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Ieee Ninth Annual Semiconductor Thermal Measurement And Management Symposium 1993
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Book Synopsis IEEE Ninth Annual Semiconductor Thermal Measurement and Management Symposium, 1993 by : IEEE, Components, Hybrids and Manufacturing Technology
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Book Synopsis Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium by :
Download or read book Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1993 with total page 214 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium by :
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Book Synopsis Semiconductor Thermal Measurement and Management Symposium by :
Download or read book Semiconductor Thermal Measurement and Management Symposium written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1999 with total page 299 pages. Available in PDF, EPUB and Kindle. Book excerpt: This collection of essays from the 15th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Semi-Therm) provides a forum for the exchange of information between industrial and academic communities on topics related to semiconductor thermal measurement, modelling and management.
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Book Synopsis 2022 38th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM). by :
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Book Synopsis 2014 IEEE/CPMT 30th Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM 2014) by :
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Book Synopsis Thirteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium by :
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Book Synopsis Semiconductor Thermal Measurement and Management Symposium, 2010. SEMI-THERM 2010. 26th Annual IEEE. by :
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Book Synopsis 2014 IEEE/CPMT 30th Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM 2014) by :
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Book Synopsis Handbook of 3D Integration, Volume 4 by : Paul D. Franzon
Download or read book Handbook of 3D Integration, Volume 4 written by Paul D. Franzon and published by John Wiley & Sons. This book was released on 2019-01-25 with total page 265 pages. Available in PDF, EPUB and Kindle. Book excerpt: This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration. This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
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