Gan Based Vertical Power Devices

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GaN-based Vertical Power Devices

Author : Yuhao Zhang (Ph. D.)
Publisher :
ISBN 13 :
Total Pages : 170 pages
Book Rating : 4.:/5 (1 download)

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Book Synopsis GaN-based Vertical Power Devices by : Yuhao Zhang (Ph. D.)

Download or read book GaN-based Vertical Power Devices written by Yuhao Zhang (Ph. D.) and published by . This book was released on 2017 with total page 170 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power electronics based on Gallium Nitride (GaN) is expected to significantly reduce the losses in power conversion circuits and increase the power density. This makes GaN devices very exciting candidates for next-generation power electronics, for the applications in electric vehicles, data centers, high-power and high-frequency communications. Currently, both lateral and vertical structures are considered for GaN power devices. In particular, vertical GaN power devices have attracted significant attention recently, due to the potential for achieving high breakdown voltage and current levels without enlarging the chip size. In addition, these vertical devices show superior thermal performance than their lateral counterparts. This PhD thesis addresses several key obstacles in developing vertical GaN power devices. The commercialization of vertical GaN power devices has been hindered by the high cost of bulk GaN. The first project in this PhD thesis demonstrated the feasibility of making vertical devices on a low-cost silicon (Si) substrate for the first time. The demonstrated high performance shows the great potential of low-cost vertical GaN-on-Si devices for 600-V level high-current and high-power applications. This thesis has also studied the origin of the off-state leakage current in vertical GaN pn diodes on Si, sapphire and GaN substrates, by experiments, analytical calculations and TCAD simulations. Variable-range-hopping through threading dislocations was identified as the main off-state leakage mechanism in these devices. The design space of leakage current of vertical GaN devices has been subsequently derived. Thirdly, a novel GaN vertical Schottky rectifier with trench MIS structures and trench field rings was demonstrated. The new structure greatly enhanced the reverse blocking characteristics while maintaining a Schottky-like good forward conduction. This new device shows great potential for using advanced vertical Schottky rectifiers for high-power and high-frequency applications. Finally, we investigated a fundamental and significant challenge for GaN power devices: the lack of reliable and generally useable patterned pn junctions. Two approaches have been proposed to make lateral patterned pn junctions. Two devices, junction barrier Schottky devices and super-junction devices, have been designed and optimized. Preliminary experimental results were also demonstrated for the feasibility of making patterned pn junctions and fabricating novel power devices.

Vertical GaN and SiC Power Devices

Author : Kazuhiro Mochizuki
Publisher : Artech House
ISBN 13 : 1630814296
Total Pages : 308 pages
Book Rating : 4.6/5 (38 download)

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Book Synopsis Vertical GaN and SiC Power Devices by : Kazuhiro Mochizuki

Download or read book Vertical GaN and SiC Power Devices written by Kazuhiro Mochizuki and published by Artech House. This book was released on 2018-04-30 with total page 308 pages. Available in PDF, EPUB and Kindle. Book excerpt: This unique new resource provides a comparative introduction to vertical Gallium Nitride (GaN) and Silicon Carbide (SiC) power devices using real commercial device data, computer, and physical models. This book uses commercial examples from recent years and presents the design features of various GaN and SiC power components and devices. Vertical verses lateral power semiconductor devices are explored, including those based on wide bandgap materials. The abstract concepts of solid state physics as they relate to solid state devices are explained with particular emphasis on power solid state devices. Details about the effects of photon recycling are presented, including an explanation of the phenomenon of the family tree of photon-recycling. This book offers in-depth coverage of bulk crystal growth of GaN, including hydride vapor-phase epitaxial (HVPE) growth, high-pressure nitrogen solution growth, sodium-flux growth, ammonothermal growth, and sublimation growth of SiC. The fabrication process, including ion implantation, diffusion, oxidation, metallization, and passivation is explained. The book provides details about metal-semiconductor contact, unipolar power diodes, and metal-insulator-semiconductor (MIS) capacitors. Bipolar power diodes, power switching devices, and edge terminations are also covered in this resource.

Gallium Nitride Power Devices

Author : Hongyu Yu
Publisher : CRC Press
ISBN 13 : 1351767607
Total Pages : 301 pages
Book Rating : 4.3/5 (517 download)

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Book Synopsis Gallium Nitride Power Devices by : Hongyu Yu

Download or read book Gallium Nitride Power Devices written by Hongyu Yu and published by CRC Press. This book was released on 2017-07-06 with total page 301 pages. Available in PDF, EPUB and Kindle. Book excerpt: GaN is considered the most promising material candidate in next-generation power device applications, owing to its unique material properties, for example, bandgap, high breakdown field, and high electron mobility. Therefore, GaN power device technologies are listed as the top priority to be developed in many countries, including the United States, the European Union, Japan, and China. This book presents a comprehensive overview of GaN power device technologies, for example, material growth, property analysis, device structure design, fabrication process, reliability, failure analysis, and packaging. It provides useful information to both students and researchers in academic and related industries working on GaN power devices. GaN wafer growth technology is from Enkris Semiconductor, currently one of the leading players in commercial GaN wafers. Chapters 3 and 7, on the GaN transistor fabrication process and GaN vertical power devices, are edited by Dr. Zhihong Liu, who has been working on GaN devices for more than ten years. Chapters 2 and 5, on the characteristics of polarization effects and the original demonstration of AlGaN/GaN heterojunction field-effect transistors, are written by researchers from Southwest Jiaotong University. Chapters 6, 8, and 9, on surface passivation, reliability, and package technologies, are edited by a group of researchers from the Southern University of Science and Technology of China.

Vertical GaN and SiC Power Devices

Author : Kazuhiro Mochizuki
Publisher : Artech House
ISBN 13 : 1630814296
Total Pages : 308 pages
Book Rating : 4.6/5 (38 download)

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Book Synopsis Vertical GaN and SiC Power Devices by : Kazuhiro Mochizuki

Power GaN Devices

Author : Matteo Meneghini
Publisher : Springer
ISBN 13 : 3319431994
Total Pages : 383 pages
Book Rating : 4.3/5 (194 download)

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Book Synopsis Power GaN Devices by : Matteo Meneghini

Download or read book Power GaN Devices written by Matteo Meneghini and published by Springer. This book was released on 2016-09-08 with total page 383 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the first comprehensive overview of the properties and fabrication methods of GaN-based power transistors, with contributions from the most active research groups in the field. It describes how gallium nitride has emerged as an excellent material for the fabrication of power transistors; thanks to the high energy gap, high breakdown field, and saturation velocity of GaN, these devices can reach breakdown voltages beyond the kV range, and very high switching frequencies, thus being suitable for application in power conversion systems. Based on GaN, switching-mode power converters with efficiency in excess of 99 % have been already demonstrated, thus clearing the way for massive adoption of GaN transistors in the power conversion market. This is expected to have important advantages at both the environmental and economic level, since power conversion losses account for 10 % of global electricity consumption. The first part of the book describes the properties and advantages of gallium nitride compared to conventional semiconductor materials. The second part of the book describes the techniques used for device fabrication, and the methods for GaN-on-Silicon mass production. Specific attention is paid to the three most advanced device structures: lateral transistors, vertical power devices, and nanowire-based HEMTs. Other relevant topics covered by the book are the strategies for normally-off operation, and the problems related to device reliability. The last chapter reviews the switching characteristics of GaN HEMTs based on a systems level approach. This book is a unique reference for people working in the materials, device and power electronics fields; it provides interdisciplinary information on material growth, device fabrication, reliability issues and circuit-level switching investigation.

Gallium Nitride-enabled High Frequency and High Efficiency Power Conversion

Author : Gaudenzio Meneghesso
Publisher : Springer
ISBN 13 : 331977994X
Total Pages : 242 pages
Book Rating : 4.3/5 (197 download)

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Book Synopsis Gallium Nitride-enabled High Frequency and High Efficiency Power Conversion by : Gaudenzio Meneghesso

Download or read book Gallium Nitride-enabled High Frequency and High Efficiency Power Conversion written by Gaudenzio Meneghesso and published by Springer. This book was released on 2018-05-12 with total page 242 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book demonstrates to readers why Gallium Nitride (GaN) transistors have a superior performance as compared to the already mature Silicon technology. The new GaN-based transistors here described enable both high frequency and high efficiency power conversion, leading to smaller and more efficient power systems. Coverage includes i) GaN substrates and device physics; ii) innovative GaN -transistors structure (lateral and vertical); iii) reliability and robustness of GaN-power transistors; iv) impact of parasitic on GaN based power conversion, v) new power converter architectures and vi) GaN in switched mode power conversion. Provides single-source reference to Gallium Nitride (GaN)-based technologies, from the material level to circuit level, both for power conversions architectures and switched mode power amplifiers; Demonstrates how GaN is a superior technology for switching devices, enabling both high frequency, high efficiency and lower cost power conversion; Enables design of smaller, cheaper and more efficient power supplies.

Design and Development of GaN-based Vertical Transistors for Increased Power Density in Power Electronics Applications

Author : Dong Ji
Publisher :
ISBN 13 : 9780355764284
Total Pages : pages
Book Rating : 4.7/5 (642 download)

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Book Synopsis Design and Development of GaN-based Vertical Transistors for Increased Power Density in Power Electronics Applications by : Dong Ji

Download or read book Design and Development of GaN-based Vertical Transistors for Increased Power Density in Power Electronics Applications written by Dong Ji and published by . This book was released on 2017 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Gallium nitride (GaN)-based devices have entered the power electronics market and shown excellent progress in the medium power conversion applications. For power conversions applications > 10 kW, devices with vertical geometry are preferred over lateral geometry, since the former allows more current for a given chip area, thus provides a more economical solution for high-voltage and high-current applications. Moreover, the vertical geometry is attractive for its dispersion-free performance without passivation, a phenomenon that causes high dynamic on-state resistance (R[subscript on]) in lateral geometry high electron mobility transistors (HEMTs). In this study, GaN-based vertical transistors, which include trench current aperture vertical electron transistors (CAVETs) and in-situ oxide, GaN interlayer based trench field-effect transistors (OGFETs), have been studied both theoretically and experimentally. In order to model the devices for DC and switching performances, a device/circuit hybrid simulation platform was developed based on Silvaco ATLAS. The validation of the model was obtained by calibrating it against commercially available HEMT data. Using this hybrid model, one can start with a two-dimensional (2D) drift-diffusion model of the device and build all the way up to its circuit implementation to evaluate its switching performance. The hybrid model offers an inexpensive and accurate way to project and benchmark the performance and can be extended to any GaN-based power transistors.In the experimental portion of this study, a high voltage OGFET was designed and fabricated. An OGFET shows improved characteristics owing to a 10 nm unintentionally doped (UID) GaN interlayer as the channel. A normally-off (V[subscript th] = 4 V) vertical GaN OGFET with 10 nm UID-GaN channel interlayer and 50 nm in-situ Al2O3 was successfully demonstrated and scaled for higher current operation. By using a novel double-field-plated structure for mitigating peak electric field, a higher off-state breakdown voltage over 1.4 kV was achieved with a significantly low specific on-state resistance (R[subscript on,sp]) of 2.2 m[omega] cm2. The metal-organic chemical vapor deposition (MOCVD) regrown 10 nm GaN channel interlayer enabled a channel resistance lower than 10 [omega] mm with an average channel electron mobility of 185 cm2/Vs. The fabricated large area transistor with a total area of 0.4 mm × 0.5 mm offered a breakdown voltage of 900 V and an Ron of 4.1 [omega]. Results indicate the potential of vertical GaN OGFET for greater than 1 kV range of power electronics applications.In addition to the OGFET, the CAVET with a trench gate structure was studied in this work. By taking advantage of the two-dimensional electron gas (2DEG) in the AlGaN/GaN structure, the trench CAVET can secure an even higher channel electron mobility compared to the OGFET. The first functional trench CAVET with a metal-insulator-semiconductor (MIS) gate structure was fabricated in this work with a breakdown voltage of about 225 V. With the improvement in the fabrication process, an 880 V device with an R[subscript on,sp] of 2.7 m[omega] cm2 was demonstrated. One of the notable features of the fabricated trench CAVET is that it requires a standard MOCVD growth condition for HEMT epilayers. The simplification of the growth process is a significant achievement. Finally, a regrowth-free CAVET was demonstrated and patented. The transformative approach was realized using Si ion implantation based doping compensation in the aperture.

GaN Power Devices and Applications

Author : Alex Lidow
Publisher :
ISBN 13 : 9780996649223
Total Pages : pages
Book Rating : 4.6/5 (492 download)

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Book Synopsis GaN Power Devices and Applications by : Alex Lidow

Download or read book GaN Power Devices and Applications written by Alex Lidow and published by . This book was released on 2021-10 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: GaN Power Devices and Applications, provides an update on gallium nitride (GaN) technology and applications by leading experts. It includes detailed descriptions of the latest examples of GaN's usage in power supplies, lidar systems, motor drives, and space applications.

GaN Transistors for Efficient Power Conversion

Author : Alex Lidow
Publisher : John Wiley & Sons
ISBN 13 : 1119594421
Total Pages : 470 pages
Book Rating : 4.1/5 (195 download)

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Book Synopsis GaN Transistors for Efficient Power Conversion by : Alex Lidow

Download or read book GaN Transistors for Efficient Power Conversion written by Alex Lidow and published by John Wiley & Sons. This book was released on 2019-08-12 with total page 470 pages. Available in PDF, EPUB and Kindle. Book excerpt: An up-to-date, practical guide on upgrading from silicon to GaN, and how to use GaN transistors in power conversion systems design This updated, third edition of a popular book on GaN transistors for efficient power conversion has been substantially expanded to keep students and practicing power conversion engineers ahead of the learning curve in GaN technology advancements. Acknowledging that GaN transistors are not one-to-one replacements for the current MOSFET technology, this book serves as a practical guide for understanding basic GaN transistor construction, characteristics, and applications. Included are discussions on the fundamental physics of these power semiconductors, layout, and other circuit design considerations, as well as specific application examples demonstrating design techniques when employing GaN devices. GaN Transistors for Efficient Power Conversion, 3rd Edition brings key updates to the chapters of Driving GaN Transistors; Modeling, Simulation, and Measurement of GaN Transistors; DC-DC Power Conversion; Envelope Tracking; and Highly Resonant Wireless Energy Transfer. It also offers new chapters on Thermal Management, Multilevel Converters, and Lidar, and revises many others throughout. Written by leaders in the power semiconductor field and industry pioneers in GaN power transistor technology and applications Updated with 35% new material, including three new chapters on Thermal Management, Multilevel Converters, Wireless Power, and Lidar Features practical guidance on formulating specific circuit designs when constructing power conversion systems using GaN transistors A valuable resource for professional engineers, systems designers, and electrical engineering students who need to fully understand the state-of-the-art GaN Transistors for Efficient Power Conversion, 3rd Edition is an essential learning tool and reference guide that enables power conversion engineers to design energy-efficient, smaller, and more cost-effective products using GaN transistors.

GaN-based Materials and Devices

Author : Michael Shur
Publisher : World Scientific
ISBN 13 : 9789812562364
Total Pages : 310 pages
Book Rating : 4.5/5 (623 download)

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Book Synopsis GaN-based Materials and Devices by : Michael Shur

Download or read book GaN-based Materials and Devices written by Michael Shur and published by World Scientific. This book was released on 2004 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt: The unique materials properties of GaN-based semiconductors havestimulated a great deal of interest in research and developmentregarding nitride materials growth and optoelectronic andnitride-based electronic devices. High electron mobility andsaturation velocity, high sheet carrier concentration atheterojunction interfaces, high breakdown field, and low thermalimpedance of GaN-based films grown over SiC or bulk AlN substratesmake nitride-based electronic devices very promising.

