IPC Printed Circuits Expo '99

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ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (595 download)

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Book Synopsis IPC Printed Circuits Expo '99 by : Institute of Printed Circuits

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Proceedings of the Technical Conference

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Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (793 download)

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Book Synopsis Proceedings of the Technical Conference by : Institute for Interconnecting and Packaging Electronic Circuits (Northbrook, Ill.)

Download or read book Proceedings of the Technical Conference written by Institute for Interconnecting and Packaging Electronic Circuits (Northbrook, Ill.) and published by . This book was released on 1999 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics

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Publisher : The Electrochemical Society
ISBN 13 : 9781566772945
Total Pages : 262 pages
Book Rating : 4.7/5 (729 download)

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Book Synopsis Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics by : G. S. Mathad

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Machine Design

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Publisher :
ISBN 13 :
Total Pages : 956 pages
Book Rating : 4.:/5 (318 download)

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Book Synopsis Machine Design by :

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Handbook of Lead-Free Solder Technology for Microelectronic Assemblies

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Publisher : CRC Press
ISBN 13 : 0203021487
Total Pages : 1044 pages
Book Rating : 4.2/5 (3 download)

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Book Synopsis Handbook of Lead-Free Solder Technology for Microelectronic Assemblies by : Karl J. Puttlitz

Download or read book Handbook of Lead-Free Solder Technology for Microelectronic Assemblies written by Karl J. Puttlitz and published by CRC Press. This book was released on 2004-02-27 with total page 1044 pages. Available in PDF, EPUB and Kindle. Book excerpt: This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specif

Microvias

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Publisher : McGraw Hill Professional
ISBN 13 : 0071500472
Total Pages : 595 pages
Book Rating : 4.0/5 (715 download)

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Book Synopsis Microvias by : John H. Lau

Download or read book Microvias written by John H. Lau and published by McGraw Hill Professional. This book was released on 2001-04-26 with total page 595 pages. Available in PDF, EPUB and Kindle. Book excerpt: State-of-the-art introduction to high-density interconnect technology The first-ever book on this hot topic, Microvias: Low Cost, High Density Interconnects gives you a thorough look at the technology that’s changing the nature of printed circuit boards--and driving the mobile electronic revolution. A "must" for electronics and mechanical engineers, John Lau and Ricky Lee’s intensive introduction to microvia technology expertly covers all major techniques. You get important details on mechanical NC drilling, laser drilling, photo-defined, chemical and plasma etching, and conductive ink formation. You also get a survey of the work of leading companies and their products, including Canon, Compaq, Fujitsu Limited, Gore, Hitachi Chemical Co., Ibiden, IBM, JCI, JVC, K&S (X-Lam), Kyocera/JME, Matsushita, Mitsubishi, NEC, Samsung, Sheldahl, Shinko, Toshiba.

Microelectronics Failure Analysis

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Publisher : ASM International
ISBN 13 : 1615037268
Total Pages : 673 pages
Book Rating : 4.6/5 (15 download)

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Book Synopsis Microelectronics Failure Analysis by : EDFAS Desk Reference Committee

Download or read book Microelectronics Failure Analysis written by EDFAS Desk Reference Committee and published by ASM International. This book was released on 2011 with total page 673 pages. Available in PDF, EPUB and Kindle. Book excerpt: Includes bibliographical references and index.

Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment : 2001 IEEE ISEE

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ISBN 13 :
Total Pages : 332 pages
Book Rating : 4.E/5 ( download)

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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

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Publisher : Springer Science & Business Media
ISBN 13 : 0387329897
Total Pages : 1471 pages
Book Rating : 4.3/5 (873 download)

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Book Synopsis Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging by : Ephraim Suhir

Download or read book Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging written by Ephraim Suhir and published by Springer Science & Business Media. This book was released on 2007-05-26 with total page 1471 pages. Available in PDF, EPUB and Kindle. Book excerpt: This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.

Microelectronics Failure Analysis

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Publisher : ASM International
ISBN 13 : 0871708043
Total Pages : 813 pages
Book Rating : 4.8/5 (717 download)

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Download or read book Microelectronics Failure Analysis written by and published by ASM International. This book was released on 2004-01-01 with total page 813 pages. Available in PDF, EPUB and Kindle. Book excerpt: For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron

Proceedings

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Publisher :
ISBN 13 :
Total Pages : 1220 pages
Book Rating : 4.0/5 ( download)

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Download or read book Proceedings written by and published by . This book was released on 2004 with total page 1220 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Computers and the Environment: Understanding and Managing their Impacts

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Publisher : Springer Science & Business Media
ISBN 13 : 9401000336
Total Pages : 306 pages
Book Rating : 4.4/5 (1 download)

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Book Synopsis Computers and the Environment: Understanding and Managing their Impacts by : R. Kuehr

Download or read book Computers and the Environment: Understanding and Managing their Impacts written by R. Kuehr and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 306 pages. Available in PDF, EPUB and Kindle. Book excerpt: Personal computers have made life convenient in many ways, but what about their impacts on the environment due to production, use and disposal? Manufacturing computers requires prodigious quantities of fossil fuels, toxic chemicals and water. Rapid improvements in performance mean we often buy a new machine every 1-3 years, which adds up to mountains of waste computers. How should societies respond to manage these environmental impacts? This volume addresses the environmental impacts and management of computers through a set of analyses on issues ranging from environmental assessment, technologies for recycling, consumer behaviour, strategies of computer manufacturing firms, and government policies. One conclusion is that extending the lifespan of computers (e.g. through reselling) is an environmentally and economically effective strategy that deserves more attention from governments, firms and the general public.

Advanced Millimeter-wave Technologies

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Publisher : John Wiley & Sons
ISBN 13 : 9780470742952
Total Pages : 850 pages
Book Rating : 4.7/5 (429 download)

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Book Synopsis Advanced Millimeter-wave Technologies by : Duixian Liu

Download or read book Advanced Millimeter-wave Technologies written by Duixian Liu and published by John Wiley & Sons. This book was released on 2009-03-03 with total page 850 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explains one of the hottest topics in wireless and electronic devices community, namely the wireless communication at mmWave frequencies, especially at the 60 GHz ISM band. It provides the reader with knowledge and techniques for mmWave antenna design, evaluation, antenna and chip packaging. Addresses practical engineering issues such as RF material evaluation and selection, antenna and packaging requirements, manufacturing tolerances, antenna and system interconnections, and antenna One of the first books to discuss the emerging research and application areas, particularly chip packages with integrated antennas, wafer scale mmWave phased arrays and imaging Contains a good number of case studies to aid understanding Provides the antenna and packaging technologies for the latest and emerging applications with the emphases on antenna integrations for practical applications such as wireless USB, wireless video, phase array, automobile collision avoidance radar, and imaging

Lead-Free Solder Interconnect Reliability

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Publisher : ASM International
ISBN 13 : 161503093X
Total Pages : 292 pages
Book Rating : 4.6/5 (15 download)

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Book Synopsis Lead-Free Solder Interconnect Reliability by : Dongkai Shangguan

Download or read book Lead-Free Solder Interconnect Reliability written by Dongkai Shangguan and published by ASM International. This book was released on 2005 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Noise Coupling in System-on-Chip

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Publisher : CRC Press
ISBN 13 : 1351642782
Total Pages : 555 pages
Book Rating : 4.3/5 (516 download)

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Book Synopsis Noise Coupling in System-on-Chip by : Thomas Noulis

Download or read book Noise Coupling in System-on-Chip written by Thomas Noulis and published by CRC Press. This book was released on 2018-01-09 with total page 555 pages. Available in PDF, EPUB and Kindle. Book excerpt: Noise Coupling is the root-cause of the majority of Systems on Chip (SoC) product fails. The book discusses a breakthrough substrate coupling analysis flow and modelling toolset, addressing the needs of the design community. The flow provides capability to analyze noise components, propagating through the substrate, the parasitic interconnects and the package. Using this book, the reader can analyze and avoid complex noise coupling that degrades RF and mixed signal design performance, while reducing the need for conservative design practices. With chapters written by leading international experts in the field, novel methodologies are provided to identify noise coupling in silicon. It additionally features case studies that can be found in any modern CMOS SoC product for mobile communications, automotive applications and readout front ends.

Op Amp Applications

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ISBN 13 :
Total Pages : 976 pages
Book Rating : 4.X/5 (4 download)

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Book Synopsis Op Amp Applications by : Walter G. Jung

Download or read book Op Amp Applications written by Walter G. Jung and published by . This book was released on 2002 with total page 976 pages. Available in PDF, EPUB and Kindle. Book excerpt: Operational amplifier applications, principles, and history

Electronic Packaging and Production

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Publisher :
ISBN 13 :
Total Pages : 738 pages
Book Rating : 4.:/5 (31 download)

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Download or read book Electronic Packaging and Production written by and published by . This book was released on 1995 with total page 738 pages. Available in PDF, EPUB and Kindle. Book excerpt: