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International Symposium For Testing And Failure Analysis 1989
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Book Synopsis Failure Analysis of Integrated Circuits by : Lawrence C. Wagner
Download or read book Failure Analysis of Integrated Circuits written by Lawrence C. Wagner and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 256 pages. Available in PDF, EPUB and Kindle. Book excerpt: This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.
Book Synopsis Future Energy Conferences and Symposia by :
Download or read book Future Energy Conferences and Symposia written by and published by . This book was released on 1989 with total page 838 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Microelectronics Failure Analysis by : EDFAS Desk Reference Committee
Download or read book Microelectronics Failure Analysis written by EDFAS Desk Reference Committee and published by ASM International. This book was released on 2011 with total page 673 pages. Available in PDF, EPUB and Kindle. Book excerpt: Includes bibliographical references and index.
Book Synopsis Microelectronics Fialure Analysis Desk Reference, Seventh Edition by : Tejinder Gandhi
Download or read book Microelectronics Fialure Analysis Desk Reference, Seventh Edition written by Tejinder Gandhi and published by ASM International. This book was released on 2019-11-01 with total page 719 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.
Book Synopsis Microelectronics Failure Analysis by :
Download or read book Microelectronics Failure Analysis written by and published by ASM International. This book was released on 2004-01-01 with total page 813 pages. Available in PDF, EPUB and Kindle. Book excerpt: For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron
Book Synopsis Scientific and Technical Aerospace Reports by :
Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1992 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Cyclic Deformation, Fracture, and Nondestructive Evaluation of Advanced Materials by : Michael R. Mitchell
Download or read book Cyclic Deformation, Fracture, and Nondestructive Evaluation of Advanced Materials written by Michael R. Mitchell and published by ASTM International. This book was released on 1994 with total page 405 pages. Available in PDF, EPUB and Kindle. Book excerpt: Examines the initiation and growth of fatigue cracks and the fracture toughness of advanced materials such as silicon nitride, special alloys and steels, thermoplastics, and graphite-epoxy composites; and explains several non-destructive techniques to evaluate such materials for manufacturing defect
Download or read book Energy Research Abstracts written by and published by . This book was released on 1992-02 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Defect Oriented Testing for CMOS Analog and Digital Circuits by : Manoj Sachdev
Download or read book Defect Oriented Testing for CMOS Analog and Digital Circuits written by Manoj Sachdev and published by Springer Science & Business Media. This book was released on 2013-06-29 with total page 317 pages. Available in PDF, EPUB and Kindle. Book excerpt: Defect oriented testing is expected to play a significant role in coming generations of technology. Smaller feature sizes and larger die sizes will make ICs more sensitive to defects that can not be modeled by traditional fault modeling approaches. Furthermore, with increased level of integration, an IC may contain diverse building blocks. Such blocks include, digital logic, PLAs, volatile and non-volatile memories, and analog interfaces. For such diverse building blocks, traditional fault modeling and test approaches will become increasingly inadequate. Defect oriented testing methods have come a long way from a mere interesting academic exercise to a hard industrial reality. Many factors have contributed to its industrial acceptance. Traditional approaches of testing modern integrated circuits (ICs) have been found to be inadequate in terms of quality and economics of test. In a globally competitive semiconductor market place, overall product quality and economics have become very important objectives. In addition, electronic systems are becoming increasingly complex and demand components of highest possible quality. Testing, in general and, defect oriented testing, in particular, help in realizing these objectives. Defect Oriented Testing for CMOS Analog and Digital Circuits is the first book to provide a complete overview of the subject. It is essential reading for all design and test professionals as well as researchers and students working in the field. `A strength of this book is its breadth. Types of designs considered include analog and digital circuits, programmable logic arrays, and memories. Having a fault model does not automatically provide a test. Sometimes, design for testability hardware is necessary. Many design for testability ideas, supported by experimental evidence, are included.' ... from the Foreword by Vishwani D. Agrawal
Book Synopsis High Resolution Focused Ion Beams: FIB and its Applications by : Jon Orloff
Download or read book High Resolution Focused Ion Beams: FIB and its Applications written by Jon Orloff and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 304 pages. Available in PDF, EPUB and Kindle. Book excerpt: In this book, we have attempted to produce a reference on high resolution focused ion beams (FIBs) that will be useful for both the user and the designer of FIB instrumentation. We have included a mix of theory and applications that seemed most useful to us. The field of FIBs has advanced rapidly since the application of the first field emission ion sources in the early 1970s. The development of the liquid metal ion source (LMIS) in the late 1960s and early 1970s and its application for FIBs in the late 1970s have resulted in a powerful tool for research and for industry. There have been hundreds of papers written on many aspects of LMIS and FIBs, and a useful and informative book on these subjects was published in 1991 by Phil Prewett and Grame Mair. Because there have been so many new applications and uses found for FIBs in the last ten years we felt that it was time for another book on the subject.