Vertical Gallium Nitride PowerDevices: Fabrication and Characterisation

Author : Rico Hentschel
Publisher : BoD – Books on Demand
ISBN 13 : 3752641762
Total Pages : 156 pages
Book Rating : 4.7/5 (526 download)

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Book Synopsis Vertical Gallium Nitride PowerDevices: Fabrication and Characterisation by : Rico Hentschel

Download or read book Vertical Gallium Nitride PowerDevices: Fabrication and Characterisation written by Rico Hentschel and published by BoD – Books on Demand. This book was released on 2021-01-03 with total page 156 pages. Available in PDF, EPUB and Kindle. Book excerpt: Efficient power conversion is essential to face the continuously increasing energy consumption of our society. GaN based vertical power field effect transistors provide excellent performance figures for power-conversion switches, due to their capability of handling high voltages and current densities with very low area consumption. This work focuses on a vertical trench gate metal oxide semiconductor field effect transistor (MOSFET) with conceptional advantages in a device fabrication preceded GaN epitaxy and enhancement mode characteristics. The functional layer stack comprises from the bottom an n+/n--drift/p-body/n+-source GaN layer sequence. Special attention is paid to the Mg doping of the p-GaN body layer, which is a complex topic by itself. Hydrogen passivation of magnesium plays an essential role, since only the active (hydrogen-free) Mg concentration determines the threshold voltage of the MOSFET and the blocking capability of the body diode. Fabrication specific challenges of the concept are related to the complex integration, formation of ohmic contacts to the functional layers, the specific implementation and processing scheme of the gate trench module and the lateral edge termination. The maximum electric field, which was achieved in the pn- junction of the body diode of the MOSFET is estimated to be around 2.1 MV/cm. From double-sweep transfer measurements with relatively small hysteresis, steep subthreshold slope and a threshold voltage of 3 - 4 V a reasonably good Al2O3/GaN interface quality is indicated. In the conductive state a channel mobility of around 80 - 100 cm2/Vs is estimated. This value is comparable to device with additional overgrowth of the channel. Further enhancement of the OFF-state and ON-state characteristics is expected for optimization of the device termination and the high-k/GaN interface of the vertical trench gate, respectively. From the obtained results and dependencies key figures of an area efficient and competitive device design with thick drift layer is extrapolated. Finally, an outlook is given and advancement possibilities as well as technological limits are discussed.

GaN Technology

Author : Maurizio Di Paolo Emilio
Publisher : Springer Nature
ISBN 13 : 3031632389
Total Pages : 388 pages
Book Rating : 4.0/5 (316 download)

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Book Synopsis GaN Technology by : Maurizio Di Paolo Emilio

Download or read book GaN Technology written by Maurizio Di Paolo Emilio and published by Springer Nature. This book was released on with total page 388 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Design, Fabrication and Characterization of GaN-based Devices for Power Applications

Author : Burcu Ercan
Publisher :
ISBN 13 :
Total Pages : 0 pages
Book Rating : 4.5/5 (825 download)

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Book Synopsis Design, Fabrication and Characterization of GaN-based Devices for Power Applications by : Burcu Ercan

