement of a specific standard. It is the process, procedures and authority used to accept or reject all components, drug product containers, closures, in-process materials, packaging material, labeling and drug products, and the authority to review production records to assure that no errors have occurred.The quality which is supposed to be achieved is not a concept which can be controlled by easy, numerical or other means, but it is the control over the intrinsic quality of a test facility and its studies. The aim of this book is to share useful and practical knowledge about quality control in several fields with the people who want to improve their knowledge.
Book Synopsis In-line Characterization, Yield Reliability, and Failure Analysis in Microelectronics Manufacturing by :
Download or read book In-line Characterization, Yield Reliability, and Failure Analysis in Microelectronics Manufacturing written by and published by . This book was released on 2001 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Materials and Processes by : Barrie D. Dunn
Download or read book Materials and Processes written by Barrie D. Dunn and published by Springer. This book was released on 2015-12-29 with total page 677 pages. Available in PDF, EPUB and Kindle. Book excerpt: The objective of this book is to assist scientists and engineers select the ideal material or manufacturing process for particular applications; these could cover a wide range of fields, from light-weight structures to electronic hardware. The book will help in problem solving as it also presents more than 100 case studies and failure investigations from the space sector that can, by analogy, be applied to other industries. Difficult-to-find material data is included for reference. The sciences of metallic (primarily) and organic materials presented throughout the book demonstrate how they can be applied as an integral part of spacecraft product assurance schemes, which involve quality, material and processes evaluations, and the selection of mechanical and component parts. In this successor edition, which has been revised and updated, engineering problems associated with critical spacecraft hardware and the space environment are highlighted by over 500 illustrations including micrographs and fractographs. Space hardware captured by astronauts and returned to Earth from long durations in space are examined. Information detailed in the Handbook is applicable to general terrestrial applications including consumer electronics as well as high reliability systems associated with aeronautics, medical equipment and ground transportation. This Handbook is also directed to those involved in maximizing the relia bility of new materials and processes for space technology and space engineering. It will be invaluable to engineers concerned with the construction of advanced structures or mechanical and electronic sub-systems.
Book Synopsis Wide Spectra of Quality Control by : Isin Akyar
Download or read book Wide Spectra of Quality Control written by Isin Akyar and published by BoD – Books on Demand. This book was released on 2011-11-09 with total page 548 pages. Available in PDF, EPUB and Kindle. Book excerpt: Quality control is a standard which certainly has become a style of living. With the improvement of technology every day, we meet new and complicated devices and methods in different fields. Quality control explains the directed use of testing to measure the achievement of a specific standard. It is the process, procedures and authority used to accept or reject all components, drug product containers, closures, in-process materials, packaging material, labeling and drug products, and the authority to review production records to assure that no errors have occurred.The quality which is supposed to be achieved is not a concept which can be controlled by easy, numerical or other means, but it is the control over the intrinsic quality of a test facility and its studies. The aim of this book is to share useful and practical knowledge about quality control in several fields with the people who want to improve their knowledge.
Book Synopsis Microelectronics Failure Analysis by :
Download or read book Microelectronics Failure Analysis written by and published by ASM International. This book was released on 2004-01-01 with total page 813 pages. Available in PDF, EPUB and Kindle. Book excerpt: For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron
Book Synopsis Materials and Process Characterization by : Norman G. Einspruch
Download or read book Materials and Process Characterization written by Norman G. Einspruch and published by Academic Press. This book was released on 2014-12-01 with total page 614 pages. Available in PDF, EPUB and Kindle. Book excerpt: VLSI Electronics: Microstructure Science, Volume 6: Materials and Process Characterization addresses the problem of how to apply a broad range of sophisticated materials characterization tools to materials and processes used for development and production of very large scale integration (VLSI) electronics. This book discusses the various characterization techniques, such as Auger spectroscopy, secondary ion mass spectroscopy, X-ray topography, transmission electron microscopy, and spreading resistance. The systematic approach to the technologies of VLSI electronic materials and device manufacture are also considered. This volume is beneficial to materials scientists, chemists, and engineers who are commissioned with the responsibility of developing and implementing the production of materials and devices to support the VLSI era.
