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High Speed Interconnect Design Characterization And Applications
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Book Synopsis High-speed Interconnect Design, Characterization, and Applications by : Jinsook Kim
Download or read book High-speed Interconnect Design, Characterization, and Applications written by Jinsook Kim and published by . This book was released on 2006 with total page 322 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis High-speed Interconnect Design and Characterization by : Pingshan Wang
Download or read book High-speed Interconnect Design and Characterization written by Pingshan Wang and published by . This book was released on 2004 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis High-Speed Digital System Design by : Stephen H. Hall
Download or read book High-Speed Digital System Design written by Stephen H. Hall and published by Wiley-IEEE Press. This book was released on 2000-09-08 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt: The importance of interconnect design - Ideal transmission line fundamentals - Crosstalk - Nonideal interconnect issues - Connectors, packages, and vias - Nonideal return paths, simultaneous switching noise, and power delivery - Buffer modeling - Digital timing analysis - Design methodologies - Radiated emissions compliance and system noise minimization - High-speed measurement techniques.
Book Synopsis Bogatin’s Practical Guide to Transmission Line Design and Characterization for Signal Integrity Applications by : Eric Bogatin
Download or read book Bogatin’s Practical Guide to Transmission Line Design and Characterization for Signal Integrity Applications written by Eric Bogatin and published by Artech House. This book was released on 2020-05-31 with total page 603 pages. Available in PDF, EPUB and Kindle. Book excerpt: This multimedia eBook establishes a solid foundation in the essential principles of how signals interact with transmission lines, how the physical design of interconnects affects transmission line properties, and how to interpret single-ended and differential time domain reflection (TDR) measurements to extract important figures of merits and avoid common mistakes. This book presents an intuitive understanding of transmission lines. Instructional videos are provided in every chapter that cover important aspects of the interconnect design and characterization process. This video eBook helps establish foundations for designing and characterizing the electrical properties of interconnects to explain in a simplified way how signals propagate and interact with interconnects and how the physical design of transmission structures will impact performance. Never be intimidated by impedance or differential pairs again.
Book Synopsis Signal Integrity Characterization Techniques by : Mike Resso
Download or read book Signal Integrity Characterization Techniques written by Mike Resso and published by Intl. Engineering Consortiu. This book was released on 2009 with total page 812 pages. Available in PDF, EPUB and Kindle. Book excerpt: Cogently addressing the future of signal integrity and the effect it will have on the data transmission industry as a whole, this all-inclusive guide addresses a wide array of technologies, from traditional digital data transmission to microwave measurements, and accessibly examines the gap between the two. Focusing on real world applications and providing a wide array of case studies that show how each technology can be used—from backplane design challenges to advanced error correction techniques—this guide addresses many of today’s high-speed technologies while also providing excellent insight into their future direction. With numerous valuable lessons pertaining to the signal integrity industry, this resource is the ultimate must-read guide for any specialist in the design engineering field.
Book Synopsis Signal Integrity Effects in Custom IC and ASIC Designs by : Raminderpal Singh
Download or read book Signal Integrity Effects in Custom IC and ASIC Designs written by Raminderpal Singh and published by John Wiley & Sons. This book was released on 2001-12-12 with total page 484 pages. Available in PDF, EPUB and Kindle. Book excerpt: "...offers a tutorial guide to IC designers who want to move to the next level of chip design by unlocking the secrets of signal integrity." —Jake Buurma, Senior Vice President, Worldwide Research & Development, Cadence Design Systems, Inc. Covers signal integrity effects in high performance Radio Frequency (RF) IC Brings together research papers from the past few years that address the broad range of issues faced by IC designers and CAD managers now and in the future A Wiley-IEEE Press publication
Download or read book Icccd-2000. written by and published by Allied Publishers. This book was released on 2000 with total page 444 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Characterization and Application of Advanced VLSI Interconnects by : Weiping Ni
Download or read book Characterization and Application of Advanced VLSI Interconnects written by Weiping Ni and published by . This book was released on 2007 with total page 358 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Scientific and Technical Aerospace Reports by :
Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1995 with total page 692 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Foundations for Microstrip Circuit Design by : Terry C. Edwards
Download or read book Foundations for Microstrip Circuit Design written by Terry C. Edwards and published by John Wiley & Sons. This book was released on 2016-02-01 with total page 688 pages. Available in PDF, EPUB and Kindle. Book excerpt: Building on the success of the previous three editions, Foundations for Microstrip Circuit Design offers extensive new, updated and revised material based upon the latest research. Strongly design-oriented, this fourth edition provides the reader with a fundamental understanding of this fast expanding field making it a definitive source for professional engineers and researchers and an indispensable reference for senior students in electronic engineering. Topics new to this edition: microwave substrates, multilayer transmission line structures, modern EM tools and techniques, microstrip and planar transmision line design, transmission line theory, substrates for planar transmission lines, Vias, wirebonds, 3D integrated interposer structures, computer-aided design, microstrip and power-dependent effects, circuit models, microwave network analysis, microstrip passive elements, and slotline design fundamentals.
