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Ieee Multi Chip Module Conference 1993
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Book Synopsis IEEE Multi-Chip Module Conference, 1993 by : Institute of Electrical and Electronics Engineers, Inc. Staff
Download or read book IEEE Multi-Chip Module Conference, 1993 written by Institute of Electrical and Electronics Engineers, Inc. Staff and published by . This book was released on 1993 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis 1993 IEEE Multi-Chip Module Conference, MCMC-93 by :
Download or read book 1993 IEEE Multi-Chip Module Conference, MCMC-93 written by and published by IEEE Computer Society. This book was released on 1993 with total page 203 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Multi-Chip Module Conference by : IEEE
Download or read book Multi-Chip Module Conference written by IEEE and published by . This book was released on 1992 with total page 210 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Multi-Chip Module Test Strategies by : Yervant Zorian
Download or read book Multi-Chip Module Test Strategies written by Yervant Zorian and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 161 pages. Available in PDF, EPUB and Kindle. Book excerpt: MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. Multi-Chip Module Test Strategies presents state-of-the-art test strategies for MCMs. This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs. Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain. Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2).
Book Synopsis Physical Design for Multichip Modules by : Mysore Sriram
Download or read book Physical Design for Multichip Modules written by Mysore Sriram and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 205 pages. Available in PDF, EPUB and Kindle. Book excerpt: Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as well as original work by the authors. All major aspects of MCM physical design are discussed, including interconnect analysis and modeling, system partitioning and placement, and multilayer routing. For readers unfamiliar with MCMs, this book presents an overview of the different MCM technologies available today. An in-depth discussion of various recent approaches to interconnect analysis are also presented. Remaining chapters discuss the problems of partitioning, placement, and multilayer routing, with an emphasis on timing performance. For the first time, data from a wide range of sources is integrated to present a clear picture of a new, challenging and very important research area. For students and researchers looking for interesting research topics, open problems and suggestions for further research are clearly stated. Points of interest include : Clear overview of MCM technology and its relationship to physical design; Emphasis on performance-driven design, with a chapter devoted to recent techniques for rapid performance analysis and modeling of MCM interconnects; Different approaches to multilayer MCM routing collected together and compared for the first time; Explanation of algorithms is not overly mathematical, yet is detailed enough to give readers a clear understanding of the approach; Quantitative data provided wherever possible for comparison of different approaches; A comprehensive list of references to recent literature on MCMs provided.
Book Synopsis Conceptual Design of Multichip Modules and Systems by : Peter A. Sandborn
Download or read book Conceptual Design of Multichip Modules and Systems written by Peter A. Sandborn and published by Springer Science & Business Media. This book was released on 2013-03-14 with total page 270 pages. Available in PDF, EPUB and Kindle. Book excerpt: Conceptual Design of Multichip Modules and Systems treats activities which take place at the conceptual and specification level of the design of complex multichip systems. These activities include the formalization of design knowledge (information modeling), tradeoff analysis, partitioning, and decision process capture. All of these functions occur prior to the traditional CAD activities of synthesis and physical design. Inherent in the design of electronic modules are tradeoffs which must be understood before feasible technology, material, process, and partitioning choices can be selected. The lack of a complete set of technology information is an especially serious problem in the packaging and interconnect field since the number of technologies, process, and materials is substantial and selecting optimums is arduous and non-trivial if one truly wants a balance in cost and performance. Numerous tradeoff and design decisions have to be made intelligently and quickly at the beginning of the design cycle before physical design work begins. These critical decisions, made within the first 10% of the total design cycle, ultimately define up to 80% of the final product cost. Conceptual Design of Multichip Modules and Systems lays the groundwork for concurrent estimation level analysis including size, routing, electrical performance, thermal performance, cost, reliability, manufacturability, and testing. It will be useful both as a reference for system designers and as a text for those wishing to gain a perspective on the nature of packaging and interconnect design, concurrent engineering, computer-aided design, and system synthesis.
Book Synopsis IEEE multi-chip module conference ... by :
Download or read book IEEE multi-chip module conference ... written by and published by . This book was released on 1997 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Proceedings, 1997 IEEE Multi-Chip Module Conference by : IEEE Computer Society
Download or read book Proceedings, 1997 IEEE Multi-Chip Module Conference written by IEEE Computer Society and published by IEEE Computer Society. This book was released on 1997-01-01 with total page 171 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Chip On Board written by John H. Lau and published by Springer Science & Business Media. This book was released on 1994-06-30 with total page 584 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.
