High-level Estimation and Exploration of Reliability for Multi-Processor System-on-Chip

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Publisher : Springer
ISBN 13 : 9811010730
Total Pages : 210 pages
Book Rating : 4.8/5 (11 download)

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Book Synopsis High-level Estimation and Exploration of Reliability for Multi-Processor System-on-Chip by : Zheng Wang

Download or read book High-level Estimation and Exploration of Reliability for Multi-Processor System-on-Chip written by Zheng Wang and published by Springer. This book was released on 2017-06-23 with total page 210 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book introduces a novel framework for accurately modeling the errors in nanoscale CMOS technology and developing a smooth tool flow at high-level design abstractions to estimate and mitigate the effects of errors. The book presents novel techniques for high-level fault simulation and reliability estimation as well as architecture-level and system-level fault tolerant designs. It also presents a survey of state-of-the-art problems and solutions, offering insights into reliability issues in digital design and their cross-layer countermeasures.

High-level Estimation and Exploration of Reliability for Multi-processor System-on-chip

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ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (975 download)

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Book Synopsis High-level Estimation and Exploration of Reliability for Multi-processor System-on-chip by : Zheng Wang

Download or read book High-level Estimation and Exploration of Reliability for Multi-processor System-on-chip written by Zheng Wang and published by . This book was released on 2015 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Design of Cost-Efficient Interconnect Processing Units

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Publisher : CRC Press
ISBN 13 : 1420044729
Total Pages : 292 pages
Book Rating : 4.4/5 (2 download)

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Book Synopsis Design of Cost-Efficient Interconnect Processing Units by : Marcello Coppola

Download or read book Design of Cost-Efficient Interconnect Processing Units written by Marcello Coppola and published by CRC Press. This book was released on 2020-10-14 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt: Streamlined Design Solutions Specifically for NoC To solve critical network-on-chip (NoC) architecture and design problems related to structure, performance and modularity, engineers generally rely on guidance from the abundance of literature about better-understood system-level interconnection networks. However, on-chip networks present several distinct challenges that require novel and specialized solutions not found in the tried-and-true system-level techniques. A Balanced Analysis of NoC Architecture As the first detailed description of the commercial Spidergon STNoC architecture, Design of Cost-Efficient Interconnect Processing Units: Spidergon STNoC examines the highly regarded, cost-cutting technology that is set to replace well-known shared bus architectures, such as STBus, for demanding multiprocessor system-on-chip (SoC) applications. Employing a balanced, well-organized structure, simple teaching methods, numerous illustrations, and easy-to-understand examples, the authors explain: how the SoC and NoC technology works why developers designed it the way they did the system-level design methodology and tools used to configure the Spidergon STNoC architecture differences in cost structure between NoCs and system-level networks From professionals in computer sciences, electrical engineering, and other related fields, to semiconductor vendors and investors – all readers will appreciate the encyclopedic treatment of background NoC information ranging from CMPs to the basics of interconnection networks. The text introduces innovative system-level design methodology and tools for efficient design space exploration and topology selection. It also provides a wealth of key theoretical and practical MPSoC and NoC topics, such as technological deep sub-micron effects, homogeneous and heterogeneous processor architectures, multicore SoC, interconnect processing units, generic NoC components, and embeddings of common communication patterns.

Multiprocessor Systems on Chip

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Publisher : Springer
ISBN 13 : 9781441981523
Total Pages : 189 pages
Book Rating : 4.9/5 (815 download)

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Book Synopsis Multiprocessor Systems on Chip by : Torsten Kempf

Download or read book Multiprocessor Systems on Chip written by Torsten Kempf and published by Springer. This book was released on 2011-02-21 with total page 189 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book gives a comprehensive introduction to the design challenges of MPSoC platforms, focusing on early design space exploration. It defines an iterative methodology to increase the abstraction level so that evaluation of design decisions can be performed earlier in the design process. These techniques enable exploration on the system level before undertaking time- and cost-intensive development.

