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Hole Transport In Strained Sige Channel Mosfets
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Book Synopsis Hole Transport in Strained SiGe-channel MOSFETs by : Leonardo Gomez (Ph. D.)
Download or read book Hole Transport in Strained SiGe-channel MOSFETs written by Leonardo Gomez (Ph. D.) and published by . This book was released on 2010 with total page 167 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since the 90 nm CMOS technology node, geometric scaling of CMOS has been supplemented with strain to boost transistor drive current. Future CMOS technology nodes (i.e. beyond the 32 nm node) will require more significant changes to continue improvements in transistor performance. Novel CMOS channel materials and device architectures are one option for enhancing carrier transport and increasing device performance. In this work strained SiGe and Ge are examined as a means of increasing the drive current in deeply scaled CMOS. As part of this work a novel high mobility strained-Ge on-insulator substrate has been developed, and the hole transport characteristics of short channel and asymmetrically strained-SiGe channel p-MOSFETs have been explored. A thin-body biaxial compressive strained-Si/strained-Ge heterostructure on-insulator (HOI) substrate has been developed, which combines the electrostatic benefits of the thin-body architecture with the transport benefits of biaxial compressive strain. A novel Germanium on Silicon growth method and a low temperature bond and etch-back process have been developed to enable Ge HOI fabrication. P-MOSFETs were also fabricated using these substrates and the hole mobility characteristics were studied. The hole mobility and velocity characteristics of short channel biaxial compressive strained-Si 45 Geo. 55 p-MOSFETs on-insulator have also been examined. Devices with gate lengths down to 65 nm were fabricated. The short channel mobility characteristics were extracted and a 2.4x hole mobility enhancement relative to relaxed-Si was observed. The measured hole velocity enhancement is more modest at about 1.2x. Band structure and ballistic velocity simulations suggest that a more substantial velocity improvement can be expected with the incorporation of added longitudinal uniaxial compressive strain in the SiGe channel. The hole mobility characteristics of biaxial strained SiGe and Ge p-MOSFETs with applied uniaxial strain are also studied. The hole mobility in biaxial compressive strained SiGe is already enhanced relative to relaxed Si. It is observed that this mobility enhancement increases further with the application of 110 longitudinal uniaxial compressive strain. Since hole mobility and velocity are correlated through their dependence on the hole effective mass, a mass driven increase in mobility with applied uniaxial strain should result in an increase in velocity. Simulations have also been performed to estimate the hole effective mass change in asymmetric strained SiGe. Finally the piezo resistance coefficients of strained SiGe are extracted and found to be larger than in Si.
Book Synopsis Transport in Thin-body MOSFETs Fabricated in Strained Si and Strained Si/SiGe Heterostructures on Insulator by : Ingvar Åberg
Download or read book Transport in Thin-body MOSFETs Fabricated in Strained Si and Strained Si/SiGe Heterostructures on Insulator written by Ingvar Åberg and published by . This book was released on 2006 with total page 183 pages. Available in PDF, EPUB and Kindle. Book excerpt: (Cont.) Comparisons between SSDOI of two strain levels indicate benefits of strain engineering down to 3 nm thickness. The hole mobility in HOI is improved compared to that in SSDOI, due to the high hole mobility in the Si1-zGez channel. The mobility enhancement is similar at low and high hole densities even at moderate strain levels. The hole mobility in HOI with SiGe channel thickness below 10 nm is observed to follow a similar dependence on channel thickness as hole mobility in SSDOI. Simulations of electrostatics in HOI and SSDOI with ultra-thin channel thicknesses indicate similarities in the confinement of the inversion charge in ultra-thin body HOI and SSDOI. This suggests that the similar reduction of hole mobility in HOI and SSDOI with 4-10 nm-thick channels is associated with an increase in phonon scattering from the reduced effective channel thickness.
Download or read book SiGe and Ge written by David Louis Harame and published by The Electrochemical Society. This book was released on 2006 with total page 1280 pages. Available in PDF, EPUB and Kindle. Book excerpt: The second International SiGe & Ge: Materials, Processing, and Devices Symposium was part of the 2006 ECS conference held in Cancun, Mexico from October 29-Nov 3, 2006. This meeting provided a forum for reviewing and discussing all materials and device related aspects of SiGe & Ge. The hardcover edition includes a bonus CD-ROM containing the PDF of the entire issue.