Book Synopsis Microelectronics Packaging Handbook by : R.R. Tummala
Download or read book Microelectronics Packaging Handbook written by R.R. Tummala and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 1060 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
Author :IEEE Computer Society Staff Publisher :Institute of Electrical & Electronics Engineers(IEEE) ISBN 13 :9780780305069 Total Pages :200 pages Book Rating :4.3/5 (5 download)
Book Synopsis IEEE Multi-Chip Module Conference, 1992 by : IEEE Computer Society Staff
Download or read book IEEE Multi-Chip Module Conference, 1992 written by IEEE Computer Society Staff and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1992-03-01 with total page 200 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Proceedings, 1992 IEEE Multi-Chip Module Conference, MCMC-92 by :
Download or read book Proceedings, 1992 IEEE Multi-Chip Module Conference, MCMC-92 written by and published by . This book was released on 1992 with total page 181 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis International Test Conference, 1993 by :
Download or read book International Test Conference, 1993 written by and published by Conference. This book was released on 1993 with total page 1090 pages. Available in PDF, EPUB and Kindle. Book excerpt: Annotation Proceedings of the 24th International Test Conference held in Baltimore, October 1993--the premier conference for the testing of electronic devices, assemblies, and systems, including design for testability and diagnostics. This year's leading edge topics are mixed-signal testing, multichip modules, systems test, automatic synthesis of test structures in design, boundary scan, and Iddq. Core topics represented included ATPG, modeling, test equipment hardware, delay fault testing, software testing, DFT, applied BIST, board testing, memory and microprocessor testing, test economics, and test quality and reliability. Annotation copyright by Book News, Inc., Portland, OR.
Download or read book Proceedings written by and published by . This book was released on 1997 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Advances in Acoustic Microscopy by : Andrew Briggs
Download or read book Advances in Acoustic Microscopy written by Andrew Briggs and published by Springer Science & Business Media. This book was released on 2013-11-11 with total page 374 pages. Available in PDF, EPUB and Kindle. Book excerpt: In 1992 Acoustic Microscopy was published by Oxford University Press, in the series of Monographs on the Physics and Chemistry of Materials. Reviews appeared in the Journal of Microscopy [169 (1), 91] and in Contemporary Physics [33 (4), 296]. At the time of going to press, it seemed that the field of acoustic microscopy had settled down from the wonderful developments in resolution that had been seen in the late seventies and the early eighties and from the no less exciting developments in quantitative elastic measurements that had followed. One reviewer wrote, "The time is ripe for such a book, now that the expansion of the subject has perceptively slowed after it was detonated by Lemons and Quate. " [A. Howie, Proc. RMS 27 (4), 280]. In many ways, this remains true. The basic design for both imaging and quantitative instruments is well-established; the upper frequency for routine imaging is the 2 GHz established by the Ernst Leitz scanning acoustic microscope (ELSAM) in 1984. For the most accurate V(z) measurements, the 225-MHz line-focus-beam lens, developed at Tohoku Univer sity a little before then, remains standard. The principles of the contrast theory have been confirmed by abundant experience; in particular the role of surface acoustic waves, such as Rayleigh waves, dominates the contrast in most high resolution studies of many materials.
Book Synopsis Engineering Decisions for Manufacturing Systems by : Jun Zhang
Download or read book Engineering Decisions for Manufacturing Systems written by Jun Zhang and published by Trans Tech Publications Ltd. This book was released on 2013-09-03 with total page 854 pages. Available in PDF, EPUB and Kindle. Book excerpt: Collection of selected, peer reviewed papers from the 2013 2nd International Symposium on Manufacturing Systems Engineering (ISMSE2013), July 27-29, 2013, Singapore. The 140 paper are grouped as follows: Chapter 1: Applied Materials Engineering and Materials Processing; Chapter 2: Design and Engineering Researches in Mechanical Engineering; Chapter 3: Environmental Engineering and Energy Sources Engineering; Chapter 4: Opto- and Microelectronics; Chapter 5: Measurements, Detection, Signal and Data Processing; Chapter 6: Mechatronics, Control and Automation of Manufacture; Chapter 7: Information Technology in Manufacturing Systems; Chapter 8: Organization of Manufacture and Engineering Management.
Book Synopsis Area Array Interconnection Handbook by : Karl J. Puttlitz
Download or read book Area Array Interconnection Handbook written by Karl J. Puttlitz and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 1250 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
