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Author : Junseok Chae
Publisher :
ISBN 13 :
Total Pages : 356 pages
Book Rating : 4.3/5 (91 download)
Download or read book High-sensitivity, Low-noise, Multi-axis Capacitive Micro-accelerometers written by Junseok Chae and published by . This book was released on 2003 with total page 356 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Mahmoud Rasras
Publisher : MDPI
ISBN 13 : 3038974145
Total Pages : 252 pages
Book Rating : 4.0/5 (389 download)
Download or read book MEMS Accelerometers written by Mahmoud Rasras and published by MDPI. This book was released on 2019-05-27 with total page 252 pages. Available in PDF, EPUB and Kindle. Book excerpt: Micro-electro-mechanical system (MEMS) devices are widely used for inertia, pressure, and ultrasound sensing applications. Research on integrated MEMS technology has undergone extensive development driven by the requirements of a compact footprint, low cost, and increased functionality. Accelerometers are among the most widely used sensors implemented in MEMS technology. MEMS accelerometers are showing a growing presence in almost all industries ranging from automotive to medical. A traditional MEMS accelerometer employs a proof mass suspended to springs, which displaces in response to an external acceleration. A single proof mass can be used for one- or multi-axis sensing. A variety of transduction mechanisms have been used to detect the displacement. They include capacitive, piezoelectric, thermal, tunneling, and optical mechanisms. Capacitive accelerometers are widely used due to their DC measurement interface, thermal stability, reliability, and low cost. However, they are sensitive to electromagnetic field interferences and have poor performance for high-end applications (e.g., precise attitude control for the satellite). Over the past three decades, steady progress has been made in the area of optical accelerometers for high-performance and high-sensitivity applications but several challenges are still to be tackled by researchers and engineers to fully realize opto-mechanical accelerometers, such as chip-scale integration, scaling, low bandwidth, etc. This Special Issue on "MEMS Accelerometers" seeks to highlight research papers, short communications, and review articles that focus on: Novel designs, fabrication platforms, characterization, optimization, and modeling of MEMS accelerometers. Alternative transduction techniques with special emphasis on opto-mechanical sensing. Novel applications employing MEMS accelerometers for consumer electronics, industries, medicine, entertainment, navigation, etc. Multi-physics design tools and methodologies, including MEMS-electronics co-design. Novel accelerometer technologies and 9DoF IMU integration. Multi-accelerometer platforms and their data fusion.
Author : Henry Baltes
Publisher : John Wiley & Sons
ISBN 13 : 352767506X
Total Pages : 610 pages
Book Rating : 4.5/5 (276 download)
Download or read book CMOS - MEMS written by Henry Baltes and published by John Wiley & Sons. This book was released on 2013-03-26 with total page 610 pages. Available in PDF, EPUB and Kindle. Book excerpt: This edition of 'CMOS-MEMS' was originally published in the successful series 'Advanced Micro & Nanosystems'. Here, the combination of the globally established, billion dollar chip mass fabrication technology CMOS with the fascinating and commercially promising new world of MEMS is covered from all angles. The book introduces readers to this fi eld and takes them from fabrication technologies and material charaterization aspects to the actual applications of CMOS-MEMS - a wide range of miniaturized physical, chemical and biological sensors and RF systems. Vital knowledge on circuit and system integration issues concludes this in-depth treatise, illustrating the advantages of combining CMOS and MEMS in the first place, rather than having a hybrid solution.