Download or read book Design, Fabrication and Characterization of GaN-based Devices for Power Applications written by Burcu Ercan and published by . This book was released on 2020 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Gallium Nitride (GaN) and related alloys have gained considerable momentum in recent years since the improvement in silicon (Si) based power devices is now only incremental. GaN is a promising material for high-power, high-frequency applications due to its wide bandgap, high carrier mobility which result in devices with high breakdown voltage, low on-resistance, and high temperature stability. Despite the superior properties of GaN there is still room for improvement in device design and fabrication to reach theoretical limits of GaN based devices. Reaching the theoretical critical electric field in GaN devices has been challenging due to the presence of threading dislocations, surface impurities introduced during material growth and fabrication process. In order to prevent premature breakdown of the devices, these defects must be mitigated. In this study, avalanche breakdown was observed in p-n diodes fabricated with low power reactive ion etch with a moat etch profile, followed by Mg ion implantation to passivate the plasma damages. Additionally, the devices were fabricated on free standing GaN substrates which has lower dislocation than sapphire or SiC substrates. The electron and hole impact ionization coefficients were extracted separately by analyzing the ultraviolet (UV) assisted reverse bias current voltage measurements of vertical p-n and n-p diodes. GaN and related alloy such as Indium Aluminum Nitride (InAlN) or Aluminum Gallium Nitride (AlGaN) form a high mobility, high density sheet charge at the heterojunction. High electron mobility transistor (HEMT) devices fabricated on these layer stacks are depletion mode (normally-on) devices with a negative threshold voltage. However, normally-on devices are not preferred in power applications due to safety reasons and to reduce the external circuitry. Therefore, the development of an enhancement mode (normally-off) GaN based high electron mobility transistors (HEMT) with positive threshold voltage is important for next generation power devices. Several methods, such as growing a p-GaN on the barrier layer, recessed gate by dry etching, plasma treatment under the gate have been previously studied to develop enhancement-mode HEMT devices. In this study, MOS-HEMT devices were fabricated by selective thermal oxidation of InAlN to reduce InAlN barrier thickness under the gate contact. The thermal oxidation of InAlN occurs at temperatures above 600°C, while GaN oxidation occurs above 1000°C at a slow rate which allows the decrease of the InAlN barrier layer thickness under the gate in a reliable way due to the self-limiting nature of oxidation. A positive shift in the threshold voltage and a reduction in reverse leakage current was demonstrated on MOS-diode structures by thermally oxidizing InAlN layers with In composition of 0.17, 0.178 and 0.255 for increasing oxidation durations at 700°C and 800°C. Enhancement mode device operation was demonstrated on lattice matched InAlN/AlN/GaN/Sapphire MOS-HEMT devices by selective thermal oxidation of InAlN layer under the gate contact. A positive threshold voltage was observed for devices which were subjected to thermal oxidation at 700°C for 10, 30 and 60 minutes. The highest threshold voltage was observed as 1.16 V for the device that was oxidized for 30 minutes at 700°C. The maximum transconductance and the maximum drain saturation current of this device was 4.27 mS/mm and 150 mA/mm, respectively.

Wide Bandgap Semiconductor Power Devices

Author : B. Jayant Baliga
Publisher : Woodhead Publishing
ISBN 13 : 0081023073
Total Pages : 420 pages
Book Rating : 4.0/5 (81 download)

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Book Synopsis Wide Bandgap Semiconductor Power Devices by : B. Jayant Baliga

Download or read book Wide Bandgap Semiconductor Power Devices written by B. Jayant Baliga and published by Woodhead Publishing. This book was released on 2018-10-17 with total page 420 pages. Available in PDF, EPUB and Kindle. Book excerpt: Wide Bandgap Semiconductor Power Devices: Materials, Physics, Design and Applications provides readers with a single resource on why these devices are superior to existing silicon devices. The book lays the groundwork for an understanding of an array of applications and anticipated benefits in energy savings. Authored by the Founder of the Power Semiconductor Research Center at North Carolina State University (and creator of the IGBT device), Dr. B. Jayant Baliga is one of the highest regarded experts in the field. He thus leads this team who comprehensively review the materials, device physics, design considerations and relevant applications discussed. Comprehensively covers power electronic devices, including materials (both gallium nitride and silicon carbide), physics, design considerations, and the most promising applications Addresses the key challenges towards the realization of wide bandgap power electronic devices, including materials defects, performance and reliability Provides the benefits of wide bandgap semiconductors, including opportunities for cost reduction and social impact

Gallium Nitride And Silicon Carbide Power Devices

Author : B Jayant Baliga
Publisher : World Scientific Publishing Company
ISBN 13 : 9813109424
Total Pages : 592 pages
Book Rating : 4.8/5 (131 download)

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Book Synopsis Gallium Nitride And Silicon Carbide Power Devices by : B Jayant Baliga

Download or read book Gallium Nitride And Silicon Carbide Power Devices written by B Jayant Baliga and published by World Scientific Publishing Company. This book was released on 2016-12-12 with total page 592 pages. Available in PDF, EPUB and Kindle. Book excerpt: During the last 30 years, significant progress has been made to improve our understanding of gallium nitride and silicon carbide device structures, resulting in experimental demonstration of their enhanced performances for power electronic systems. Gallium nitride power devices made by the growth of the material on silicon substrates have gained a lot of interest. Power device products made from these materials have become available during the last five years from many companies.This comprehensive book discusses the physics of operation and design of gallium nitride and silicon carbide power devices. It can be used as a reference by practicing engineers in the power electronics industry and as a textbook for a power device or power electronics course in universities.

Review and Characterization of Gallium Nitride Power Devices

Author : Edward Andrew Jones
Publisher :
ISBN 13 :
Total Pages : 150 pages
Book Rating : 4.:/5 (972 download)

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Book Synopsis Review and Characterization of Gallium Nitride Power Devices by : Edward Andrew Jones

Download or read book Review and Characterization of Gallium Nitride Power Devices written by Edward Andrew Jones and published by . This book was released on 2016 with total page 150 pages. Available in PDF, EPUB and Kindle. Book excerpt: Gallium Nitride (GaN) power devices are an emerging technology that have only recently become available commercially. This new technology enables the design of converters at higher frequencies and efficiencies than those achievable with conventional Si devices. This thesis reviews the characteristics and commercial status of both vertical and lateral GaN power devices from the user perspective, providing the background necessary to understand the significance of these recent developments. Additionally, the challenges encountered in GaN-based converter design are considered, such as the consequences of faster switching on gate driver design and board layout. Other issues include the unique reverse conduction behavior, dynamic on-resistance, breakdown mechanisms, thermal design, device availability, and reliability qualification. Static and dynamic characterization was then performed across the full current, voltage, and temperature range of this device to enable effective GaN-based converter design. Static testing was performed with a curve tracer and precision impedance analyzer. A double pulse test setup was constructed and used to measure switching loss and time at the fastest achievable switching speed, and the subsequent overvoltages due to the fast switching were characterized. The results were also analyzed to characterize the effects of cross-talk in the active and synchronous devices of a phase-leg topology with enhancement-mode GaN HFETs. Based on these results and analysis, an accurate loss model was developed for the device under test. Based on analysis of these characterization results, a simplified model was developed to describe the overall switching behavior and some unique features of the device. The consequences of the Miller effect during the turn-on transient were studied to show that no Miller plateau occurs, but rather a decreased gate voltage slope, followed by a sharp drop. The significance of this distinction is derived and explained. GaN performance at elevated temperature was also studied, because turn-on time increases significantly with temperature, and turn-on losses increase as a result. Based on this relationship, a temperature-dependent turn-on model and a linear scaling factor was proposed for estimating turn-on loss in e-mode GaN HFETs.

Vertical Gallium Nitride Power Devices on Bulk Native Substrates

Author : Min Sun (Ph. D.)
Publisher :
ISBN 13 :
Total Pages : 151 pages
Book Rating : 4.:/5 (1 download)

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Book Synopsis Vertical Gallium Nitride Power Devices on Bulk Native Substrates by : Min Sun (Ph. D.)

Download or read book Vertical Gallium Nitride Power Devices on Bulk Native Substrates written by Min Sun (Ph. D.) and published by . This book was released on 2017 with total page 151 pages. Available in PDF, EPUB and Kindle. Book excerpt: Lateral power devices based on AlGaN/GaN hetero-structures have achieved excellent performance in the medium power range applications. However for higher voltage higher current switches, a vertical structure is preferred since its die area does not depend on the breakdown voltage. This thesis studies vertical GaN power diodes and transistors grown on bulk GaN substrates. The first part of the thesis studies the PiN diode. Low p-GaN ohmic contact resistance is obtained through annealing in oxygen ambient. The breakdown voltage reaches 1200 V with optimized field plate design. The resistance components of the PiN diodes are also analyzed in this part of the thesis. The second half of the thesis presents a novel vertical power FinFET design with only n-GaN epi-layers. One of the key fabrication processes required for this device structure is to achieve a smooth vertical fin sidewall by combining dry/wet etch. The normally-off power FinFET demonstrates excellent performances without the need of p-GaN layer or material regrowth. With the optimization of edge termination structures, 800 V blocking voltage was achieved. A further reduction of on resistance is achieved by increasing the cap layer doping. Switching characteristics are investigated by capacitance measurements. The thesis concludes with the demonstration of spalling off the bulk GaN substrate after device fabrication. Thanks to the substrate spalling technology, the on resistance of the device can be further reduced and the bulk GaN substrate could possibly be reused to save cost.