Book Synopsis Silicon-Germanium (SiGe) Nanostructures by : Y. Shiraki
Download or read book Silicon-Germanium (SiGe) Nanostructures written by Y. Shiraki and published by Elsevier. This book was released on 2011-02-26 with total page 649 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nanostructured silicon-germanium (SiGe) opens up the prospects of novel and enhanced electronic device performance, especially for semiconductor devices. Silicon-germanium (SiGe) nanostructures reviews the materials science of nanostructures and their properties and applications in different electronic devices. The introductory part one covers the structural properties of SiGe nanostructures, with a further chapter discussing electronic band structures of SiGe alloys. Part two concentrates on the formation of SiGe nanostructures, with chapters on different methods of crystal growth such as molecular beam epitaxy and chemical vapour deposition. This part also includes chapters covering strain engineering and modelling. Part three covers the material properties of SiGe nanostructures, including chapters on such topics as strain-induced defects, transport properties and microcavities and quantum cascade laser structures. In Part four, devices utilising SiGe alloys are discussed. Chapters cover ultra large scale integrated applications, MOSFETs and the use of SiGe in different types of transistors and optical devices. With its distinguished editors and team of international contributors, Silicon-germanium (SiGe) nanostructures is a standard reference for researchers focusing on semiconductor devices and materials in industry and academia, particularly those interested in nanostructures. Reviews the materials science of nanostructures and their properties and applications in different electronic devices Assesses the structural properties of SiGe nanostructures, discussing electronic band structures of SiGe alloys Explores the formation of SiGe nanostructuresfeaturing different methods of crystal growth such as molecular beam epitaxy and chemical vapour deposition
Book Synopsis High Mobility Strained Si/SiGe Heterostructure MOSFETs by : Christopher W. Leitz
Download or read book High Mobility Strained Si/SiGe Heterostructure MOSFETs written by Christopher W. Leitz and published by . This book was released on 2002 with total page 178 pages. Available in PDF, EPUB and Kindle. Book excerpt: (Cont.) Record mobility strained Si p-MOSFETs have been fabricated on relaxed 40% Ge virtual substrates. Hole mobility enhancements saturate at virtual substrate compositions of 40% Ge and above, with mobility enhancements over twice that of co-processed bulk Si devices. In contrast, hole mobility in strained Si p-MOSFETs displays no strong dependence on strained layer thickness. These results indicate that strain is the primary variable in determining hole mobility in strained Si p-MOSFETs and that symmetric electron and hole mobility enhancements in strained Si MOSFETs can be obtained for virtual substrate compositions beyond 35% Ge. The effect of alloy scattering on carrier mobility in tensile strained SiGe surface channel MOSFETs is measured directly for the first time. Electron mobility is degraded much more severely than hole mobility in these heterostructures, in agreement with theoretical predictions. Dual channel heterostructures, which consist of the combination of buried compressively strained SiilyGey buried channels and tensile strained Si surface channels, grown on relaxed SilxGex virtual substrates, are explored in detail for the first time. Hole mobilities exceeding 700 cm2/V-s have been achieved by combining tensile strained Si surface channels and compressively strained 80% Ge buried channels grown on relaxed 50% Ge virtual substrates. This layer sequence exhibits nearly symmetric electron and hole mobilities, both enhanced relative to bulk Si ...
Book Synopsis MOSFET Channel Engineering Using Strained Si and Strained Ge Grown on SiGe Virtual Substrates by : Minjoo Lawrence Lee
Download or read book MOSFET Channel Engineering Using Strained Si and Strained Ge Grown on SiGe Virtual Substrates written by Minjoo Lawrence Lee and published by . This book was released on 2003 with total page 161 pages. Available in PDF, EPUB and Kindle. Book excerpt: (Cont.) While [epsilon]-Si p-MOSFETs tend to lose much of their mobility enhancement at large vertical fields, previous work shows that the situation improves as x in the Si[sub]l-x Ge[sub]x virtual substrate is increased to 0.5. The work presented here demonstrates that enhancements continue to improve for even higher Ge content. At x = 0.7, hole mobility enhancements of 2.9 times were observed with no degradation at very large inversion densities (i.e.>101̂3cm-̂2). Also, for the first time, a p-MOSFET with mobility enhancements that are independent of inversion density has been demonstrated through the use of a digital-alloy heterostructure. In general, it is shown that engineering the layer structure allows great control over the slope of hole mobility versus gate overdrive and that hole mobility enhancements that increase or remain constant with respect to inversion density can be attained. While the first demonstration of high hole mobility in strained Ge ([epsilon]-Ge) was published nearly 10 years ago, little or no work on enhancement mode p-MOSFETs utilizing [epsilon]-Ge had been published prior to this thesis ...
Book Synopsis SiGe and Si Strained-Layer Epitaxy for Silicon Heterostructure Devices by : John D. Cressler
Download or read book SiGe and Si Strained-Layer Epitaxy for Silicon Heterostructure Devices written by John D. Cressler and published by CRC Press. This book was released on 2017-12-19 with total page 264 pages. Available in PDF, EPUB and Kindle. Book excerpt: What seems routine today was not always so. The field of Si-based heterostructures rests solidly on the shoulders of materials scientists and crystal growers, those purveyors of the semiconductor “black arts” associated with the deposition of pristine films of nanoscale dimensionality onto enormous Si wafers with near infinite precision. We can now grow near-defect free, nanoscale films of Si and SiGe strained-layer epitaxy compatible with conventional high-volume silicon integrated circuit manufacturing. SiGe and Si Strained-Layer Epitaxy for Silicon Heterostructure Devices tells the materials side of the story and details the many advances in the Si-SiGe strained-layer epitaxy for device applications. Drawn from the comprehensive and well-reviewed Silicon Heterostructure Handbook, this volume defines and details the many advances in the Si/SiGe strained-layer epitaxy for device applications. Mining the talents of an international panel of experts, the book covers modern SiGe epitaxial growth techniques, epi defects and dopant diffusion in thin films, stability constraints, and electronic properties of SiGe, strained Si, and Si-C alloys. It includes appendices on topics such as the properties of Si and Ge, the generalized Moll-Ross relations, integral charge-control relations, and sample SiGe HBT compact model parameters.
Book Synopsis Computational Electronics by : Dragica Vasileska
Download or read book Computational Electronics written by Dragica Vasileska and published by CRC Press. This book was released on 2017-12-19 with total page 866 pages. Available in PDF, EPUB and Kindle. Book excerpt: Starting with the simplest semiclassical approaches and ending with the description of complex fully quantum-mechanical methods for quantum transport analysis of state-of-the-art devices, Computational Electronics: Semiclassical and Quantum Device Modeling and Simulation provides a comprehensive overview of the essential techniques and methods for effectively analyzing transport in semiconductor devices. With the transistor reaching its limits and new device designs and paradigms of operation being explored, this timely resource delivers the simulation methods needed to properly model state-of-the-art nanoscale devices. The first part examines semiclassical transport methods, including drift-diffusion, hydrodynamic, and Monte Carlo methods for solving the Boltzmann transport equation. Details regarding numerical implementation and sample codes are provided as templates for sophisticated simulation software. The second part introduces the density gradient method, quantum hydrodynamics, and the concept of effective potentials used to account for quantum-mechanical space quantization effects in particle-based simulators. Highlighting the need for quantum transport approaches, it describes various quantum effects that appear in current and future devices being mass-produced or fabricated as a proof of concept. In this context, it introduces the concept of effective potential used to approximately include quantum-mechanical space-quantization effects within the semiclassical particle-based device simulation scheme. Addressing the practical aspects of computational electronics, this authoritative resource concludes by addressing some of the open questions related to quantum transport not covered in most books. Complete with self-study problems and numerous examples throughout, this book supplies readers with the practical understanding required to create their own simulators.
Book Synopsis SiGe, Ge, and Related Compounds 4: Materials, Processing, and Devices by : D. Harame
Download or read book SiGe, Ge, and Related Compounds 4: Materials, Processing, and Devices written by D. Harame and published by The Electrochemical Society. This book was released on 2010-10 with total page 1066 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced semiconductor technology is depending on innovation and less on "classical" scaling. SiGe, Ge, and Related Compounds has become a key component in the arsenal in improving semiconductor performance. This symposium discusses the technology to form these materials, process them, FET devices incorporating them, Surfaces and Interfaces, Optoelectronic devices, and HBT devices.
Book Synopsis High Mobility Materials for CMOS Applications by : Nadine Collaert
Download or read book High Mobility Materials for CMOS Applications written by Nadine Collaert and published by Woodhead Publishing. This book was released on 2018-06-29 with total page 390 pages. Available in PDF, EPUB and Kindle. Book excerpt: High Mobility Materials for CMOS Applications provides a comprehensive overview of recent developments in the field of (Si)Ge and III-V materials and their integration on Si. The book covers material growth and integration on Si, going all the way from device to circuit design. While the book's focus is on digital applications, a number of chapters also address the use of III-V for RF and analog applications, and in optoelectronics. With CMOS technology moving to the 10nm node and beyond, however, severe concerns with power dissipation and performance are arising, hence the need for this timely work on the advantages and challenges of the technology. Addresses each of the challenges of utilizing high mobility materials for CMOS applications, presenting possible solutions and the latest innovations Covers the latest advances in research on heterogeneous integration, gate stack, device design and scalability Provides a broad overview of the topic, from materials integration to circuits
Book Synopsis Strained-Si Heterostructure Field Effect Devices by : C.K Maiti
Download or read book Strained-Si Heterostructure Field Effect Devices written by C.K Maiti and published by CRC Press. This book was released on 2007-01-11 with total page 438 pages. Available in PDF, EPUB and Kindle. Book excerpt: A combination of the materials science, manufacturing processes, and pioneering research and developments of SiGe and strained-Si have offered an unprecedented high level of performance enhancement at low manufacturing costs. Encompassing all of these areas, Strained-Si Heterostructure Field Effect Devices addresses the research needs associated wi
Book Synopsis Numerical Methods and Applications by : Todor Boyanov
Download or read book Numerical Methods and Applications written by Todor Boyanov and published by Springer Science & Business Media. This book was released on 2007-02-20 with total page 741 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the thoroughly refereed post-proceedings of the 6th International Conference on Numerical Methods and Applications, NMA 2006, held in Borovets, Bulgaria, in August 2006. The 84 revised full papers presented together with 3 invited papers were carefully reviewed and selected from 111 submissions. The papers are organized in topical sections on numerical methods for hyperbolic problems, robust preconditioning solution methods, Monte Carlo and quasi-Monte Carlo for diverse applications, metaheuristics for optimization problems, uncertain/control systems and reliable numerics, interpolation and quadrature processes, large-scale computations in environmental modelling, and contributed talks.
Book Synopsis Full-band Monte Carlo Simulation of Electrons and Holes in Strained Si and SiGe by : Fabian M. Bufler
Download or read book Full-band Monte Carlo Simulation of Electrons and Holes in Strained Si and SiGe written by Fabian M. Bufler and published by Herbert Utz Verlag. This book was released on 1998 with total page 196 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Strained SiGe-channel P-MOSFETs by : Cáit Ní Chléirigh
Download or read book Strained SiGe-channel P-MOSFETs written by Cáit Ní Chléirigh and published by . This book was released on 2007 with total page 173 pages. Available in PDF, EPUB and Kindle. Book excerpt: Conventional Si CMOS intrinsic device performance has improved by 17% per year over the last 30 years through scaling of the gate length of the MOSFET along with process innovations such as the super-steep retrograde channel doping and ultra shallow source-drain junctions. In order to continue performance scaling with gate length for the 90 nm node and beyond (physical gate length 45 nm) an increase in the carrier mobility through the introduction of strain to the Si channel was required. To continue this scaling down to gate lengths of 10 nm new channel materials with superior mobility will be required. Superior hole mobility (up to 10X enhancement over bulk Si channels) and compatibility with mainstream Si processing technology make compressively strained SiGe an attractive channel material for sub 45 nm p-MOSFETs. This research investigates strained SiGe as a suitable channel material for p-MOSFETs using SiGe grown pseudomorphically on both relaxed SiGe and bulk Si substrates. Some of the fundamental and technological challenges that must be faced in order to incorporate SiGe channel materials are addressed, including the impact of heterostructure composition and SiGe channel thickness on mobility and MOSFET off-state leakage, as well as critical thickness and thermal budget constraints. In particular, the impact of the strained channel thickness on mobility is analyzed in detail. This work provides a detailed analysis of the design space for the SiGe heterostructure required to evaluate the trade off's between mobility enhancement, subthreshold characteristics and ease of integration with conventional CMOS processing in order to determine the optimum device structure.
Book Synopsis Strain-Engineered MOSFETs by : C.K. Maiti
Download or read book Strain-Engineered MOSFETs written by C.K. Maiti and published by CRC Press. This book was released on 2018-10-03 with total page 320 pages. Available in PDF, EPUB and Kindle. Book excerpt: Currently strain engineering is the main technique used to enhance the performance of advanced silicon-based metal-oxide-semiconductor field-effect transistors (MOSFETs). Written from an engineering application standpoint, Strain-Engineered MOSFETs introduces promising strain techniques to fabricate strain-engineered MOSFETs and to methods to assess the applications of these techniques. The book provides the background and physical insight needed to understand new and future developments in the modeling and design of n- and p-MOSFETs at nanoscale. This book focuses on recent developments in strain-engineered MOSFETS implemented in high-mobility substrates such as, Ge, SiGe, strained-Si, ultrathin germanium-on-insulator platforms, combined with high-k insulators and metal-gate. It covers the materials aspects, principles, and design of advanced devices, fabrication, and applications. It also presents a full technology computer aided design (TCAD) methodology for strain-engineering in Si-CMOS technology involving data flow from process simulation to process variability simulation via device simulation and generation of SPICE process compact models for manufacturing for yield optimization. Microelectronics fabrication is facing serious challenges due to the introduction of new materials in manufacturing and fundamental limitations of nanoscale devices that result in increasing unpredictability in the characteristics of the devices. The down scaling of CMOS technologies has brought about the increased variability of key parameters affecting the performance of integrated circuits. This book provides a single text that combines coverage of the strain-engineered MOSFETS and their modeling using TCAD, making it a tool for process technology development and the design of strain-engineered MOSFETs.
Book Synopsis Fabrication of SiGe HBT BiCMOS Technology by : John D. Cressler
Download or read book Fabrication of SiGe HBT BiCMOS Technology written by John D. Cressler and published by CRC Press. This book was released on 2018-10-03 with total page 258 pages. Available in PDF, EPUB and Kindle. Book excerpt: SiGe HBT BiCMOS technology is the obvious groundbreaker of the Si heterostructures application space. To date virtually every major player in the communications electronics market either has SiGe up and running in-house or is using someone else’s SiGe fab as foundry for their designers. Key to this success lies in successful integration of the SiGe HBT and Si CMOS, with no loss of performance from either device. Filled with contributions from leading experts, Fabrication of SiGe HBT BiCMOS Technologies brings together a complete discussion of these topics into a single resource. Drawn from the comprehensive and well-reviewed Silicon Heterostructure Handbook, this volume examines the design, fabrication, and application of silicon heterostructure transistors. A novel aspect of this book the inclusion of numerous snapshot views of the industrial state-of-the-art for SiGe HBT BiCMOS technology. It has been carefully designed to provide a useful basis of comparison for the current status and future course of the global industry. In addition to the copious technical material and the numerous references contained in each chapter, the book includes easy-to-reference appendices on the properties of Si and Ge, the generalized Moll-Ross relations, integral charge-control relations, and sample SiGe HBT compact model parameters.
Book Synopsis Strained Silicon Heterostructures by : C. K. Maiti
Download or read book Strained Silicon Heterostructures written by C. K. Maiti and published by IET. This book was released on 2001 with total page 520 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book comprehensively covers the areas of materials growth, characterisation and descriptions for the new devices in siliconheterostructure material systems. In recent years, the development of powerful epitaxial growth techniques such as molecular beam epitaxy (MBE), ultra-high vacuum chemical vapour deposition (UHVCVD) and other low temperature epitaxy techniques has given rise to a new area of research of bandgap engineering in silicon-based materials. This has paved the way not only for heterojunction bipolar and field effect transistors, but also for other fascinating novel quantum devices. This book provides an excellent introduction and valuable references for postgraduate students and research scientists.