Author : Nicolas Wood
Publisher :
ISBN 13 :
Total Pages : 0 pages
Book Rating : 4.:/5 (133 download)
Download or read book Characterization and Measurement Circuit Design for a Novel Low Noise and High Sensitivity MEMS Capacitive Accelerometer written by Nicolas Wood and published by . This book was released on 2018 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Fatemeh Edalatfar
Publisher :
ISBN 13 :
Total Pages : 125 pages
Book Rating : 4.:/5 (112 download)
Download or read book Design and Fabrication of High-performance Capacitive Micro Accelerometers written by Fatemeh Edalatfar and published by . This book was released on 2018 with total page 125 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thesis presents the development of capacitive high-performance accelerometers for sonar wave detection. Two different designs of in-plane and out-of-plane accelerometers are developed, micro-fabricated, and experimentally tested.The out-of-plane accelerometer is designed based on a continuous membrane suspension element. In comparison to beam-type suspension elements, the new design provides uniform displacement of the proof mass, lower cross-axis sensitivity, and lower stress concentration in suspension elements which could result in higher yield in the fabrication process. The out-of-plane accelerometer is fabricated using a novel microfabrication method which facilitates developing continuous membrane type suspension elements and full wafer thick proof mass for accelerometers. The designed accelerometer is fabricated on a silicon-on-insulator wafer with an 8 μm device layer, 1.5 μm buried-oxide layer, and 500 μm handle wafer. The developed accelerometer is proven to have resonance frequency of 5.2 kHz, sensitivity of ~0.9 pF/g, mechanical noise equivalent acceleration of less than 450 ng/√Hz, and an open loop dynamic range of higher than 130 dB while operating at atmospheric pressure.The in-plane single-axis accelerometer is designed based on a proposed mode-tuned modified structure. In this modified structure, the proof mass is substituted with a moving frame which also provides the area for increasing the number of sensing electrodes. This substitution contributes to widening the bandwidth of the accelerometer by locating the anchors and elastic elements both inside and outside of the moving frame. The designed accelerometer is fabricated on a silicon-on-insulator wafer with a 100μm device layer and high aspect ratio capacitive gaps of ~2 μm. The sensitivity of the accelerometer is measured as ~0.7 pF/g with the total noise equivalent acceleration of less than 500 ng/√Hz in the flat band region of the bandwidth. The resonance frequency of the devices is 4.2 kHz while maintaining a linearity of better than 0.7%. The open loop dynamic range of the accelerometer, while operating at atmospheric pressure, is higher than 135 dB, and the cross-axis sensitivity is less than -30 dB.
Author : Muhammad Shuja Khan
Publisher : LAP Lambert Academic Publishing
ISBN 13 : 9783845409528
Total Pages : 92 pages
Book Rating : 4.4/5 (95 download)
Download or read book Design of a Monolithic 3dof Mems Capacitive Accelerometer written by Muhammad Shuja Khan and published by LAP Lambert Academic Publishing. This book was released on 2011-07 with total page 92 pages. Available in PDF, EPUB and Kindle. Book excerpt: Sensors and devices, based on micromachining technology, known as micro-electro-mechanicalsystems or MEMS, have been received increasing attention so far in recent years. Micromachined inertial sensors, consisting of accelerometers and gyroscopes, are one of the most important types of silicon-based sensor. MEMS capacitive accelerometers have been extensively used in automobiles, inertial navigation systems, earth quake detection and many other bio-medical applications. This book deals with the design of a monolithic 3DOF MEMS capacitive accelerometer using both analytical and numerical techniques. Monolithic accelerometer is a single structure having three individual single axis Accelerometers on a single substrate and utilizes a surface micromachining technology using standard PolyMUMPs process. The designed accelerometer is 3mmx3.1mm in size, has low mechanical noise floor, high sense capacitance and high sensitivity along in-plane (x and y) and out-of-plane (z) axes. Performing a detailed finite element analysis in ANSYS 11.o, physical level simulation has been done to verify the deflection for x, y and z axes with respect to the applied acceleration (g).
Author : Liang-Yee Cheng
Publisher : Springer Nature
ISBN 13 : 3031135881
Total Pages : 1080 pages
Book Rating : 4.0/5 (311 download)
Download or read book ICGG 2022 - Proceedings of the 20th International Conference on Geometry and Graphics written by Liang-Yee Cheng and published by Springer Nature. This book was released on 2022-08-12 with total page 1080 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers recent achievements on the ever-expanding field of Geometry and Graphics on both analogical and digital fronts, from theoretical investigations to a broad range of applications, new teaching methodologies, and historical aspects. It is from 20th International Conference on Geometry and Graphics (ICGG2022), a series of conference that started in 1978 and promoted by International Society for Geometry and Graphics, which aims to foster international collaboration and stimulate the scientific research and teaching innovations in the multidisciplinary field. The contents of the book are organized in: Theoretical Geometry and Graphics; Applied Geometry and Graphics; Engineering Computer Graphics; Graphics Education; Geometry and Graphics in History, and are intent for the academics, researchers, and professionals in architecture, engineering, industrial design, mathematics, and arts.
Author : Ahmad Alfaifi
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (14 download)
Download or read book Surface-micromachined Capacitive Accelerometers in Above-IC Integration Methods written by Ahmad Alfaifi and published by . This book was released on 2018 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: "This thesis proposes a methodology to optimize the design of capacitive accelerometers. This is achieved through a systematic improvement procedure of the closing-gaps accelerometers design. This is used to find the optimum electrode dimensions that would result in the highest sensitivity, within a specified area. The method is verified through the simulation and fabrication of different variations of two designs, then comparing the results with the expected values from analytical optimization methods. The prototypes are fabricated in a commercial process, which imposed limitations on the sizes of the possible accelerometer designs. A survey of prior published works shows the importance of the optimization technique suggested here to increase the performance of these types of sensors, when no fabrication restrictions exist.The thesis also introduces a novel low cross-sensitivity dual-axis capacitive accelerometer design. The device is fabricated in a silicon-on-insulator (SOI) process and its fabrication is finalized by an in-house release step. The device measures 1 mm × 1 mm, with four (4) proof masses that are able to sense accelerations in the X- and Y-axes independently. Two commercial capacitance-to-digital converters are used to read the outputs of both axes of the device in a system in package implementation. The fabricated device exhibits a sensitivity of 16.83 fF/g, while keeping the measured cross-sensitivity to less than 1 % throughout the ±4 g linear range. The rotational motion and Z accelerations have no impact on the device X and Y readings, thanks to the device's particular geometry and differential nature.In addition, the thesis presents a novel design of a 3D high-sensitivity lateral capacitive accelerometer. The accelerometer design utilizes the whole area of the sensor for both the sensing and proof masses, which cancels the tradeoff needed in conventional 2D designs. The design model of the accelerometer is developed to target the highest possible performance. A Z-shaped innovative design of the supporting beams is developed to limit the vertical displacement within the used submicron gap. The accelerometer measures 500 × 500 [mu]m2 and achieves 58 fF/g sensitivity in a ±4 g range in an open-loop system. Suggestions are provided to decrease the 1.4 mg noise floor of the device.Finally, the thesis describes a 3D surface micromachining platform process for above-IC integration. This method uses non-conductive materials with attractive mechanical properties to fabricate micro-electromechanical systems (MEMS) devices. The fixed structures are created using a polyimide layer, while the moving structures are built using silicon nitride (SiN). A 240-nm thin parylene-N polymer layer is used as a sacrificial layer to largely define the capacitive gaps and enable dry release. The photolithography steps are limited to four, in order to ensure a simple and low-cost process. The process has a thermal budget of 300 °C, which should be safe for processing above CMOS integrated circuits. While the used materials provide good results, this process is not limited to these specific materials, and others can be used if needed." --
Author : Felix Levinzon
Publisher : Springer
ISBN 13 : 3319080784
Total Pages : 180 pages
Book Rating : 4.3/5 (19 download)
Download or read book Piezoelectric Accelerometers with Integral Electronics written by Felix Levinzon and published by Springer. This book was released on 2014-08-06 with total page 180 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides an invaluable reference to Piezoelectric Accelerometers with Integral Electronics (IEPE). It describes the design and performance parameters of IEPE accelerometers and their key elements, PE transducers and FET-input amplifiers. Coverage includes recently designed, low-noise and high temperature IEPE accelerometers. Readers will benefit from the detailed noise analysis of the IEPE accelerometer, which enables estimation of its noise floor and noise limits. Other topics useful for designers of low-noise, high temperature silicon-based electronics include noise analysis of FET amplifiers, experimental investigation and comparison of low-frequency noise in different JFETs and MOSFETs, and ultra-low-noise JFETs (at level of 0.6 nV/√Hz). The discussion also includes ultra-low-noise (at level of 3 ng/√Hz) seismic IEPE accelerometers and high temperature (up to 175 ̊C) triaxial and single axis miniature IEPE accelerometers, along with key factors for their design. • Provides a comprehensive reference to the design and performance of IEPE accelerometers, including low-noise and high temperature IEPE sensors; • Includes noise analysis of the IEPE accelerometer, which enables estimation of the its noise floor and noise limits; • Describes recently design of ultra-low-noise (at level of 3 ng/√Hz) IEPE seismic accelerometers and high temperature (up to 175 ̊C) triaxial and single axis miniature IEPE accelerometers; • Compares low-frequency noise in different JFETs and MOSFETs including measurement results of ultra-low-noise (at level of 0.6 nV/√Hz) JFET; • Presents key factors for design of low-noise and high temperature IEPE accelerometer and their electronics.
Author : Md Sohel Mahmood
Publisher :
ISBN 13 :
Total Pages : 156 pages
Book Rating : 4.:/5 (132 download)
Download or read book Design and Fabrication of Self-packaged, Flexible MEMs Accelerometer and Aluminum Nitride Tactile Sensors written by Md Sohel Mahmood and published by . This book was released on 2019 with total page 156 pages. Available in PDF, EPUB and Kindle. Book excerpt: The work presented in this dissertation describes the design, fabrication and characterization of a Micro Electro Mechanical System (MEMS) capacitive accelerometer on a flexible substrate. To facilitate the bending of the accelerometers and make them mountable on a curved surface, polyimide was used as a flexible substrate. Considering its high glass transition temperature and low thermal expansion coefficient, PI5878G was chosen as the underlying flexible substrate. Three different sizes of accelerometers were designed in CoventorWare® software which utilizes Finite Element Method (FEM) to numerically perform various analyses. Capacitance simulation under acceleration, modal analysis, stress and pull-in study were performed in CoventorWare®. A double layer UV-LIGA technique was deployed to electroplate the proof mass for increased sensitivity. The proof mass of the accelerometers was perforated to lower the damping force as well as to facilitate the ashing process of the underlying sacrificial layer. Three different sizes of accelerometers were fabricated and subsequently characterized. The largest accelerometer demonstrated a sensitivity of 187 fF/g at its resonant frequency of 800 Hz. It also showed excellent noise performance with a signal to noise ratio (SNR) of 100:1. The accelerometers were also placed on curved surfaces having radii of 3.8 cm, 2.5 cm and 2.0 cm for flexibility analysis. The sensitivity of the largest device was obtained to be 168 fF/g on a curved surface of 2.0 cm radius. The radii of robotic index and thumb fingertips are 1.0 cm and 3.5 cm, respectively. Therefore, these accelerometers are fully compatible with robotics as well as prosthetics. The accelerometers were later encapsulated by Kapton® superstrate in vacuum environment. Kapton® is a polyimide film which possesses similar glass transition temperature and thermal expansion coefficient to that of the underlying substrate PI5878G. The thickness of the superstrate was optimized to place the intermediate accelerometer on a plane of zero stress. The Kapton® films were pre-etched before bonding to the device wafer, thus avoiding spin-coating a photoresist layer at high rpm and possibly damaging the already released micro-accelerometers in the device wafer. The packaged accelerometers were characterized in the same way the open accelerometers were characterized on both flat and curved surfaces. After encapsulation, the sensitivity of the largest accelerometer on a flat and a curved surface with 2.0 cm radius were obtained to be 195 fF/g and 174 fF/f, respectively. All three accelerometers demonstrated outstanding noise performance after vacuum packaging with an SNR of 100:1. Further analysis showed that the contribution from the readout circuitry is the most dominant noise component followed by the Brownian noise of the accelerometers. The developed stresses in different layers of the accelerometers upon bending the substrates were analyzed. The stresses in all cases were below the yield strength of the respective layer materials. AlN cantilevers as tactile sensors were also fabricated and characterized on a flexible substrate. Ti was utilized as the bottom and the top electrode for its smaller lattice mismatch to AlN compared to Pt and Al. The piezoelectric layer of AlN was annealed after sputtering which resulted in excellent crystalline orientation. The XRD peak corresponding to AlN (002) plane was obtained at 36.54o. The fabricated AlN cantilevers were capable of sensing pressures from 100 kPa to 850 kPa which includes soft touching of human index finger and grasping of an object. The sensitivities of the cantilevers were between 1.90 × 10-4 V/kPa and 2.04 × 10-4 V/kPa. The stresses inside the AlN and Ti layer, developed upon full bending, were below the yield strength of the respective layer materials.
Author : R. K. Sharma
Publisher : Springer
ISBN 13 : 3319976044
Total Pages : 1299 pages
Book Rating : 4.3/5 (199 download)
Download or read book The Physics of Semiconductor Devices written by R. K. Sharma and published by Springer. This book was released on 2019-01-31 with total page 1299 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book disseminates the current knowledge of semiconductor physics and its applications across the scientific community. It is based on a biennial workshop that provides the participating research groups with a stimulating platform for interaction and collaboration with colleagues from the same scientific community. The book discusses the latest developments in the field of III-nitrides; materials & devices, compound semiconductors, VLSI technology, optoelectronics, sensors, photovoltaics, crystal growth, epitaxy and characterization, graphene and other 2D materials and organic semiconductors.
Author : Dongning Zhao
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (642 download)
Download or read book A Low-noise Cmos Interface for Capacitive Microaccelerometers written by Dongning Zhao and published by . This book was released on 2009 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The high-performance accelerometers with micro-gravity resolution and large dynamic range at very low frequencies are not only used in GPS-augmented inertial navigation, monitoring of aircrafts and space station, but also used in monitoring wind turbines for green energy. This dissertation presents the design and development of a mixed-signal, low-noise, and fourth-order sigma-delta interface circuit for the MEMS capacitive micro-gravity accelerometer. A fully-differential switched-capacitor (SC) amplifier architecture is developed with the low-frequency noise reduction through the integration of chopper-stabilization technique with lateral BJT at input stage. The effectiveness of different noise reduction techniques is also compared and verified. The application of fourth-order SC sigma-delta modulation concept to the inertial-grade accelerometer is to achieve the benefits of the digitization of the accelerometer output without compromising the resolution of the analog front-end. This open-loop interface provides 1-bit digital output stream and has the versatility of interfacing sensors with different sensitivities while maintaining minimum power dissipation and maximum dynamic range. The micromechanical accelerometers are fabricated in thick silicon-on-insulator (SOI) substrates. The accelerometer operates in air and is designed for non-peaking response with a bandwidth of 500 Hz.
Author : Adel Merdassi
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (979 download)
Download or read book Ultra-clean Wafer-level Vacuum Encapsulated Inertial Sensors Using a Commercial Process written by Adel Merdassi and published by . This book was released on 2017 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: "Inertial sensors, such as accelerometers and gyroscopes, have become ubiquitous in our daily lives and are found in a variety of devices and applications that require measurement of motion, direction, vibration and orientation. These integrated sensors benefiting from the tremendous advancements in microfabrication technology continue to grow rapidly providing efficient control and continuous monitoring in a variety of applications including smartdevices, automotive, aerospace, and industrial robotics. Here, both the choice of the fabrication technology and the design of the sensor devices play an important role to develop high performance MicroElectroMechanical Systems (MEMS) inertial sensors to insure stability, repeatability and accuracy of the measurements during operation. Literature review of MEMS inertial sensors reveals that many of these sensors are developed using full custom or proprietary micromachining processes. Till recently, standard pure-play MEMS processes had several limitations including choice of materials and lack of wafer-level vacuum packaging that made them incapable to support development of integrated inertial sensors with high performance specifications. Recently, the availability of standard pure-play MEMS processes that offer excellent advantages in high quality materials and advanced packaging could lead to development of new inertial sensors that can be readily mass-produced. These devices could help towards lowering the cost of devices with increased competition to existing players in the market and pursuing niche application areas that cannot be satisfied by available devices in the market. The present research aims to design, fabricate and characterize high performance novel integrated capacitive inertial sensors including both single axial and multi-axis accelerometer and a multi-axis gyroscope for angular rate measurement. The developed devices are based on two standard pure-play processes offered by Teledyne DALSA Semiconductor Inc. (TDSI). In 2013, TDSI introduced MEMS Integrated Design for Inertial Sensors (MIDIS) process, which is currently the only commercial MEMS process that includes ultra-clean wafer-level vacuum encapsulation of the MEMS devices at 10 mTorr. MIDIS process helps towards achieving a high Quality factor and reducing noise interference on the MEMS sensor devices. The developed inertial sensors in MIDIS process include a uniaxial accelerometer with ultra-low noise performance enabling resolution of 33mg over a high-g range of ±100g, tri-axial accelerometer with very low cross-axis sensitivity of 0.8%, and rate grade gyroscope with high Quality factor (> 50,000). This research is the first demonstration of wafer-level vacuum packaging of MEMS inertial sensors in a high volume pure-play MEMS process. " --
Author : Navid Yazdi
Publisher :
ISBN 13 :
Total Pages : 320 pages
Book Rating : 4.3/5 (91 download)
Download or read book Micro-g Silicon Accelerometers with High Performance CMOS Interface Circuitry written by Navid Yazdi and published by . This book was released on 1999 with total page 320 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
ISBN 13 : 9780780382657
Total Pages : 926 pages
Book Rating : 4.3/5 (826 download)
Download or read book 17th IEEE International Conference on Micro Electro Mechanical Systems written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 2004 with total page 926 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Xu, Yong Ping
Publisher : River Publishers
ISBN 13 : 877022045X
Total Pages : 312 pages
Book Rating : 4.7/5 (72 download)
Download or read book MEMS Silicon Oscillating Accelerometers and Readout Circuits written by Xu, Yong Ping and published by River Publishers. This book was released on 2019-02-12 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Most MEMS accelerometers on the market today are capacitive accelerometers that are based on the displacement sensing mechanism. This book is intended to cover recent developments of MEMS silicon oscillating accelerometers (SOA), also referred to as MEMS resonant accelerometer. As contrast to the capacitive accelerometer, the MEMS SOA is based on the force sensing mechanism, where the input acceleration is converted to a frequency output. MEMS Silicon Oscillating Accelerometers and Readout Circuits consists of six chapters and covers both MEMS sensor and readout circuit, and provides an in-depth coverage on the design and modelling of the MEMS SOA with several recently reported prototypes. The book is not only useful to researchers and engineers who are familiar with the topic, but also appeals to those who have general interests in MEMS inertial sensors. The book includes extensive references that provide further information on this topic.
Author : Arvind Sanjiva Salian
Publisher :
ISBN 13 :
Total Pages : 406 pages
Book Rating : 4.3/5 (91 download)
Download or read book Design, Fabrication and Testing of High-performance Capacitive Microaccelerometers written by Arvind Sanjiva Salian and published by . This book was released on 2001 with total page 406 pages. Available in PDF, EPUB and Kindle. Book excerpt:
