Read Books Online and Download eBooks, EPub, PDF, Mobi, Kindle, Text Full Free.
Download Istfa 2012 full books in PDF, epub, and Kindle. Read online Istfa 2012 ebook anywhere anytime directly on your device. Fast Download speed and no annoying ads. We cannot guarantee that every ebooks is available!
Author : ASM International
Publisher : ASM International
ISBN 13 : 1615039953
Total Pages : 643 pages
Book Rating : 4.6/5 (15 download)
Download or read book ISTFA 2012 written by ASM International and published by ASM International. This book was released on 2012 with total page 643 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher : ASM International
ISBN 13 : 1615038507
Total Pages : 479 pages
Book Rating : 4.6/5 (15 download)
Download or read book ISTFA 2011 written by and published by ASM International. This book was released on 2011 with total page 479 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : A. S. M. International
Publisher : ASM International
ISBN 13 : 1627080228
Total Pages : 634 pages
Book Rating : 4.6/5 (27 download)
Download or read book ISTFA 2013 written by A. S. M. International and published by ASM International. This book was released on 2013-01-01 with total page 634 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures.
Author : A. S. M. International
Publisher : ASM International
ISBN 13 : 1627080740
Total Pages : 561 pages
Book Rating : 4.6/5 (27 download)
Download or read book ISTFA 2014 written by A. S. M. International and published by ASM International. This book was released on 2014-11-01 with total page 561 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers address the symposium's theme, Exploring the Many Facets of Failure Analysis.
Author :
Publisher : ASM International
ISBN 13 : 1627082735
Total Pages : 540 pages
Book Rating : 4.6/5 (27 download)
Download or read book ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis written by and published by ASM International. This book was released on 2019-12-01 with total page 540 pages. Available in PDF, EPUB and Kindle. Book excerpt: The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Author :
Publisher : ASM International
ISBN 13 : 1627081518
Total Pages : pages
Book Rating : 4.6/5 (27 download)
Download or read book ISTFA 2017: Proceedings from the 43rd International Symposium for Testing and Failure Analysis written by and published by ASM International. This book was released on 2017-12-01 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.
Author :
Publisher : ASM International
ISBN 13 : 1627080996
Total Pages : pages
Book Rating : 4.6/5 (27 download)
Download or read book ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis written by and published by ASM International. This book was released on 2018-12-01 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.
Author : Tejinder Gandhi
Publisher : ASM International
ISBN 13 : 1627082468
Total Pages : 750 pages
Book Rating : 4.6/5 (27 download)
Download or read book Microelectronics Fialure Analysis Desk Reference, Seventh Edition written by Tejinder Gandhi and published by ASM International. This book was released on 2019-11-01 with total page 750 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.
Author : Yan Li
Publisher : Springer Nature
ISBN 13 : 9811570906
Total Pages : 629 pages
Book Rating : 4.8/5 (115 download)
Download or read book 3D Microelectronic Packaging written by Yan Li and published by Springer Nature. This book was released on 2020-11-23 with total page 629 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
Author :
Publisher :
ISBN 13 : 9781680155129
Total Pages : 620 pages
Book Rating : 4.1/5 (551 download)
Download or read book ISTFA 2012 written by and published by . This book was released on 2012 with total page 620 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Gregor Hlawacek
Publisher : Springer
ISBN 13 : 3319419900
Total Pages : 526 pages
Book Rating : 4.3/5 (194 download)
Download or read book Helium Ion Microscopy written by Gregor Hlawacek and published by Springer. This book was released on 2016-10-04 with total page 526 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers the fundamentals of Helium Ion Microscopy (HIM) including the Gas Field Ion Source (GFIS), column and contrast formation. It also provides first hand information on nanofabrication and high resolution imaging. Relevant theoretical models and the existing simulation approaches are discussed in an extra section. The structure of the book allows the novice to get acquainted with the specifics of the technique needed to understand the more applied chapters in the second half of the volume. The expert reader will find a complete reference of the technique covering all important applications in several chapters written by the leading experts in the field. This includes imaging of biological samples, resist and precursor based nanofabrication, applications in semiconductor industry, using Helium as well as Neon and many more. The fundamental part allows the regular HIM user to deepen his understanding of the method. A final chapter by Bill Ward, one of the pioneers of HIM, covering the historical developments leading to the existing tool complements the content.
Author : Zhiyong Ma
Publisher : CRC Press
ISBN 13 : 135173394X
Total Pages : 843 pages
Book Rating : 4.3/5 (517 download)
Download or read book Metrology and Diagnostic Techniques for Nanoelectronics written by Zhiyong Ma and published by CRC Press. This book was released on 2017-03-27 with total page 843 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nanoelectronics is changing the way the world communicates, and is transforming our daily lives. Continuing Moore’s law and miniaturization of low-power semiconductor chips with ever-increasing functionality have been relentlessly driving R&D of new devices, materials, and process capabilities to meet performance, power, and cost requirements. This book covers up-to-date advances in research and industry practices in nanometrology, critical for continuing technology scaling and product innovation. It holistically approaches the subject matter and addresses emerging and important topics in semiconductor R&D and manufacturing. It is a complete guide for metrology and diagnostic techniques essential for process technology, electronics packaging, and product development and debugging—a unique approach compared to other books. The authors are from academia, government labs, and industry and have vast experience and expertise in the topics presented. The book is intended for all those involved in IC manufacturing and nanoelectronics and for those studying nanoelectronics process and assembly technologies or working in device testing, characterization, and diagnostic techniques.
Author : Yan Li
Publisher : Springer Nature
ISBN 13 : 9811950539
Total Pages : 628 pages
Book Rating : 4.8/5 (119 download)
Download or read book Advanced Driver Assistance Systems and Autonomous Vehicles written by Yan Li and published by Springer Nature. This book was released on 2022-10-28 with total page 628 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive reference for both academia and industry on the fundamentals, technology details, and applications of Advanced Driver-Assistance Systems (ADAS) and autonomous driving, an emerging and rapidly growing area. The book written by experts covers the most recent research results and industry progress in the following areas: ADAS system design and test methodologies, advanced materials, modern automotive technologies, artificial intelligence, reliability concerns, and failure analysis in ADAS. Numerous images, tables, and didactic schematics are included throughout. This essential book equips readers with an in-depth understanding of all aspects of ADAS, providing insights into key areas for future research and development. • Provides comprehensive coverage of the state-of-the-art in ADAS • Covers advanced materials, deep learning, quality and reliability concerns, and fault isolation and failure analysis • Discusses ADAS system design and test methodologies, novel automotive technologies • Features contributions from both academic and industry authors, for a complete view of this important technology
Author : Umberto Celano
Publisher : Springer
ISBN 13 : 3030156125
Total Pages : 408 pages
Book Rating : 4.0/5 (31 download)
Download or read book Electrical Atomic Force Microscopy for Nanoelectronics written by Umberto Celano and published by Springer. This book was released on 2019-08-01 with total page 408 pages. Available in PDF, EPUB and Kindle. Book excerpt: The tremendous impact of electronic devices on our lives is the result of continuous improvements of the billions of nanoelectronic components inside integrated circuits (ICs). However, ultra-scaled semiconductor devices require nanometer control of the many parameters essential for their fabrication. Through the years, this created a strong alliance between microscopy techniques and IC manufacturing. This book reviews the latest progress in IC devices, with emphasis on the impact of electrical atomic force microscopy (AFM) techniques for their development. The operation principles of many techniques are introduced, and the associated metrology challenges described. Blending the expertise of industrial specialists and academic researchers, the chapters are dedicated to various AFM methods and their impact on the development of emerging nanoelectronic devices. The goal is to introduce the major electrical AFM methods, following the journey that has seen our lives changed by the advent of ubiquitous nanoelectronics devices, and has extended our capability to sense matter on a scale previously inaccessible.
Author : Xiong Du
Publisher : Springer Nature
ISBN 13 : 9811931321
Total Pages : 184 pages
Book Rating : 4.8/5 (119 download)
Download or read book Thermal Reliability of Power Semiconductor Device in the Renewable Energy System written by Xiong Du and published by Springer Nature. This book was released on 2022-07-08 with total page 184 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device.
Author :
Publisher : ASM International
ISBN 13 : 0871708043
Total Pages : 813 pages
Book Rating : 4.8/5 (717 download)
Download or read book Microelectronics Failure Analysis written by and published by ASM International. This book was released on 2004-01-01 with total page 813 pages. Available in PDF, EPUB and Kindle. Book excerpt: For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron
Author : Mark Tehranipoor
Publisher : Springer Nature
ISBN 13 : 3030644480
Total Pages : 602 pages
Book Rating : 4.0/5 (36 download)
Download or read book Emerging Topics in Hardware Security written by Mark Tehranipoor and published by Springer Nature. This book was released on 2021-04-30 with total page 602 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides an overview of emerging topics in the field of hardware security, such as artificial intelligence and quantum computing, and highlights how these technologies can be leveraged to secure hardware and assure electronics supply chains. The authors are experts in emerging technologies, traditional hardware design, and hardware security and trust. Readers will gain a comprehensive understanding of hardware security problems and how to overcome them through an efficient combination of conventional approaches and emerging technologies, enabling them to design secure, reliable, and trustworthy hardware.