Download or read book The Shock and Vibration Digest written by and published by . This book was released on 1989 with total page 236 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Failure Modes and Mechanisms in Electronic Packages by : P. Singh
Download or read book Failure Modes and Mechanisms in Electronic Packages written by P. Singh and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 391 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.
Book Synopsis Metrology and Diagnostic Techniques for Nanoelectronics by : Zhiyong Ma
Download or read book Metrology and Diagnostic Techniques for Nanoelectronics written by Zhiyong Ma and published by CRC Press. This book was released on 2017-03-27 with total page 889 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nanoelectronics is changing the way the world communicates, and is transforming our daily lives. Continuing Moore’s law and miniaturization of low-power semiconductor chips with ever-increasing functionality have been relentlessly driving R&D of new devices, materials, and process capabilities to meet performance, power, and cost requirements. This book covers up-to-date advances in research and industry practices in nanometrology, critical for continuing technology scaling and product innovation. It holistically approaches the subject matter and addresses emerging and important topics in semiconductor R&D and manufacturing. It is a complete guide for metrology and diagnostic techniques essential for process technology, electronics packaging, and product development and debugging—a unique approach compared to other books. The authors are from academia, government labs, and industry and have vast experience and expertise in the topics presented. The book is intended for all those involved in IC manufacturing and nanoelectronics and for those studying nanoelectronics process and assembly technologies or working in device testing, characterization, and diagnostic techniques.
Book Synopsis 国立国会図書館所蔵科学技術関係欧文会議錄目錄 by : 国立国会図書館 (Japan)
Download or read book 国立国会図書館所蔵科学技術関係欧文会議錄目錄 written by 国立国会図書館 (Japan) and published by . This book was released on 1972 with total page 1528 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Solder Joint Reliability by : John H. Lau
Download or read book Solder Joint Reliability written by John H. Lau and published by Springer Science & Business Media. This book was released on 1991-05-31 with total page 504 pages. Available in PDF, EPUB and Kindle. Book excerpt: Looks at how solder joint reliability is influenced by flux reactions, solder paste, reflow methods, wave soldering, and cleaning. Explores failure mechanisms and includes practical methods for testing, analysis, and life prediction of solder joints subjected to conditions of fatigue, creep, stress relaxation, shock, and vibration. For engineers and designers involved in electronics packaging. Annotation copyrighted by Book News, Inc., Portland, OR
Book Synopsis ESD Design and Analysis Handbook by : James E. Vinson
Download or read book ESD Design and Analysis Handbook written by James E. Vinson and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 214 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electrostatic Discharge is a pervasive issue in the semiconductor industry affecting both manufacturers and users of semiconductors. This easy-to-read, practical handbook presents an overview of ESD as it effects electronic circuits and provides a concise introduction for students, engineers, circuit designers and failure analysts.
Book Synopsis Reliability and Quality in Microelectronic Manufacturing by : A. Christou
Download or read book Reliability and Quality in Microelectronic Manufacturing written by A. Christou and published by RIAC. This book was released on 2006 with total page 410 pages. Available in PDF, EPUB and Kindle. Book excerpt:
