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Electronic Packaging Materials Science V Volume 203
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Book Synopsis Electronic Packaging Materials Science V: Volume 203 by : Edwin D. Lillie
Download or read book Electronic Packaging Materials Science V: Volume 203 written by Edwin D. Lillie and published by . This book was released on 1991-06-07 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Book Synopsis Electronic Packaging Materials Science V: Symposium Held in Boston, Massachusetts on 26-29 November 1990. Materials Research Society Symposium Proceedings by : Edwin D. Lillie
Download or read book Electronic Packaging Materials Science V: Symposium Held in Boston, Massachusetts on 26-29 November 1990. Materials Research Society Symposium Proceedings written by Edwin D. Lillie and published by . This book was released on 1990 with total page 473 pages. Available in PDF, EPUB and Kindle. Book excerpt: The theme of the symposium deals with materials-related issues important to the future of technology for the packaging and interconnection of electronic components. This technology is on the critical path to increased performance of office computers and workstations, home computers, mainframes, supercomputers, control systems in automobiles, navigation and avionics, fast processors for medical diagnostics, or the huge telecommunications industry. It is true of all these applications that major advanced in packaging and interconnect are only possible with concomitant progress in materials science. Performance is not the only issue so influences, so too is compactness, lightness and cost to the consumer. The symposium included sessions on the mechanical and deformation properties of polymer interfaces (with emphasis and the effects of plastic behavior in polymeric thin films, and general attention to stress effects on reliability), protective coatings for IC's, polymers and polymer-processing for high density packaging (e.g., photoimageable polyimides, use of liquid crystals to control thermal expansion, effect of curing on stress in polyimides in multilayer structures), ceramics and glass-ceramics (emphasis on aluminum nitride bulk, and interface properties), metallization techniques (low temperature CVD of copper films, laser planarization, laser assisted deposition of catalysts for electroless and electrolytic plating of copper), solders and soldering (including fatigue life predictions for solder joints), and measurement of material properties of thin films.
Book Synopsis Electronic Packaging Materials Science by :
Download or read book Electronic Packaging Materials Science written by and published by . This book was released on 1993 with total page 480 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Electronic Packaging Materials Science III: Volume 108 by : Ralph Jaccodine
Download or read book Electronic Packaging Materials Science III: Volume 108 written by Ralph Jaccodine and published by Mrs Proceedings. This book was released on 1988 with total page 514 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Book Synopsis Multichip Module Technologies and Alternatives: The Basics by : Daryl Ann Doane
Download or read book Multichip Module Technologies and Alternatives: The Basics written by Daryl Ann Doane and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 895 pages. Available in PDF, EPUB and Kindle. Book excerpt: Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.
Book Synopsis Electronic Packaging Materials Science IX: Volume 445 by : Steven K. Groothuis
Download or read book Electronic Packaging Materials Science IX: Volume 445 written by Steven K. Groothuis and published by . This book was released on 1997-10-20 with total page 344 pages. Available in PDF, EPUB and Kindle. Book excerpt: While this book continues the spirit of the MRS series on materials science related to the development of electronic packaging, it also focuses on three very specific technological areas - technology for flip-chip packaging, materials metrology and characterization, and packaging reliability and testing. These are important areas for technology development in electronic packaging, particularly since materials and processing play an important role in controlling system performance and reliability. Topics include: flip-chip and solder technology; future packaging technology; manufacturing technology in packaging; packaging materials and metrology; interfacial adhesion and fracture and packaging reliability and testing.
Book Synopsis Electronic Packaging Materials Science VIII: Volume 390 by : Robert C. Sundahl
Download or read book Electronic Packaging Materials Science VIII: Volume 390 written by Robert C. Sundahl and published by . This book was released on 1995-09-26 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: The dynamic nature of the microelectronics industry, in particular within the area of packaging, requires a continuous updating and revision of priorities. In an effort to communicate these priorities to researchers and engineers in the field, the National Technology Road Map was developed. This proceedings volume, the eighth in a series on electronic packaging, focuses on the materials research, development and processing issues identified in the road map. Topics include: an overview of the National Technology Road Map for Semiconductors; institutional and industrial perspectives; impact on materials needs and materials science issues; and research responses. Technical subtopics include polymers, ceramics, solder and composites.
Book Synopsis National Semiconductor Metrology Program, Semiconductor Electronics Division, NIST List Of Publications, LP 103, March 1999 by :
Download or read book National Semiconductor Metrology Program, Semiconductor Electronics Division, NIST List Of Publications, LP 103, March 1999 written by and published by . This book was released on 1999 with total page 148 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis National Semiconductor Metrology Program by : National Semiconductor Metrology Program (U.S.)
Download or read book National Semiconductor Metrology Program written by National Semiconductor Metrology Program (U.S.) and published by . This book was released on 2000 with total page 160 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis National Semiconductor Metrology Program by : National Institute of Standards and Technology (U.S.)
Download or read book National Semiconductor Metrology Program written by National Institute of Standards and Technology (U.S.) and published by . This book was released on 2000 with total page 160 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Electronic Packaging Materials Science VII: Volume 323 by : Peter Børgesen
Download or read book Electronic Packaging Materials Science VII: Volume 323 written by Peter Børgesen and published by . This book was released on 1994-03-21 with total page 480 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Book Synopsis Electronic Packaging Science and Technology by : King-Ning Tu
Download or read book Electronic Packaging Science and Technology written by King-Ning Tu and published by John Wiley & Sons. This book was released on 2021-12-29 with total page 340 pages. Available in PDF, EPUB and Kindle. Book excerpt: Must-have reference on electronic packaging technology! The electronics industry is shifting towards system packaging technology due to the need for higher chip circuit density without increasing production costs. Electronic packaging, or circuit integration, is seen as a necessary strategy to achieve a performance growth of electronic circuitry in next-generation electronics. With the implementation of novel materials with specific and tunable electrical and magnetic properties, electronic packaging is highly attractive as a solution to achieve denser levels of circuit integration. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology.
Book Synopsis Electronic Packaging Materials Science VI by : P. S. Ho
Download or read book Electronic Packaging Materials Science VI written by P. S. Ho and published by . This book was released on 1992 with total page 464 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Materials for Electronic Packaging by : Deborah D.L. Chung
Download or read book Materials for Electronic Packaging written by Deborah D.L. Chung and published by Elsevier. This book was released on 1995-03-31 with total page 383 pages. Available in PDF, EPUB and Kindle. Book excerpt: Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems. - Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors - Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science - Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems
Book Synopsis Advanced Electronic Packaging Materials: Volume 167 by : Andrew T. Barfknecht
Download or read book Advanced Electronic Packaging Materials: Volume 167 written by Andrew T. Barfknecht and published by . This book was released on 1990-04-11 with total page 416 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Book Synopsis Electronic Packaging Materials Science II: Volume 72 by : K. A. Jackson
Download or read book Electronic Packaging Materials Science II: Volume 72 written by K. A. Jackson and published by . This book was released on 1986-11-07 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Book Synopsis Semiconductor Measurement Technology by : National Institute of Standards and Technology (U.S.)
Download or read book Semiconductor Measurement Technology written by National Institute of Standards and Technology (U.S.) and published by . This book was released on with total page 60 pages. Available in PDF, EPUB and Kindle. Book excerpt:
