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Heterogeneous Optoelectronics Integration
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Book Synopsis Heterogeneous Optoelectronics Integration by : Elias Towe
Download or read book Heterogeneous Optoelectronics Integration written by Elias Towe and published by SPIE Press. This book was released on 2000 with total page 304 pages. Available in PDF, EPUB and Kindle. Book excerpt: Numerous efforts are directed at investigating the use of optics at short distances--for example, at the chip-to-chip and board-to-board levels of the interconnection hierarchy. This book provides an overview of the state of the art in heterogeneous integration of electronics, optoelectronics, and micro-optics for short-distance optical interconnections.
Book Synopsis Heterogeneous Optoelectronics Integration by : Elias Towe
Download or read book Heterogeneous Optoelectronics Integration written by Elias Towe and published by . This book was released on 2000 with total page 281 pages. Available in PDF, EPUB and Kindle. Book excerpt: Numerous efforts are directed at investigating the use of optics at short distances--for example, at the chip-to-chip and board-to-board levels of the interconnection hierarchy. This book provides an overview of the state of the art in heterogeneous integration of electronics, optoelectronics, and micro-optics for short-distance optical interconnections.
Book Synopsis Heterogeneous Integrations by : John H. Lau
Download or read book Heterogeneous Integrations written by John H. Lau and published by Springer. This book was released on 2019-04-03 with total page 368 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
Book Synopsis Heterogeneous Integration by : Anis Husain
Download or read book Heterogeneous Integration written by Anis Husain and published by SPIE-International Society for Optical Engineering. This book was released on 1998 with total page 290 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.
Book Synopsis Optoelectronic Integration: Physics, Technology and Applications by : Osamu Wada
Download or read book Optoelectronic Integration: Physics, Technology and Applications written by Osamu Wada and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 464 pages. Available in PDF, EPUB and Kindle. Book excerpt: As we approach the end of the present century, the elementary particles of light (photons) are seen to be competing increasingly with the elementary particles of charge (electrons/holes) in the task of transmitting and processing the insatiable amounts of infonnation needed by society. The massive enhancements in electronic signal processing that have taken place since the discovery of the transistor, elegantly demonstrate how we have learned to make use of the strong interactions that exist between assemblages of electrons and holes, disposed in suitably designed geometries, and replicated on an increasingly fine scale. On the other hand, photons interact extremely weakly amongst themselves and all-photonic active circuit elements, where photons control photons, are presently very difficult to realise, particularly in small volumes. Fortunately rapid developments in the design and understanding of semiconductor injection lasers coupled with newly recognized quantum phenomena, that arise when device dimensions become comparable with electronic wavelengths, have clearly demonstrated how efficient and fast the interaction between electrons and photons can be. This latter situation has therefore provided a strong incentive to devise and study monolithic integrated circuits which involve both electrons and photons in their operation. As chapter I notes, it is barely fifteen years ago since the first demonstration of simple optoelectronic integrated circuits were realised using m-V compound semiconductors; these combined either a laser/driver or photodetector/preamplifier combination.
Book Synopsis Self-Organized 3D Integrated Optical Interconnects by : Tetsuzo Yoshimura
Download or read book Self-Organized 3D Integrated Optical Interconnects written by Tetsuzo Yoshimura and published by CRC Press. This book was released on 2021-03-09 with total page 364 pages. Available in PDF, EPUB and Kindle. Book excerpt: Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE modules, in which discrete bulk-chip OE/electronic devices are assembled using the flip-chip-bonding-based packaging technology. OE modules, however, are not applicable to intra-box optical interconnects, because intra-box interconnects involve “short line distances of the cm–mm order” and “large line counts of hundreds-thousands.” This causes optics excess, namely, excess components, materials, spaces, fabrication efforts for packaging, and design efforts. The optics excess raises sizes and costs of intra-box optical interconnects enormously when they are built using conventional OE modules. This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects.
Book Synopsis Integrated Optoelectronics by : Mario Dagenais
Download or read book Integrated Optoelectronics written by Mario Dagenais and published by Academic Press. This book was released on 2013-10-22 with total page 704 pages. Available in PDF, EPUB and Kindle. Book excerpt: Integrated optoelectronics is becoming ever more important to communications, computer, and consumer industries. It is the enabling technology in a variety of systems, ranging from low-cost, robust optical componentsin consumer electronics to high-performance broadband information networks capable of supporting video and multimedia conferencing. The requirements for producing low-cost, highly reliable components for deployment in these new systems have created a technology challenge. Integrated optoelectronics promises to meet the performance and cost objectives of these applications by integrating both optical and electronic components in a highly functional chip. This book provides an overview of this exciting newtechnology. Integrated Optoelectronics brings together a group of acknowledged experts from both universities and industry around the world to focus on a common theme of integration. These experts have reported not only on the state-of-the-art, but also on the physics and design experience that goes into implementing integrated chips and modules. This book is a cohesive series of articles that includes a discussion of the intimate trade-offs between materials, processes, devices, functional blocks, packaging,and systems requirements in a truly integrated technology. This integration encompasses electrical, optoelectronic, and optical devices onto monolithic or hybrid chips, and into multichip modules. This volume surveys state-of-the-art research activities in integrated optoelectronics and gathers most of the important references into a single place. It outlines the major issues involved in integrating both optical and electronic components, provides an overview of design and fabrication concepts, and discusses the issues involved in bringing these new chips to the marketplace. This exciting new book: Provides a broad overview of the optoelectronic field, including materials processing, devices, and systems applications Features authors who are acknowledged research experts in this field, from both industry and universities around the world Includes new information on device fabrication, including the latest epitaxial growth and lift-off techniques to permit the mixing of dissimilar materials onto single chips Covers planar processed laser fabrication leading to wafer level automated testing Discusses optimization of devices for integration, including a detailed treatment of the vertical emitting laser and theoretical and experimental coverage of optimization of photodetectors for integration into receiver chips Describes design approaches for multifunctional chips, including photonic circuits for all-optical networks and the design of integrated optoelectronic chips with lasers, photodiodes, and electronic ICs Covers the infrastructure needed to support an integrated technology, including automated design systems which treat both optical and electrical circuits, and multichip packaging approaches for both optical and IC chips
Book Synopsis Current Trends In Integrated Optoelectronics by : Tien Pei Lee
Download or read book Current Trends In Integrated Optoelectronics written by Tien Pei Lee and published by World Scientific. This book was released on 1994-08-26 with total page 148 pages. Available in PDF, EPUB and Kindle. Book excerpt: This compilation of review articles by leading experts presents clearly the trend in future optoelectronic devices. It is clear that optoelectronic and photonic integration help to further improve high-speed system capabilities and increase the total systems and network capacities with WDM technology. The foundation of the integration technology is based on quantum well materials, and advanced epitaxial growth and device processing techniques. The integrated laser/ modulators, multi-wavelength laser arrays, and OEIC receivers have demonstrated the feasibility of this technology, but much work remains to be done to put such technology to practice.
Book Synopsis Heterogeneous Integration Technology for Hybrid Optoelectronic and Electronic Device and Module Fabrication by : Michael Sungchun Jin
Download or read book Heterogeneous Integration Technology for Hybrid Optoelectronic and Electronic Device and Module Fabrication written by Michael Sungchun Jin and published by . This book was released on 1998 with total page 302 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :Alfred Driessen Publisher :SPIE-International Society for Optical Engineering ISBN 13 : Total Pages :304 pages Book Rating :4.3/5 (91 download)
Book Synopsis Laser Diodes, Optoelectronic Devices, and Heterogenous Integration by : Alfred Driessen
Download or read book Laser Diodes, Optoelectronic Devices, and Heterogenous Integration written by Alfred Driessen and published by SPIE-International Society for Optical Engineering. This book was released on 2003 with total page 304 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Introduction to Organic Electronic and Optoelectronic Materials and Devices by : Sam-Shajing Sun
Download or read book Introduction to Organic Electronic and Optoelectronic Materials and Devices written by Sam-Shajing Sun and published by CRC Press. This book was released on 2008-05-29 with total page 936 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reflecting rapid growth in research and development on organic/polymeric electronic and photonic materials and devices, Introduction to Organic Electronic and Optoelectronic Materials and Devices provides comprehensive coverage of the state-of-the-art in an accessible format. The book presents fundamentals, principles, and mechanisms complem
Book Synopsis Optical Electronics by : Tetsuzo Yoshimura
Download or read book Optical Electronics written by Tetsuzo Yoshimura and published by CRC Press. This book was released on 2012-06-06 with total page 396 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book proposes and reviews comprehensive strategies based on optical electronics for constructing optoelectronic systems with minimized optics excess. It describes the core technologies such as self-organized optical waveguides based on self-organized lightwave network (SOLNET), three-dimensional optical circuits, material-saving heterogeneous
Book Synopsis Photonic Integration and Photonics-Electronics Convergence on Silicon Platform by : Koji Yamada
Download or read book Photonic Integration and Photonics-Electronics Convergence on Silicon Platform written by Koji Yamada and published by Frontiers Media SA. This book was released on 2015-11-10 with total page 111 pages. Available in PDF, EPUB and Kindle. Book excerpt: Silicon photonics technology, which has the DNA of silicon electronics technology, promises to provide a compact photonic integration platform with high integration density, mass-producibility, and excellent cost performance. This technology has been used to develop and to integrate various photonic functions on silicon substrate. Moreover, photonics-electronics convergence based on silicon substrate is now being pursued. Thanks to these features, silicon photonics will have the potential to be a superior technology used in the construction of energy-efficient cost-effective apparatuses for various applications, such as communications, information processing, and sensing. Considering the material characteristics of silicon and difficulties in microfabrication technology, however, silicon by itself is not necessarily an ideal material. For example, silicon is not suitable for light emitting devices because it is an indirect transition material. The resolution and dynamic range of silicon-based interference devices, such as wavelength filters, are significantly limited by fabrication errors in microfabrication processes. For further performance improvement, therefore, various assisting materials, such as indium-phosphide, silicon-nitride, germanium-tin, are now being imported into silicon photonics by using various heterogeneous integration technologies, such as low-temperature film deposition and wafer/die bonding. These assisting materials and heterogeneous integration technologies would also expand the application field of silicon photonics technology. Fortunately, silicon photonics technology has superior flexibility and robustness for heterogeneous integration. Moreover, along with photonic functions, silicon photonics technology has an ability of integration of electronic functions. In other words, we are on the verge of obtaining an ultimate technology that can integrate all photonic and electronic functions on a single Si chip. This e-Book aims at covering recent developments of the silicon photonic platform and novel functionalities with heterogeneous material integrations on this platform.
Book Synopsis Silicon Photonics II by : David J. Lockwood
Download or read book Silicon Photonics II written by David J. Lockwood and published by Springer Science & Business Media. This book was released on 2010-10-13 with total page 264 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is volume II of a series of books on silicon photonics. It gives a fascinating picture of the state-of-the-art in silicon photonics from a component perspective. It presents a perspective on what can be expected in the near future. It is formed from a selected number of reviews authored by world leaders in the field, and is written from both academic and industrial viewpoints. An in-depth discussion of the route towards fully integrated silicon photonics is presented. This book will be useful not only to physicists, chemists, materials scientists, and engineers but also to graduate students who are interested in the fields of micro- and nanophotonics and optoelectronics.
Book Synopsis Coupled Data Communication Techniques for High-Performance and Low-Power Computing by : Ron Ho
Download or read book Coupled Data Communication Techniques for High-Performance and Low-Power Computing written by Ron Ho and published by Springer Science & Business Media. This book was released on 2010-06-03 with total page 214 pages. Available in PDF, EPUB and Kindle. Book excerpt: Wafer-scale integration has long been the dream of system designers. Instead of chopping a wafer into a few hundred or a few thousand chips, one would just connect the circuits on the entire wafer. What an enormous capability wafer-scale integration would offer: all those millions of circuits connected by high-speed on-chip wires. Unfortunately, the best known optical systems can provide suitably ?ne resolution only over an area much smaller than a whole wafer. There is no known way to pattern a whole wafer with transistors and wires small enough for modern circuits. Statistical defects present a ?rmer barrier to wafer-scale integration. Flaws appear regularly in integrated circuits; the larger the circuit area, the more probable there is a ?aw. If such ?aws were the result only of dust one might reduce their numbers, but ?aws are also the inevitable result of small scale. Each feature on a modern integrated circuit is carved out by only a small number of photons in the lithographic process. Each transistor gets its electrical properties from only a small number of impurity atoms in its tiny area. Inevitably, the quantized nature of light and the atomic nature of matter produce statistical variations in both the number of photons de?ning each tiny shape and the number of atoms providing the electrical behavior of tiny transistors. No known way exists to eliminate such statistical variation, nor may any be possible.
Book Synopsis Integration of Functional Oxides with Semiconductors by : Alexander A. Demkov
Download or read book Integration of Functional Oxides with Semiconductors written by Alexander A. Demkov and published by Springer Science & Business Media. This book was released on 2014-02-20 with total page 284 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes the basic physical principles of the oxide/semiconductor epitaxy and offers a view of the current state of the field. It shows how this technology enables large-scale integration of oxide electronic and photonic devices and describes possible hybrid semiconductor/oxide systems. The book incorporates both theoretical and experimental advances to explore the heteroepitaxy of tuned functional oxides and semiconductors to identify material, device and characterization challenges and to present the incredible potential in the realization of multifunctional devices and monolithic integration of materials and devices. Intended for a multidisciplined audience, Integration of Functional Oxides with Semiconductors describes processing techniques that enable atomic-level control of stoichiometry and structure and reviews characterization techniques for films, interfaces and device performance parameters. Fundamental challenges involved in joining covalent and ionic systems, chemical interactions at interfaces, multi-element materials that are sensitive to atomic-level compositional and structural changes are discussed in the context of the latest literature. Magnetic, ferroelectric and piezoelectric materials and the coupling between them will also be discussed. GaN, SiC, Si, GaAs and Ge semiconductors are covered within the context of optimizing next-generation device performance for monolithic device processing.
Book Synopsis Silicon Photonics III by : Lorenzo Pavesi
Download or read book Silicon Photonics III written by Lorenzo Pavesi and published by Springer Science & Business Media. This book was released on 2016-01-08 with total page 524 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is volume III of a series of books on silicon photonics. It reports on the development of fully integrated systems where many different photonics component are integrated together to build complex circuits. This is the demonstration of the fully potentiality of silicon photonics. It contains a number of chapters written by engineers and scientists of the main companies, research centers and universities active in the field. It can be of use for all those persons interested to know the potentialities and the recent applications of silicon photonics both in microelectronics, telecommunication and consumer electronics market.