Book Synopsis Electronic Failure Analysis Handbook by : Perry L. Martin
Download or read book Electronic Failure Analysis Handbook written by Perry L. Martin and published by McGraw-Hill Professional Publishing. This book was released on 1999 with total page 776 pages. Available in PDF, EPUB and Kindle. Book excerpt: Annotation "In the Electronic Failure Analysis Handbook, you'll find top-to-bottom coverage of this rapidly developing field, encompassing breakthrough techniques and technologies for both components and systems reliability testing, performance evaluation, and liability avoidance."--BOOK JACKET. Title Summary field provided by Blackwell North America, Inc. All Rights Reserved.
Book Synopsis Materials Science by : Yitzhak Mastai
Download or read book Materials Science written by Yitzhak Mastai and published by BoD – Books on Demand. This book was released on 2013-06-10 with total page 563 pages. Available in PDF, EPUB and Kindle. Book excerpt: Today modern materials science is a vibrant, emerging scientific discipline at the forefront of physics, chemistry, engineering, biology and medicine, and is becoming increasingly international in scope as demonstrated by emerging international and intercontinental collaborations and exchanges. The overall purpose of this book is to provide timely and in-depth coverage of selected advanced topics in materials science. Divided into five sections, this book provides the latest research developments in many aspects of materials science. This book is of interest to both fundamental research and also to practicing scientists and will prove invaluable to all chemical engineers, industrial chemists and students in industry and academia.
Book Synopsis Microelectronic Failure Analysis Desk Reference by :
Download or read book Microelectronic Failure Analysis Desk Reference written by and published by ASM International. This book was released on 2001-01-01 with total page 162 pages. Available in PDF, EPUB and Kindle. Book excerpt: Developed by the Electronic Device Failure Analysis Society (EDFAS) Publications Committee.
Book Synopsis Microelectronics Failure Analysis by : EDFAS Desk Reference Committee
Download or read book Microelectronics Failure Analysis written by EDFAS Desk Reference Committee and published by ASM International. This book was released on 2011 with total page 673 pages. Available in PDF, EPUB and Kindle. Book excerpt: Includes bibliographical references and index.
Book Synopsis Materials Characterization by : Ramiro Pérez Campos
Download or read book Materials Characterization written by Ramiro Pérez Campos and published by Springer. This book was released on 2015-04-27 with total page 219 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers novel research results for process and techniques of materials characterization for a wide range of materials. The authors provide a comprehensive overview of the aspects of structural and chemical characterization of these materials. The articles contained in this book covers state of the art and experimental techniques commonly used in modern materials characterization. The book includes theoretical models and numerous illustrations of structural and chemical characterization properties.
Book Synopsis Microelectronic Failure Analysis by :
Download or read book Microelectronic Failure Analysis written by and published by ASM International. This book was released on 2002-01-01 with total page 160 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides new or expanded coverage on the latest techniques for microelectronic failure analysis. The CD-ROM includes the complete content of the book in fully searchable Adobe Acrobat format. Developed by the Electronic Device Failure Analysis Society (EDFAS) Publications Committee
Book Synopsis Modeling and Simulation for Microelectronic Packaging Assembly by : Shen Liu
Download or read book Modeling and Simulation for Microelectronic Packaging Assembly written by Shen Liu and published by John Wiley & Sons. This book was released on 2011-08-24 with total page 586 pages. Available in PDF, EPUB and Kindle. Book excerpt: Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging
Book Synopsis 3D Microelectronic Packaging by : Yan Li
Download or read book 3D Microelectronic Packaging written by Yan Li and published by Springer Nature. This book was released on 2020-11-23 with total page 629 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
Book Synopsis Microelectronics Processing by : L. A. Casper
Download or read book Microelectronics Processing written by L. A. Casper and published by . This book was released on 1986 with total page 464 pages. Available in PDF, EPUB and Kindle. Book excerpt: Examines leading-edge developments in the field of materials development. Covers all major aspects of materials science, with applications to many high technology areas. Explores the role of chemistry in high-tech materials and their applications.
Book Synopsis In-line Characterization, Yield Reliability, and Failure Analysis in Microelectronics Manufacturing by : European Optical Society
Download or read book In-line Characterization, Yield Reliability, and Failure Analysis in Microelectronics Manufacturing written by European Optical Society and published by Society of Photo Optical. This book was released on 1999 with total page 344 pages. Available in PDF, EPUB and Kindle. Book excerpt:
