Heterogeneous Integration Of Materials For Passive Components And Smart Systems Volume 969

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Heterogeneous Integration of Materials for Passive Components and Smart Systems: Volume 969

Author : Juan C. Nino
Publisher :
ISBN 13 :
Total Pages : 184 pages
Book Rating : 4.X/5 (3 download)

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Book Synopsis Heterogeneous Integration of Materials for Passive Components and Smart Systems: Volume 969 by : Juan C. Nino

Download or read book Heterogeneous Integration of Materials for Passive Components and Smart Systems: Volume 969 written by Juan C. Nino and published by . This book was released on 2007-05-30 with total page 184 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book, first published in 2007, discusses advances, the current status, and future challenges in the broad area of materials integration for passive components and smart systems.

Advanced Electronic Packaging: Volume 968

Author : Vasudeva P. Atluri
Publisher :
ISBN 13 :
Total Pages : 226 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Advanced Electronic Packaging: Volume 968 by : Vasudeva P. Atluri

Download or read book Advanced Electronic Packaging: Volume 968 written by Vasudeva P. Atluri and published by . This book was released on 2007-04-09 with total page 226 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic packaging architecture evolutions are being driven by silicon technology advancements and new form factors, used models and emerging technologies. High-performance mobile computer and communication systems will require higher I/O counts, greater density, lower cost, lighter weight and improved performance in the electronic package. The book focuses on silicon technology dimension scaling and performance improvement, Pb-free or 'green' assembly, and system-in-package (SIP) technologies. It explores the key thermomechanical failure modes and mitigating solutions associated with integration of silicon with weak interlayer dielectrics during the assembly process, under bump metallurgy integrity with lead-free assembly, and the impact of stress on die-cracking and transistor performance in 3D thin-die stacking. The interaction of these failures with silicon and assembly materials, processes and design features is covered and includes: system in package; advanced packaging/nanotechnology in packaging; physical behavior and mechanical behavior in packaging; electromigration and thermal behavior in packaging and thin films and adhesives in packaging.

Materials Research at High Pressure: Volume 987

Author : Materials Research Society. Meeting
Publisher :
ISBN 13 :
Total Pages : 224 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Materials Research at High Pressure: Volume 987 by : Materials Research Society. Meeting

Download or read book Materials Research at High Pressure: Volume 987 written by Materials Research Society. Meeting and published by . This book was released on 2007-04-03 with total page 224 pages. Available in PDF, EPUB and Kindle. Book excerpt: High-pressure materials research has been revolutionized in the past few years due to technological breakthroughs in the diamond anvil cell (DAC), shock wave compression, and first-principles molecular dynamic simulation (MD) methods. Pressure-induced chemistry and high-pressure synthesis of superhard materials were topics of the successful Symposium DD, High-Pressure Materials Research, held at the 1997 MRS Fall Meeting in Boston. Since then, a plethora of discoveries have been made, including new materials synthesized under high pressure, geophysical-geochemical material conversion and ionization prior to polymerization of molecular solids. Additionally, new experimental and computational techniques, such as in situ studies of materials properties and transformations using laser heating are increasingly providing a deeper insight and a few surprises for the behavior and properties of matter at elevated pressure conditions. This book provides a timely report on progress in the field. Topics include: synthesis and characterization; disordered systems; dense molecular materials; and properties under extreme conditions.

Zinc Oxide and Related Materials: Volume 957

Author : Jürgen H. Christen
Publisher :
ISBN 13 :
Total Pages : 470 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Zinc Oxide and Related Materials: Volume 957 by : Jürgen H. Christen

Download or read book Zinc Oxide and Related Materials: Volume 957 written by Jürgen H. Christen and published by . This book was released on 2007-04-05 with total page 470 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. The topics covered in this volume, first published in 2007, include devices, defects, spintronics and magnetism, growth, optical properties and nanostructures, and doping and processing TFTs.

Solid-State Ionics-2006: Volume 972

Author : E. Traversa
Publisher : Mrs Proceedings
ISBN 13 :
Total Pages : 448 pages
Book Rating : 4.:/5 (318 download)

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Book Synopsis Solid-State Ionics-2006: Volume 972 by : E. Traversa

Download or read book Solid-State Ionics-2006: Volume 972 written by E. Traversa and published by Mrs Proceedings. This book was released on 2007-04-02 with total page 448 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Enabling Technologies for 3-D Integration: Volume 970

Author : Christopher A. Bower
Publisher :
ISBN 13 :
Total Pages : 320 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Enabling Technologies for 3-D Integration: Volume 970 by : Christopher A. Bower

Download or read book Enabling Technologies for 3-D Integration: Volume 970 written by Christopher A. Bower and published by . This book was released on 2007-03-30 with total page 320 pages. Available in PDF, EPUB and Kindle. Book excerpt: An emerging technology or device architecture called 3-D IC integration is based on the system performance gains that can be achieved by stacking and vertically interconnecting distinct device chips. The 3-D concept of replacing long 2-D interconnects with shorter vertical (3-D) interconnects has the potential to alleviate the well-known interconnect (RC) delay problem facing the semiconductor industry. Additional benefits of the 3-D concept for the IC maker include reduced die size and the ability to use distinct technologies (analog, logic, RF, etc...) on separate vertically interconnected layers. The 3-D concept, therefore, allows the integration of otherwise incompatible technologies, and offers significant advantages in performance, functionality, and form factor. Topics in this book include: fabrication of 3-D ICs; modeling, simulation and scaling of 3-D integrated devices; applications of 3-D integration; through wafer interconnects for 3-D packaging and interposer applications; bonding technology for 3-D integration; and enabling processes for 3-D integration.

Solid State Ionics

Author :
Publisher :
ISBN 13 :
Total Pages : 448 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Solid State Ionics by :

Download or read book Solid State Ionics written by and published by . This book was released on 2006 with total page 448 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Group IV Semiconductor Nanostructures - 2006: Volume 958

Author : Leonid Tsybeskov
Publisher :
ISBN 13 :
Total Pages : 336 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Group IV Semiconductor Nanostructures - 2006: Volume 958 by : Leonid Tsybeskov

Download or read book Group IV Semiconductor Nanostructures - 2006: Volume 958 written by Leonid Tsybeskov and published by . This book was released on 2007-03-28 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on advances in materials science and device applications of nanostructures composed of Si, Ge, diamond, SiGe and SiCGe. Continuous progress in the development of reproducibly grown quantum dots, wires and wells has produced a new class of functional materials and devices with characteristic dimensions less than 50nm. The broad spectrum of these devices ranges from commercially offered high-mobility transistors using strained Si to exploratory SiGe nanostructures for integrated optical interconnects and THz lasers. This book brings together researchers from chemistry, physics, biology, materials science and engineering to share and discuss both the challenges and progress towards a new generation of Si(SiGe, SiCGe)-based novel functional structures and devices. Topics include: light emission and photonic devices; Ge, SiGe and diamond nanostructures; strains, Si/Ge films and layers and Si nanocrystals.

Diamond Electronics--fundamentals to Applications

Author : Philippe Bergonzo
Publisher :
ISBN 13 :
Total Pages : 312 pages
Book Rating : 4.X/5 (3 download)

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Book Synopsis Diamond Electronics--fundamentals to Applications by : Philippe Bergonzo

Download or read book Diamond Electronics--fundamentals to Applications written by Philippe Bergonzo and published by . This book was released on 2007 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Advanced Intermetallic-based Alloys

Author : Jörg Wiezorek
Publisher :
ISBN 13 :
Total Pages : 616 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Advanced Intermetallic-based Alloys by : Jörg Wiezorek

Download or read book Advanced Intermetallic-based Alloys written by Jörg Wiezorek and published by . This book was released on 2007 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Actinides 2006--basic Science, Applications and Technology

Author : Materials Research Society. Meeting
Publisher :
ISBN 13 : 9781558999435
Total Pages : 232 pages
Book Rating : 4.9/5 (994 download)

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Book Synopsis Actinides 2006--basic Science, Applications and Technology by : Materials Research Society. Meeting

Download or read book Actinides 2006--basic Science, Applications and Technology written by Materials Research Society. Meeting and published by . This book was released on 2007 with total page 232 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Scientific Basis for Nuclear Waste Management XXX

Author : Darrel E. Dunn
Publisher :
ISBN 13 :
Total Pages : 672 pages
Book Rating : 4.:/5 (318 download)

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Book Synopsis Scientific Basis for Nuclear Waste Management XXX by : Darrel E. Dunn

Download or read book Scientific Basis for Nuclear Waste Management XXX written by Darrel E. Dunn and published by . This book was released on 2007 with total page 672 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Scientific Basis for Nuclear Waste Management

Author :
Publisher :
ISBN 13 :
Total Pages : 672 pages
Book Rating : 4.X/5 (3 download)

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Book Synopsis Scientific Basis for Nuclear Waste Management by :

Download or read book Scientific Basis for Nuclear Waste Management written by and published by . This book was released on 2007 with total page 672 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Materials and Devices for Smart Systems III: Volume 1129

Author : Ji Su
Publisher : Cambridge University Press
ISBN 13 : 9781605111018
Total Pages : 360 pages
Book Rating : 4.1/5 (11 download)

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Book Synopsis Materials and Devices for Smart Systems III: Volume 1129 by : Ji Su

Download or read book Materials and Devices for Smart Systems III: Volume 1129 written by Ji Su and published by Cambridge University Press. This book was released on 2009-06-02 with total page 360 pages. Available in PDF, EPUB and Kindle. Book excerpt: Smart/intelligent systems employ active materials as sensors/actuators to respond to environmental conditions for next-generation machines and structures - applications ranging from everyday life to space exploration missions, from civilian products to military needs, from robots to information/communication technology. It is not surprising, then, that the development of smart materials systems and structures demand higher performance sensors/actuators with new and reliable functions and a fully integrated composite system design. This requires the combination of active and passive materials systems, often including the coupling of relevant mechanical, electrical, magnetic, thermal or other physical/chemical properties. This book bridges the fields of smart materials, sensing and actuating devices, and intelligent/smart systems, and provides an opportunity for researchers from related disciplines to build an interdisciplinary research field and community. Topics include: ferroelectrics and piezoelectrics; nanomaterials and nanofabrication; shape-memory alloys and magnetomaterials; active polymers and soft matters; and other materials, devices and characterization.

Electrically Conductive Adhesives

Author : Rajesh Gomatam
Publisher : CRC Press
ISBN 13 : 9004187820
Total Pages : 436 pages
Book Rating : 4.0/5 (41 download)

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Book Synopsis Electrically Conductive Adhesives by : Rajesh Gomatam

Download or read book Electrically Conductive Adhesives written by Rajesh Gomatam and published by CRC Press. This book was released on 2008-12-23 with total page 436 pages. Available in PDF, EPUB and Kindle. Book excerpt: With all the environmental concerns and constraints today and stricter future regulations, there is a patent need to replace materials noxious to the environment by environmentally-friendly alternatives. Electrically conductive adhesives (ECAs) are one such example. ECAs offer an excellent alternative to lead-solder interconnects for microelectroni

Ultra-wide Bandgap Semiconductor Materials

Author : Meiyong Liao
Publisher : Elsevier
ISBN 13 : 0128172568
Total Pages : 503 pages
Book Rating : 4.1/5 (281 download)

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Book Synopsis Ultra-wide Bandgap Semiconductor Materials by : Meiyong Liao

Download or read book Ultra-wide Bandgap Semiconductor Materials written by Meiyong Liao and published by Elsevier. This book was released on 2019-06-18 with total page 503 pages. Available in PDF, EPUB and Kindle. Book excerpt: Ultra-wide Bandgap Semiconductors (UWBG) covers the most recent progress in UWBG materials, including sections on high-Al-content AlGaN, diamond, B-Ga2O3, and boron nitrides. The coverage of these materials is comprehensive, addressing materials growth, physics properties, doping, device design, fabrication and performance. The most relevant and important applications are covered, including power electronics, RF electronics and DUV optoelectronics. There is also a chapter on novel structures based on UWBG, such as the heterojunctions, the low-dimensional structures, and their devices. This book is ideal for materials scientists and engineers in academia and R&D searching for materials superior to silicon carbide and gallium nitride. Provides a one-stop resource on the most promising ultra-wide bandgap semiconducting materials, including high-Al-content AlGaN, diamond, β-Ga2O3, boron nitrides, and low-dimensional materials Presents comprehensive coverage, from materials growth and properties, to device design, fabrication and performance Features the most relevant applications, including power electronics, RF electronics and DUV optoelectronics

Innovation in Information Systems and Technologies to Support Learning Research

Author : Mohammed Serrhini
Publisher : Springer Nature
ISBN 13 : 3030367789
Total Pages : 659 pages
Book Rating : 4.0/5 (33 download)

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Book Synopsis Innovation in Information Systems and Technologies to Support Learning Research by : Mohammed Serrhini

Download or read book Innovation in Information Systems and Technologies to Support Learning Research written by Mohammed Serrhini and published by Springer Nature. This book was released on 2019-11-30 with total page 659 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides glimpses into contemporary research in information systems & technology, learning, artificial intelligence (AI), machine learning, and security and how it applies to the real world, but the ideas presented also span the domains of telehealth, computer vision, the role and use of mobile devices, brain–computer interfaces, virtual reality, language and image processing and big data analytics and applications. Great research arises from asking pertinent research questions. This book reveals some of the authors’ “beautiful questions” and how they develop the subsequent “what if” and “how” questions, offering readers food for thought and whetting their appetite for further research by the same authors.