Retargetable Processor System Integration into Multi-Processor System-on-Chip Platforms

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Publisher : Springer Science & Business Media
ISBN 13 : 1402086520
Total Pages : 167 pages
Book Rating : 4.4/5 (2 download)

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Book Synopsis Retargetable Processor System Integration into Multi-Processor System-on-Chip Platforms by : Andreas Wieferink

Download or read book Retargetable Processor System Integration into Multi-Processor System-on-Chip Platforms written by Andreas Wieferink and published by Springer Science & Business Media. This book was released on 2008-07-08 with total page 167 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a methodology and the associated tooling for enabling design space exploration as well as a successive refinement flow for the design of optimized MP-SoCs with a high degree of automation.

Multi-Processor System-on-Chip 2

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Publisher : John Wiley & Sons
ISBN 13 : 1119818400
Total Pages : 272 pages
Book Rating : 4.1/5 (198 download)

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Book Synopsis Multi-Processor System-on-Chip 2 by :

Download or read book Multi-Processor System-on-Chip 2 written by and published by John Wiley & Sons. This book was released on 2021-03-31 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt: A Multi-Processor System-on-Chip (MPSoC) is the key component for complex applications. These applications put huge pressure on memory, communication devices and computing units. This book, presented in two volumes – Architectures and Applications – therefore celebrates the 20th anniversary of MPSoC, an interdisciplinary forum that focuses on multi-core and multi-processor hardware and software systems. It is this interdisciplinarity which has led to MPSoC bringing together experts in these fields from around the world, over the last two decades. Multi-Processor System-on-Chip 2 covers application-specific MPSoC design, including compilers and architecture exploration. This second volume describes optimization methods, tools to optimize and port specific applications on MPSoC architectures. Details on compilation, power consumption and wireless communication are also presented, as well as examples of modeling frameworks and CAD tools. Explanations of specific platforms for automotive and real-time computing are also included.

Multiprocessor System-on-Chip

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Publisher : Springer Science & Business Media
ISBN 13 : 1441964606
Total Pages : 268 pages
Book Rating : 4.4/5 (419 download)

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Book Synopsis Multiprocessor System-on-Chip by : Michael Hübner

Download or read book Multiprocessor System-on-Chip written by Michael Hübner and published by Springer Science & Business Media. This book was released on 2010-11-25 with total page 268 pages. Available in PDF, EPUB and Kindle. Book excerpt: The purpose of this book is to evaluate strategies for future system design in multiprocessor system-on-chip (MPSoC) architectures. Both hardware design and integration of new development tools will be discussed. Novel trends in MPSoC design, combined with reconfigurable architectures are a main topic of concern. The main emphasis is on architectures, design-flow, tool-development, applications and system design.

Multi-Core Embedded Systems

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Publisher : CRC Press
ISBN 13 : 1439811628
Total Pages : 502 pages
Book Rating : 4.4/5 (398 download)

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Book Synopsis Multi-Core Embedded Systems by : Georgios Kornaros

Download or read book Multi-Core Embedded Systems written by Georgios Kornaros and published by CRC Press. This book was released on 2018-10-08 with total page 502 pages. Available in PDF, EPUB and Kindle. Book excerpt: Details a real-world product that applies a cutting-edge multi-core architecture Increasingly demanding modern applications—such as those used in telecommunications networking and real-time processing of audio, video, and multimedia streams—require multiple processors to achieve computational performance at the rate of a few giga-operations per second. This necessity for speed and manageable power consumption makes it likely that the next generation of embedded processing systems will include hundreds of cores, while being increasingly programmable, blending processors and configurable hardware in a power-efficient manner. Multi-Core Embedded Systems presents a variety of perspectives that elucidate the technical challenges associated with such increased integration of homogeneous (processors) and heterogeneous multiple cores. It offers an analysis that industry engineers and professionals will need to understand the physical details of both software and hardware in embedded architectures, as well as their limitations and potential for future growth. Discusses the available programming models spread across different abstraction levels The book begins with an overview of the evolution of multiprocessor architectures for embedded applications and discusses techniques for autonomous power management of system-level parameters. It addresses the use of existing open-source (and free) tools originating from several application domains—such as traffic modeling, graph theory, parallel computing and network simulation. In addition, the authors cover other important topics associated with multi-core embedded systems, such as: Architectures and interconnects Embedded design methodologies Mapping of applications

Analyse Et Caractérisation Des Couplages Substrat Et de la Connectique Dans Les Circuits 3D

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Publisher : Editions Publibook
ISBN 13 : 2753903298
Total Pages : 178 pages
Book Rating : 4.7/5 (539 download)

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Book Synopsis Analyse Et Caractérisation Des Couplages Substrat Et de la Connectique Dans Les Circuits 3D by : Fengyuan Sun

Download or read book Analyse Et Caractérisation Des Couplages Substrat Et de la Connectique Dans Les Circuits 3D written by Fengyuan Sun and published by Editions Publibook. This book was released on 2016 with total page 178 pages. Available in PDF, EPUB and Kindle. Book excerpt: The proposal of doubling the number of transistors on an IC chip (with minimum costs and subtle innovations) every 24 months by Gordon Moore in 1965 (the so-called called Moore's law) has been the most powerful driver for the emphasis of the microelectronics industry in the past 50 years. This law enhances lithography scaling and integration, in 2D, of all functions on a single chip, increasingly through system-on-chip (SOC). On the other hand, the integration of all these functions can be achieved through 3D integrations . Generally speaking, 3D integration consists of 3D IC packaging, 3D IC integration, and 3D Si integration. They are different and mostly the TSV (through-silicon via) separates 3D IC packaging from 3D IC/Si integrations since the latter two uses TSVs, but 3D IC packaging does not. TSV (with a new concept that every chip or interposer could have two surfaces with circuits) is the heart of 3D IC/Si integrations. Continued technology scaling together with the integration of disparate technologies in a single chip means that device performance continues to outstrip interconnect and packaging capabilities, and hence there exist many difficult engineering challenges, most notably in power management, noise isolation, and intra and inter-chip communication. 3D Si integration is the right way to go and compete with Moore's law (more than Moore versus more Moore). However, it is still a long way to go. In this book, Fengyuan SUN proposes new substrate network extraction techniques. Using this latter, the substrate coupling and loss in IC's can be analyzed. He implements some Green/TLM (Transmission Line Matrix) algorithms in MATLAB. It permits to extract impedances between any number of embedded contacts or/and TSVS. He does investigate models of high aspect ratio TSV, on both analytical and numerical methods electromagnetic simulations. This model enables to extract substrate and TSV impedance, S parameters and parasitic elements, considering the variable resistivity of the substrate. It is full compatible with SPICE-like solvers and should allow an investigation in depth of TSV impact on circuit performance.

Energy Efficient Computing & Electronics

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Publisher : CRC Press
ISBN 13 : 1351779850
Total Pages : 437 pages
Book Rating : 4.3/5 (517 download)

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Book Synopsis Energy Efficient Computing & Electronics by : Santosh K. Kurinec

Download or read book Energy Efficient Computing & Electronics written by Santosh K. Kurinec and published by CRC Press. This book was released on 2019-01-31 with total page 437 pages. Available in PDF, EPUB and Kindle. Book excerpt: In our abundant computing infrastructure, performance improvements across most all application spaces are now severely limited by the energy dissipation involved in processing, storing, and moving data. The exponential increase in the volume of data to be handled by our computational infrastructure is driven in large part by unstructured data from countless sources. This book explores revolutionary device concepts, associated circuits, and architectures that will greatly extend the practical engineering limits of energy-efficient computation from device to circuit to system level. With chapters written by international experts in their corresponding field, the text investigates new approaches to lower energy requirements in computing. Features • Has a comprehensive coverage of various technologies • Written by international experts in their corresponding field • Covers revolutionary concepts at the device, circuit, and system levels

Pipelined Multiprocessor System-on-Chip for Multimedia

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Publisher : Springer
ISBN 13 : 9783319347110
Total Pages : 0 pages
Book Rating : 4.3/5 (471 download)

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Book Synopsis Pipelined Multiprocessor System-on-Chip for Multimedia by : Haris Javaid

Download or read book Pipelined Multiprocessor System-on-Chip for Multimedia written by Haris Javaid and published by Springer. This book was released on 2016-08-27 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes analytical models and estimation methods to enhance performance estimation of pipelined multiprocessor systems-on-chip (MPSoCs). A framework is introduced for both design-time and run-time optimizations. For design space exploration, several algorithms are presented to minimize the area footprint of a pipelined MPSoC under a latency or a throughput constraint. A novel adaptive pipelined MPSoC architecture is described, where idle processors are transitioned into low-power states at run-time to reduce energy consumption. Multi-mode pipelined MPSoCs are introduced, where multiple pipelined MPSoCs optimized separately are merged into a single pipelined MPSoC, enabling further reduction of the area footprint by sharing the processors and communication buffers. Readers will benefit from the authors’ combined use of analytical models, estimation methods and exploration algorithms and will be enabled to explore billions of design points in a few minutes.

CASES ...

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Publisher :
ISBN 13 :
Total Pages : 460 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis CASES ... by :

Download or read book CASES ... written by and published by . This book was released on 2006 with total page 460 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Analysis and Optimization of Transaction Level Models for Multi-processor System-on-chip Design

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Publisher :
ISBN 13 : 9780549677550
Total Pages : 286 pages
Book Rating : 4.6/5 (775 download)

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Book Synopsis Analysis and Optimization of Transaction Level Models for Multi-processor System-on-chip Design by : Hans Gunar Schirner

Download or read book Analysis and Optimization of Transaction Level Models for Multi-processor System-on-chip Design written by Hans Gunar Schirner and published by . This book was released on 2008 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: The increasing complexity of modern embedded systems and systems-on-chip poses great challenges to the design process. An exploding number of alternatives has to be considered during the design process. Additionally, the amount of software with tight coupling to underlying hardware increases in current designs, adding another complexity dimension.

Modeling and Performance Estimation for Multiprocessor System On Chip Architectures

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Publisher :
ISBN 13 : 9783959470643
Total Pages : 0 pages
Book Rating : 4.4/5 (76 download)

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Book Synopsis Modeling and Performance Estimation for Multiprocessor System On Chip Architectures by : Nairuhi Grigoryan

Download or read book Modeling and Performance Estimation for Multiprocessor System On Chip Architectures written by Nairuhi Grigoryan and published by . This book was released on 2023 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Applied Reconfigurable Computing

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Publisher : Springer
ISBN 13 : 3319162144
Total Pages : 564 pages
Book Rating : 4.3/5 (191 download)

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Book Synopsis Applied Reconfigurable Computing by : Kentaro Sano

Download or read book Applied Reconfigurable Computing written by Kentaro Sano and published by Springer. This book was released on 2015-03-30 with total page 564 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the refereed proceedings of the 11th International Symposium on Applied Reconfigurable Computing, ARC 2015, held in Bochum, Germany, in April 2015. The 23 full papers and 20 short papers presented in this volume were carefully reviewed and selected from 85 submissions. They are organized in topical headings named: architecture and modeling; tools and compilers; systems and applications; network-on-a-chip; cryptography applications; extended abstracts of posters. In addition, the book contains invited papers on funded R&D - running and completed projects and Horizon 2020 funded projects.

Power-aware Processor System Design

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Publisher :
ISBN 13 :
Total Pages : 436 pages
Book Rating : 4.:/5 (125 download)

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Book Synopsis Power-aware Processor System Design by : Vijay Kiran Kalyanam

Download or read book Power-aware Processor System Design written by Vijay Kiran Kalyanam and published by . This book was released on 2020 with total page 436 pages. Available in PDF, EPUB and Kindle. Book excerpt: With everyday advances in technology and low-cost economics, processor systems are moving towards split grid shared power delivery networks (PDNs) while providing increased functionality and higher performance capabilities resulting in increased power consumption. Split grid refers to dividing up the power grid resources among various homogeneous and heterogeneous functional modules and processors. When the PDN is shared and common across multiple processors and function blocks, it is called a Shared PDN. In order to keep the power in control on a split-grid shared PDN, the processor system is required to operate when various hardware modules interact with each other while the supply voltage (V [subscript DD]) and clock frequency (F [subscript CLK]) are scaled. Software or hardware assisted power-collapse and low-power retention modes can be automatically engaged in the processor system. The processor system should also operate at maximum performance under power constraints while consuming the full thermal design power (TDP). The processor system should neither violate board and card current limits nor the power management integrated circuit (PMIC) limits or its slew rate requirements for current draw on the shared PDN. It is expected to operate within thermal limits below an operating temperature. The processor system is also required to detect and mitigate current violations within microseconds and temperature violations in milliseconds. The processor system is expected to be robust and should be able to tolerate voltage droops. Its importance is highlighted with the processor system being on shared PDN. Because of the sharing of the PDN, the voltage droop mitigation scheme is expected to be quick and must suppress V [subscript DD] droop propagation at the source while only introducing negligible performance penalties during this mitigation. Without a solution for V [subscript DD] droop in place, the entire V [subscript DD] of shared PDN is forced to be at a higher voltage, increasing overall system power. This can potentially affect the days of use (DoU) of battery-operated systems, and reliability and cooling of wired systems. A multi-threaded processor system is expected to monitor the current, power and voltage violations and react quickly without affecting the performance of its hardware threads while maintaining quality of service (QoS). Early high-level power estimates are a necessity to project how much power will be consumed by a future processor system. These power projections are used to plan for software use cases and to reassign power-domains of processors and function blocks belonging to the shared PDN. Additionally, it helps to re-design boards and power-cards, re-implement the PDN, change PMIC and plan for additional power, current, voltage and temperature violation related mitigation schemes if the existing solutions are insufficient. The split grid shared PDN that is implemented in a system-on-chip (SoC) is driven by low cost electronics and forces multiple voltage rails for a better energy efficiency. To support this, there is a need for incorporation of voltage levels and power-states into a processor behavioral register transfer level (RTL) model. Low power verification is a must in a split-grid PDN. To facilitate these, the RTL is annotated with voltage supplies and isolation circuits that engage and protect during power collapse scenarios across various voltage domains. The power-aware RTL design is verified, identified and corrected for low power circuit and RTL bugs prior to tape-out. The mandatory features to limit current, power, voltage and temperatures in these high performance and power hungry processor systems introduce a need to provide high level power projections for a processor system accounting for various split-grid PDN supplying V [subscript DD] to the processor, the interface bus, various function blocks, and co-processors. To solve this problem, a power prediction solution is provided that has an average-power error of 8% in prediction and works with reasonable accuracy by tracking instantaneous power for unknown software application traces. The compute time to calculate power using the generated prediction model is 100000X faster and uses 100X less compute memory compared to a commercial electronic design automation (EDA) RTL power tool. This solution is also applied to generate a digital power meter (DPM) in hardware for real-time power estimates while the processor is operational. These high-level power estimates project the potential peak-currents in these processor systems. This resulted in a need for new tests to be created and validated on silicon in order to functionally stress the split-grid shared PDN for extreme voltage droop and sustained high current usage scenarios. For this reason, functional test sequences are created for high power and voltage stress testing of multi-threaded processors. The PDN is a complex system and needs different functional test sequences to generate various kinds of high and low power instruction packets that can stress it. These voltage droop stress tests affect V [subscript MIN] margins in various voltage and frequency modes of operation in a commercial multi-threaded processor. These results underscore a need for voltage mitigation solutions. The processor system operating on a split grid shared PDN can have its V [subscript MIN] increased due to voltage stress tests or a power-virus software application. The shared PDN imposes requirements to mitigate the voltage noise at the source and avoid any possibility of increases to the shared PDN V [subscript DD]. This necessitates implementing a proactive system that can mitigate voltage droop before it occurs while lowering the processor’s minimum voltage of operation (V [subscript MIN]) to help in system power reduction. To mitigate the voltage droops, a proactive clock gating system (PCGS) is implemented with a voltage clock gate (VCG) circuit that uses a digital power meter (DPM) and a model of a PDN to predict the voltage droop before its occurrence. Silicon results show PCGS achieves 10% higher clock frequency (F [subscript CLK]) and 5% lower supply voltage (V [subscript DD]) in a 7nm processor. Questions arise about the effectiveness of PCGS over a reactive voltage droop mitigation scheme in the context of a shared PDN. This results in analysis of PCGS and its comparison against a reactive voltage droop mitigation scheme. This work shows the importance of voltage droop mitigation reaction time for a split grid shared PDN and highlights benefits of PCGS in its ability to provide better V [subscript MIN] of the entire split grid shared PDN. The silicon results from power-stress tests shows the possibility of the high-power processor system exceeding board or power-supply card current capacity and thermal violations. This requires designing a limiting system that can adapt processor performance. This limiting system is expected to meet the stringent system latency of 1 μs for sustained peak-current violations and react in the order of milli-seconds for thermal mitigation. It is also expected of this system to maintain the desired Quality of Service (QoS) of the multi-threaded processor. This results in implementation of a current and temperature limiting response circuit in a 7nm commercial processor. The randomized pulse modulation (RPM) circuit adapts processor performance and reduces current violations in the system within 1 μs and maintains thread fairness with a 0.4% performance resolution across a wide range of operation from 100% to 0.4%. Hard requirements from SoC software and hardware require the processor systems to be within the TDP and power budgets and processors sharing the split gird PDN. Power consumed by the threads (processors) are now exceeded by added functionality of new threads (processors), which could consume much higher power compared to power of previous generation processors. The threads (processors) operate cohesively in a multi-threaded processor system and though there is a large difference in magnitude of power profiles across threads (processors), the overall performance of the multi-threaded processor is not expected to be compromised. This enforces a need for a power limiting system that can specifically slow down the high-power threads (processors) to meet power-budgets and not affect performance of low-power threads. For this reason, a thread specific multi-thread power limiting (MTPL) mechanism is designed that monitors the processor power consumption using the per thread DPM (PTDPM). Implemented in 7nm for a commercial processor, silicon results demonstrate that the thread specific MTPL does not affect the performance of low power threads during power limiting until the current (power) is limited to very low values. For high power threads and during higher current (power) limiting scenarios, the thread specific MTPL shows similar performance to a conventional global limiting mechanism. Thus, the thread specific MTPL enables the multi-threaded processor system to operate at a higher overall performance compared to a conventional global mechanism across most of the power budget range. For the same power budget, the processor performance can be up to 25% higher using the thread specific MPTL compared to using a global power limiting scheme. In summary, in this dissertation design for power concepts are presented for a processor system on a split-grid shared PDN through various solutions that address challenges in high-power processors and help alleviate potential problems. These solutions range from embedding power-intent, to incorporating voltage droop prediction intelligence through power usage estimation, maintaining quality of service within a stringent system latency, to slowing down specific high-power threads of a multi-threaded processor. All these methods can work cohesively to incorporate power-awareness in the processor systems, making the processors energy efficient and operate reliably within the TDP

Multiprocessor System-On-Chip

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Author :
Publisher : Springer
ISBN 13 : 9781441964618
Total Pages : 280 pages
Book Rating : 4.9/5 (646 download)

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Book Synopsis Multiprocessor System-On-Chip by : Michael H Bner

Download or read book Multiprocessor System-On-Chip written by Michael H Bner and published by Springer. This book was released on 2011-03-30 with total page 280 pages. Available in PDF, EPUB and Kindle. Book excerpt: