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Influence Of 0 Level Packaging On The Microwave Performance Of Rf Mems Devices
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Book Synopsis Influence of 0-level Packaging on the Microwave Performance of RF-MEMS Devices by :
Download or read book Influence of 0-level Packaging on the Microwave Performance of RF-MEMS Devices written by and published by . This book was released on 2001 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: RF-MEMS devices (Radio Frequency-MicroElectroMechanical Systems) are made of moveable and fragile structures (membranes, beams, cantilevers, & that must be encapsulated for protection and for stable performance characteristics. Zero-level or wafer-level packaging developed so far has been limited to dc-components. This paper elaborates on the design and fabrication of a 0-level package for housing RF-MEMS devices. The fabrication process is described and packages are characterized in terms of mechanical strength, hermeticity and microwave performance in the range 1-50 GHz. Simulations and experiments show minimal impact of the package on the RF losses if the cap has a minimal height of 50 æm, if low-loss materials (e.g., glass) are used, and if matched RF feedthroughs are implemented. Finally, in a multi-switch design, we recommend to minimize the number of feedthroughs, i.e. to use a single cap for the entire design.
Download or read book Digest of Technical Papers written by and published by . This book was released on 2003 with total page 1072 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Micromachined Circuits and Devices by : Shiban Kishen Koul
Download or read book Micromachined Circuits and Devices written by Shiban Kishen Koul and published by Springer Nature. This book was released on 2022-02-07 with total page 386 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the design of different switching and resonant devices using the present state-of-the-art radio frequency (RF) micromachining (MEMS) technology. Different topologies of MEMS switches have been discussed considering optimum performances over microwave to millimeter wave frequency range. Wide varieties of micromachined switching networks starting from single-pole-double-throw (SPDT) to single-pole-fourteen-throw (SP14T) are discussed utilizing vertical and lateral actuation movements of the switch. Different transduction mechanisms of micromachined resonators are highlighted that includes capacitive, piezoelectric, and piezoresistive types. The book provides major design guidelines for the development of MEMS-based digital phase shifters, tunable filters, and antennas with extensive measurement data. Apart from the radio frequency (RF) requirements, an extensive guideline is given for the improvement of the reliability of micromachined switches and digital phase shifters where multiple switches are operating simultaneously. It takes multiple iterations and extensive characterizations to conclude with a reliable MEMS digital phase shifter, and these aspects are given one of the prime attentions in this book. Detailed performance analysis of metamaterial inspired MEMS switches is then discussed for application in millimeter wave frequency bands up to about 170 GHz. The book concludes with future research activities of RF MEMS technology and its potential in space, defense, sensors, and biomedical applications.
Author :Danelle Mary Tanner Publisher :SPIE-International Society for Optical Engineering ISBN 13 :9780819456908 Total Pages :272 pages Book Rating :4.4/5 (569 download)
Book Synopsis Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV by : Danelle Mary Tanner
Download or read book Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV written by Danelle Mary Tanner and published by SPIE-International Society for Optical Engineering. This book was released on 2005 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.
Download or read book More than Moore written by Guo Qi Zhang and published by Springer Science & Business Media. This book was released on 2010-01-23 with total page 338 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the past decades, the mainstream of microelectronics progression was mainly powered by Moore's law focusing on IC miniaturization down to nano scale. However, there is a fast increasing need for "More than Moore" (MtM) products and technology that are based upon or derived from silicon technologies, but do not simply scale with Moore’s law. This book provides new vision, strategy and guidance for the future technology and business development of micro/nanoelectronics.
Book Synopsis Advanced RF MEMS by : Stepan Lucyszyn
Download or read book Advanced RF MEMS written by Stepan Lucyszyn and published by Cambridge University Press. This book was released on 2010-08-19 with total page 441 pages. Available in PDF, EPUB and Kindle. Book excerpt: An up-to-date guide to the theory and applications of RF MEMS. With detailed information about RF MEMS technology as well as its reliability and applications, this is a comprehensive resource for professionals, researchers, and students alike. • Reviews RF MEMS technologies • Illustrates new techniques that solve long-standing problems associated with reliability and packaging • Provides the information needed to incorporate RF MEMS into commercial products • Describes current and future trends in RF MEMS, providing perspective on industry growth • Ideal for those studying or working in RF and microwave circuits, systems, microfabrication and manufacturing, production management and metrology, and performance evaluation
Book Synopsis Hermetic Wafer-Level Packaging for RF MEMs by :
Download or read book Hermetic Wafer-Level Packaging for RF MEMs written by and published by . This book was released on 2012 with total page 8 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis RF and Microwave Microelectronics Packaging by : Ken Kuang
Download or read book RF and Microwave Microelectronics Packaging written by Ken Kuang and published by Springer Science & Business Media. This book was released on 2009-12-01 with total page 295 pages. Available in PDF, EPUB and Kindle. Book excerpt: RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
Book Synopsis RF and Microwave Microelectronics Packaging II by : Ken Kuang
Download or read book RF and Microwave Microelectronics Packaging II written by Ken Kuang and published by Springer. This book was released on 2017-03-09 with total page 177 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.
Book Synopsis Physics of Semiconductor Devices by : V. K. Jain
Download or read book Physics of Semiconductor Devices written by V. K. Jain and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 841 pages. Available in PDF, EPUB and Kindle. Book excerpt: The purpose of this workshop is to spread the vast amount of information available on semiconductor physics to every possible field throughout the scientific community. As a result, the latest findings, research and discoveries can be quickly disseminated. This workshop provides all participating research groups with an excellent platform for interaction and collaboration with other members of their respective scientific community. This workshop’s technical sessions include various current and significant topics for applications and scientific developments, including • Optoelectronics • VLSI & ULSI Technology • Photovoltaics • MEMS & Sensors • Device Modeling and Simulation • High Frequency/ Power Devices • Nanotechnology and Emerging Areas • Organic Electronics • Displays and Lighting Many eminent scientists from various national and international organizations are actively participating with their latest research works and also equally supporting this mega event by joining the various organizing committees.
Author :IEEE International Conference on Micro Electro Mechanical Systems 17, 2004, Maastricht, The Netherlands Publisher : ISBN 13 :9780780382657 Total Pages :868 pages Book Rating :4.3/5 (826 download)
Book Synopsis 17th IEEE international conference on micro electro mechanical systems by : IEEE International Conference on Micro Electro Mechanical Systems 17, 2004, Maastricht, The Netherlands
Download or read book 17th IEEE international conference on micro electro mechanical systems written by IEEE International Conference on Micro Electro Mechanical Systems 17, 2004, Maastricht, The Netherlands and published by . This book was released on 2004 with total page 868 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Wafer Level Micropackaging for RF MEMS Switches by :
Download or read book Wafer Level Micropackaging for RF MEMS Switches written by and published by . This book was released on 2005 with total page 8 pages. Available in PDF, EPUB and Kindle. Book excerpt: Wafer-level micro-encapsulation is an innovative, low-cost, wafer-level packaging method for encapsulating RF MEMS switches. This zero-level packaging technique has demonstrated 0.04 dB package insertion loss at 35 GHz. This article overviews the processes, measurements, and testing methods used for determining the integrity and performance of individual encapsulated RF MEMS packages.
Download or read book עיר עולם written by and published by . This book was released on 1984 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microwave Journal written by and published by . This book was released on 2009 with total page 858 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Materials, Integration and Packaging Issues for High-frequency Devices by :
Download or read book Materials, Integration and Packaging Issues for High-frequency Devices written by and published by . This book was released on 2003 with total page 256 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Passive RF and Microwave Integrated Circuits by : Leo Maloratsky
Download or read book Passive RF and Microwave Integrated Circuits written by Leo Maloratsky and published by Elsevier. This book was released on 2003-12-01 with total page 385 pages. Available in PDF, EPUB and Kindle. Book excerpt: The growth in RF and wireless/mobile computing devices that operate at microwave frequencies has resulted in explosive demand for integrated circuits capable of operating at such frequencies in order to accomplish functions like frequency division, phase shifting, attenuation, and isolators and circulators for antennas. This book is an introduction to such ICs, combining theory and practical applications of those devices. In addition to this combined theory and application approach, the author discusses the critical importance of differing fabrication materials on the performance of ICs at different frequencies. This is an area often overlooked when choosing ICs for RF and microwave applications, yet it can be a crucial factor in how an IC performs in a given application. - Gives reader a solid background in an increasingly important area of circuit design - Emphasis on combination of theoretical discussions with practical application examples - In-depth discussion of critical, but often overlooked topic of different fabrication material performances at varying frequencies
Book Synopsis MEMS Reliability by : Allyson L. Hartzell
Download or read book MEMS Reliability written by Allyson L. Hartzell and published by Springer Science & Business Media. This book was released on 2010-11-02 with total page 300 pages. Available in PDF, EPUB and Kindle. Book excerpt: The successful launch of viable MEMs product hinges on MEMS reliability, the reliability and qualification for MEMs based products is not widely understood. Companies that have a deep understanding of MEMs reliability view the information as a competitive advantage and are reluctant to share it. MEMs Reliability, focuses on the reliability and manufacturability of MEMS at a fundamental level by addressing process development and characterization, material property characterization, failure mechanisms and physics of failure (POF), design strategies for improving yield, design for reliability (DFR), packaging and testing.
