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Liquid Cooling Of Electronic Devices By Single Phase Convection
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Book Synopsis Liquid Cooling of Electronic Devices by Single-Phase Convection by : Frank P. Incropera
Download or read book Liquid Cooling of Electronic Devices by Single-Phase Convection written by Frank P. Incropera and published by Wiley-Interscience. This book was released on 1999-05-31 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Channeling or controlling the heat generated by electronics products is a vital concern of product developers: fail to confront this issue and the chances of product failure escalate. This third book in the series explores yet another method of heat management-the use of liquids to absorb and remove heat away from vital parts of the electronic systems.
Book Synopsis Embedded Cooling Of Electronic Devices: Conduction, Evaporation, And Single- And Two-phase Convection by : Madhusudan Iyengar
Download or read book Embedded Cooling Of Electronic Devices: Conduction, Evaporation, And Single- And Two-phase Convection written by Madhusudan Iyengar and published by World Scientific. This book was released on 2024-01-10 with total page 479 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues.The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics.This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required.
Book Synopsis Cooling of Electronic Systems by : Sadik Kakaç
Download or read book Cooling of Electronic Systems written by Sadik Kakaç and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 953 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.
Book Synopsis Electronics Cooling by : S. M. Sohel Murshed
Download or read book Electronics Cooling written by S. M. Sohel Murshed and published by BoD – Books on Demand. This book was released on 2016-06-15 with total page 184 pages. Available in PDF, EPUB and Kindle. Book excerpt: Featuring contributions from the renowned researchers and academicians in the field, this book covers key conventional and emerging cooling techniques and coolants for electronics cooling. It includes following thematic topics: - Cooling approaches and coolants - Boiling and phase change-based technologies - Heat pipes-based cooling - Microchannels cooling systems - Heat loop cooling technology - Nanofluids as coolants - Theoretical development for the junction temperature of package chips. This book is intended to be a reference source and guide to researchers, engineers, postgraduate students, and academicians in the fields of thermal management and cooling technologies as well as for people in the electronics and semiconductors industries.
Book Synopsis Air Cooling Technology for Electronic Equipment by : Sung Jin Kim
Download or read book Air Cooling Technology for Electronic Equipment written by Sung Jin Kim and published by CRC Press. This book was released on 2020-07-24 with total page 264 pages. Available in PDF, EPUB and Kindle. Book excerpt: Clear your bookcase of references containing bits and pieces of useful information and replace them with this thorough, single-volume guide to thermal analysis. Air Cooling Technology for Electronic Equipment is a helpful, practical resource that answers questions frequently asked by thermal and packaging engineers grappling with today's demand for increased thermal control in electronics. Superbly organized for quick reference, the book dedicates each chapter to answering fundamental questions, such as: What is the optimal spacing between the printed circuit boards? What is a good estimate of the heat transfer coefficient and the associate pressure drop for forced convection over package arrays? How are heat transfer and fluid flow characteristics in the entrance region different from those in the fully developed region? What is the effect of substrate conduction on convection cooling? The chapters, written by engineers and engineering educators who are experts in electronic cooling, are packed with details and present the latest developments in air cooling techniques and thermal design guidelines. They provide problem-solving analyses that are jargon-free, straightforward, and easy to understand. Air Cooling Technology for Electronic Equipment is a handy source of technical information for anyone who wants to get the most out of air cooling.
Book Synopsis Cooling of Electronic Equipment by : Allan W. Scott
Download or read book Cooling of Electronic Equipment written by Allan W. Scott and published by Wiley-Interscience. This book was released on 1974 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Cooling of Microelectronic and Nanoelectronic Equipment by : Madhusudan Iyengar
Download or read book Cooling of Microelectronic and Nanoelectronic Equipment written by Madhusudan Iyengar and published by World Scientific. This book was released on 2014-08-25 with total page 472 pages. Available in PDF, EPUB and Kindle. Book excerpt: To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting. This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging. Contents:A Review of Cooling Road Maps for 3D Chip Packages (Dereje Agonafer)Thermal Performance Mapping of Direct Liquid Cooled 3D Chip Stacks (Karl J L Geisler and Avram Bar-Cohen)Dynamic Thermal Management Considering Accurate Temperature-Leakage Interdependency (Bing Shi and Ankur Srivastava)Energy Reduction and Performance Maximization Through Improved Cooling (David Copeland)Optimal Choice of Heat Sinks from an Industrial Point of View (Clemens J M Lasance)Synthetic Jets for Heat Transfer Augmentation in Microelectronics Systems (Mehmet Arik and Enes Tamdogan)Recent Advance in Thermoelectric Devices for Electronics Cooling (Peng Wang)Energy Efficient Solid-State Cooling for Hot Spot Removal (Kazuaki Yazawa, Andrei Fedorov, Yogendra Joshi and Ali Shakouri)An Overview of the Use of Phase Change Materials for the Thermal Management of Transient Portable Electronics: Benefits and Challenges (Amy S Fleischer)Estimation of Cooling Performance of Phase Change Material (PCM) Module (Masaru Ishizuka and Tomoyuki Hatakeyama)Optimization Under Uncertainty for Electronics Cooling Design (Karthik K Bodla, Jayathi Y Murthy and Suresh V Garimella)Hydrophilic CNT-Sintered Copper Composite Wick for Enhanced Cooling (Glen A Powell, Anuradha Bulusu, Justin A Weibel, Sungwon S Kim, Suresh V Garimella and Timothy S Fisher)A Cabinet Level Thermal Test Vehicle to Evaluate Hybrid Double-Sided Cooling Schemes (Qihong Nie and Yogendra Joshi)Energy Efficiency and Reliability Risk Mitigation of Data Centers Through Prognostics and Health Management (Jun Dai, Michael Ohadi and Michael Pecht)Damage Pre-Cursors Based Assessment of Accrued Thermomechanical Damage and Remaining Useful Life in Field Deployed Electronics (Pradeep Lall, Mahendra Harsha, Kai Goebel and Jim Jones)Towards Embedded Cooling — Gen 3 Thermal Packaging Technology (Avram Bar-Cohen) Readership: Researchers, practitioners, and postgraduates in mechanical engineering, nanoelectronics, computer engineering, and electrical & electronic engineering. Keywords:Electronics Cooling;Electronics Packaging;Thermal Management;Thermal Sciences;Electronics Reliability;Thermoelectrics;Computational Heat Transfer;Liquid Cooling
Book Synopsis Guide Manual of Cooling Methods for Electronic Equipment by : Cornell Aeronautical Laboratory
Download or read book Guide Manual of Cooling Methods for Electronic Equipment written by Cornell Aeronautical Laboratory and published by . This book was released on 1956 with total page 220 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Heat Transfer Handbook by : Adrian Bejan
Download or read book Heat Transfer Handbook written by Adrian Bejan and published by John Wiley & Sons. This book was released on 2003-06-30 with total page 1496 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chapters contributed by thirty world-renown experts. * Covers all aspects of heat transfer, including micro-scale and heat transfer in electronic equipment. * An associated Web site offers computer formulations on thermophysical properties that provide the most up-to-date values.
Book Synopsis Qpedia Thermal Management – Electronics Cooling Book, Volume 2 by : Advanced Thermal Solutions
Download or read book Qpedia Thermal Management – Electronics Cooling Book, Volume 2 written by Advanced Thermal Solutions and published by Advanced Thermal Solutions. This book was released on 2008 with total page 206 pages. Available in PDF, EPUB and Kindle. Book excerpt: The complete editorial contents of Qpedia Thermal eMagazine, Volume 2, Issues 1 - 12 features in-depth, technical articles on the most critical topics in the thermal management of electronics.
Book Synopsis The Engineering Handbook by : Richard C. Dorf
Download or read book The Engineering Handbook written by Richard C. Dorf and published by CRC Press. This book was released on 2018-10-03 with total page 3080 pages. Available in PDF, EPUB and Kindle. Book excerpt: First published in 1995, The Engineering Handbook quickly became the definitive engineering reference. Although it remains a bestseller, the many advances realized in traditional engineering fields along with the emergence and rapid growth of fields such as biomedical engineering, computer engineering, and nanotechnology mean that the time has come to bring this standard-setting reference up to date. New in the Second Edition 19 completely new chapters addressing important topics in bioinstrumentation, control systems, nanotechnology, image and signal processing, electronics, environmental systems, structural systems 131 chapters fully revised and updated Expanded lists of engineering associations and societies The Engineering Handbook, Second Edition is designed to enlighten experts in areas outside their own specialties, to refresh the knowledge of mature practitioners, and to educate engineering novices. Whether you work in industry, government, or academia, this is simply the best, most useful engineering reference you can have in your personal, office, or institutional library.
Book Synopsis Fluid Flow, Heat Transfer and Boiling in Micro-Channels by : L. P. Yarin
Download or read book Fluid Flow, Heat Transfer and Boiling in Micro-Channels written by L. P. Yarin and published by Springer Science & Business Media. This book was released on 2008-09-19 with total page 487 pages. Available in PDF, EPUB and Kindle. Book excerpt: The subject of the book is uid dynamics and heat transfer in micro-channels. This problem is important for understanding the complex phenomena associated with single- and two-phase ows in heated micro-channels. The challenge posed by high heat uxes in electronic chips makes thermal management a key factor in the development of these systems. Cooling of mic- electronic components by new cooling technologies, as well as improvement of the existing ones, is becoming a necessity as the power dissipation levels of integrated circuits increases and their sizes decrease. Miniature heat sinks with liquid ows in silicon wafers could signi cantly improve the performance and reliability of se- conductor devices. The improvements are made by increasing the effective thermal conductivity, by reducing the temperature gradient across the wafer, by reducing the maximum wafer temperature, and also by reducing the number and intensity of localized hot spots. A possible way to enhance heat transfer in systems with high power density is to change the phase in the micro-channels embedded in the device. This has motivated a number of theoretical and experimental investigations covering various aspects of heat transfer in micro-channel heat sinks with phase change. The ow and heat transfer in heated micro-channels are accompanied by a n- ber of thermohydrodynamic processes, such as liquid heating and vaporization, bo- ing, formation of two-phase mixtures with a very complicated inner structure, etc., which affect signi cantly the hydrodynamic and thermal characteristics of the co- ing systems.
Book Synopsis Nanotechnology Applications for Solar Energy Systems by : Mohsen Sheikholeslami
Download or read book Nanotechnology Applications for Solar Energy Systems written by Mohsen Sheikholeslami and published by John Wiley & Sons. This book was released on 2023-03-28 with total page 452 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nanotechnology Applications for Solar Energy Systems Understand the latest developments in solar nanotechnology with this comprehensive guide Solar energy has never seemed a more critical component of humanity’s future. As global researchers and industries work to develop sustainable technologies and energy sources worldwide, the need to increase efficiency and decrease costs becomes paramount. Nanotechnology has the potential to play a considerable role in meeting these challenges, leading to the development of solar energy systems that overcome the limitations of existing technologies. Nanotechnology Applications for Solar Energy Systems is a comprehensive guide to the latest technological advancements and applications of nanotechnology in the field of solar energy. It analyzes nanotechnology applications across a full range of solar energy systems, reviewing feasible technological advancements for enhanced performance of solar energy devices, and discussing emerging nanomaterials such as graphene and graphene derivatives. Nanotechnology Applications for Solar Energy Systems readers will also find: Detailed treatment of nanotechnology applications in systems including solar concentrating collectors, linear Fresnel reflectors, parabolic trough collectors, and more Coverage of methods to enhance the performance of solar energy devices including solar ponds and solar steam generators A comprehensive review of nanomaterials classification and the properties of nanomaterials in heat transfer and efficiency enhancement Nanotechnology Applications for Solar Energy Systems is critical for researchers in fields related to solar energy, engineers and industry professionals developing solar technology, and academics working in related fields such as chemistry, physics, materials science, and electrical engineering.
Book Synopsis Thermal Management Materials for Electronic Packaging by : Xingyou Tian
Download or read book Thermal Management Materials for Electronic Packaging written by Xingyou Tian and published by John Wiley & Sons. This book was released on 2023-12-12 with total page 373 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thermal Management Materials for Electronic Packaging Practical resource exploring the theoretical and experimental basis as well as solutions for the development of new thermal management materials for electronic packaging Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices provides in-depth and systematic summaries on cutting-edge thermal management materials for high-power density electronic devices, introducing the preparation methods and application scenarios of thermal management materials for electronic packing, covering refinements of thermal conductivity theory and performance prediction models for multiphase composites, and overall focusing on key scientific issues related to the subject, such as the internal interface of new high thermal conductive substrate materials and the mechanism of spatial topology on performance. The text also discusses key issues on the design and preparation of thermal conductive substrate materials with high thermal conductive properties, including their characterization, properties, and manipulation, as well as the latest methods, techniques, and applications in this rapidly developing area. Sample topics covered in Thermal Management Materials for Electronic Packaging include: Basic concepts and laws of thermal conduction, heat conduction differential equation and finite solution, and thermal conductivity of solids Definition and classification of electronic packaging, thermal management in electronic equipment, and requirements of electronic packaging materials Synthesis and surface modification of high thermal conductive filler and the synthesis of substrates and preparation of thermal conductive composites with inorganic ceramic skeleton structure Assembly of thermal conductive materials in different dimensions and preparation of composite materials, and reliability analysis and environmental performance evaluation Thermal Management Materials for Electronic Packaging serves as an ideal reference for researchers and workers in related fields to significantly improve the mechanical and thermal management properties of materials, expand the material selection and design margin of substrates, and develop substrates that meet the application needs of different gradients.
Book Synopsis Design and Optimization of Thermal Systems, Third Edition by : Yogesh Jaluria
Download or read book Design and Optimization of Thermal Systems, Third Edition written by Yogesh Jaluria and published by CRC Press. This book was released on 2019-09-06 with total page 592 pages. Available in PDF, EPUB and Kindle. Book excerpt: Design and Optimization of Thermal Systems, Third Edition: with MATLAB® Applications provides systematic and efficient approaches to the design of thermal systems, which are of interest in a wide range of applications. It presents basic concepts and procedures for conceptual design, problem formulation, modeling, simulation, design evaluation, achieving feasible design, and optimization. Emphasizing modeling and simulation, with experimentation for physical insight and model validation, the third edition covers the areas of material selection, manufacturability, economic aspects, sensitivity, genetic and gradient search methods, knowledge-based design methodology, uncertainty, and other aspects that arise in practical situations. This edition features many new and revised examples and problems from diverse application areas and more extensive coverage of analysis and simulation with MATLAB®.
Book Synopsis Thermal Design of Electronic Equipment by : Ralph Remsburg
Download or read book Thermal Design of Electronic Equipment written by Ralph Remsburg and published by CRC Press. This book was released on 2017-12-19 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt: In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.
Book Synopsis Multiphysics Simulation by : Ercan M. Dede
Download or read book Multiphysics Simulation written by Ercan M. Dede and published by Springer. This book was released on 2014-05-28 with total page 225 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book highlights a unique combination of numerical tools and strategies for handling the challenges of multiphysics simulation, with a specific focus on electromechanical systems as the target application. Features: introduces the concept of design via simulation, along with the role of multiphysics simulation in today’s engineering environment; discusses the importance of structural optimization techniques in the design and development of electromechanical systems; provides an overview of the physics commonly involved with electromechanical systems for applications such as electronics, magnetic components, RF components, actuators, and motors; reviews the governing equations for the simulation of related multiphysics problems; outlines relevant (topology and parametric size) optimization methods for electromechanical systems; describes in detail several multiphysics simulation and optimization example studies in both two and three dimensions, with sample numerical code.