Book Synopsis Contemporary Trends in Semiconductor Devices by : Rupam Goswami
Download or read book Contemporary Trends in Semiconductor Devices written by Rupam Goswami and published by Springer Nature. This book was released on 2022-02-16 with total page 313 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers evolution, concept and applications of modern semiconductor devices such as tunnel field effect transistors (TFETs), vertical super-thin body MOSFETs, ion sensing FETs (ISFETs), non-conventional solar cells, opto-electro mechanical devices and thin film transistors (TFTs). Comprising of theory, experimentation and applications of devices, the chapters describe state-of-art methods and techniques which shall be highly assistive in having an overall perspective on emerging technologies and working on a research area. The book is aimed at the scholars, enthusiasts and researchers who are currently working on devices in the contemporary era of semiconductor devices. Additionally, the chapters are lucid and descriptive and carry the potential of serving as a reference book for scholars in their undergraduate studies, who are looking ahead for a prospective career in semiconductor devices.
Download or read book Signal Integrity written by Eric Bogatin and published by Prentice Hall Professional. This book was released on 2004 with total page 612 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thorough review of the fundamental principles associated with signal integrity provides engineering principles behind signal integrity effects, and applies this understanding to solving problems.
Book Synopsis Transactions on High-Performance Embedded Architectures and Compilers IV by : Per Stenström
Download or read book Transactions on High-Performance Embedded Architectures and Compilers IV written by Per Stenström and published by Springer Science & Business Media. This book was released on 2011-11-22 with total page 446 pages. Available in PDF, EPUB and Kindle. Book excerpt: Transactions on HiPEAC aims at the timely dissemination of research contributions in computer architecture and compilation methods for high-performance embedded computer systems. Recognizing the convergence of embedded and general-purpose computer systems, this journal publishes original research on systems targeted at specific computing tasks as well as systems with broad application bases. The scope of the journal therefore covers all aspects of computer architecture, code generation and compiler optimization methods of interest to researchers and practitioners designing future embedded systems. This 4th issue contains 21 papers carefully reviewed and selected out of numerous submissions and is divided in four sections. The first section contains five regular papers. The second section consists of the top four papers from the 4th International Conference on High-Performance Embedded Architectures and Compilers, HiPEAC 2009, held in Paphos, Cyprus, in January 2009. The third section contains a set of six papers providing a snap-shot from the Workshop on Software and Hardware Challenges of Manycore Platforms, SHCMP 2008 held in Beijing, China, in June 2008. The fourth section consists of six papers from the 8th IEEE International Symposium on Systems, Architectures, Modeling and Simulation, SAMOS VIII (2008) held in Samos, Greece, in July 2008.
Book Synopsis Physics of Semiconductor Devices by : K. N. Bhat
Download or read book Physics of Semiconductor Devices written by K. N. Bhat and published by Alpha Science Int'l Ltd.. This book was released on 2004 with total page 1310 pages. Available in PDF, EPUB and Kindle. Book excerpt: Contributed papers of the workshop held at IIT, Madras, in 2003.
Book Synopsis Measurement and Modeling of Silicon Heterostructure Devices by : John D. Cressler
Download or read book Measurement and Modeling of Silicon Heterostructure Devices written by John D. Cressler and published by CRC Press. This book was released on 2018-10-03 with total page 189 pages. Available in PDF, EPUB and Kindle. Book excerpt: When you see a nicely presented set of data, the natural response is: “How did they do that; what tricks did they use; and how can I do that for myself?” Alas, usually, you must simply keep wondering, since such tricks-of- the-trade are usually held close to the vest and rarely divulged. Shamefully ignored in the technical literature, measurement and modeling of high-speed semiconductor devices is a fine art. Robust measuring and modeling at the levels of performance found in modern SiGe devices requires extreme dexterity in the laboratory to obtain reliable data, and then a valid model to fit that data. Drawn from the comprehensive and well-reviewed Silicon Heterostructure Handbook, this volume focuses on measurement and modeling of high-speed silicon heterostructure devices. The chapter authors provide experience-based tricks-of-the-trade and the subtle nuances of measuring and modeling advanced devices, making this an important reference for the semiconductor industry. It includes easy-to-reference appendices covering topics such as the properties of silicon and germanium, the generalized Moll-Ross relations, the integral charge-control model, and sample SiGe HBT compact model parameters.
Download or read book System-in-Package written by Lei He and published by Now Publishers Inc. This book was released on 2011-06-20 with total page 93 pages. Available in PDF, EPUB and Kindle. Book excerpt: Surveys the electrical and layout perspectives of System-in-Package, the system integration technology that has emerged as a required technology to reduce the system board space and height in addition to the overall time-to-market and design cost of consumer electronics products such as those of cell phones, audio/video players and digital cameras.
Book Synopsis Graduate Announcement by : University of Michigan--Dearborn
Download or read book Graduate Announcement written by University of Michigan--Dearborn and published by . This book was released on 1998 with total page 196 pages. Available in PDF, EPUB and Kindle. Book excerpt: