Electromigration at Via Contacts in Multilevel Interconnect Systems

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ISBN 13 :
Total Pages : 426 pages
Book Rating : 4.:/5 (64 download)

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Book Synopsis Electromigration at Via Contacts in Multilevel Interconnect Systems by : Lawrence Peter Muray

Download or read book Electromigration at Via Contacts in Multilevel Interconnect Systems written by Lawrence Peter Muray and published by . This book was released on 1990 with total page 426 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Proceedings

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Publisher :
ISBN 13 :
Total Pages : 504 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Proceedings by :

Download or read book Proceedings written by and published by . This book was released on 1990 with total page 504 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Metrology and Diagnostic Techniques for Nanoelectronics

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Publisher : CRC Press
ISBN 13 : 135173394X
Total Pages : 843 pages
Book Rating : 4.3/5 (517 download)

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Book Synopsis Metrology and Diagnostic Techniques for Nanoelectronics by : Zhiyong Ma

Download or read book Metrology and Diagnostic Techniques for Nanoelectronics written by Zhiyong Ma and published by CRC Press. This book was released on 2017-03-27 with total page 843 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nanoelectronics is changing the way the world communicates, and is transforming our daily lives. Continuing Moore’s law and miniaturization of low-power semiconductor chips with ever-increasing functionality have been relentlessly driving R&D of new devices, materials, and process capabilities to meet performance, power, and cost requirements. This book covers up-to-date advances in research and industry practices in nanometrology, critical for continuing technology scaling and product innovation. It holistically approaches the subject matter and addresses emerging and important topics in semiconductor R&D and manufacturing. It is a complete guide for metrology and diagnostic techniques essential for process technology, electronics packaging, and product development and debugging—a unique approach compared to other books. The authors are from academia, government labs, and industry and have vast experience and expertise in the topics presented. The book is intended for all those involved in IC manufacturing and nanoelectronics and for those studying nanoelectronics process and assembly technologies or working in device testing, characterization, and diagnostic techniques.

Electromigration Behavior and Reliability of Aluminum-based Multilevel Interconnects for Integrated Circuits

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ISBN 13 :
Total Pages : 380 pages
Book Rating : 4.:/5 (328 download)

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Book Synopsis Electromigration Behavior and Reliability of Aluminum-based Multilevel Interconnects for Integrated Circuits by : Harold Kahn

Download or read book Electromigration Behavior and Reliability of Aluminum-based Multilevel Interconnects for Integrated Circuits written by Harold Kahn and published by . This book was released on 1992 with total page 380 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Predictive Simulation of Semiconductor Processing

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Publisher : Springer Science & Business Media
ISBN 13 : 3662094320
Total Pages : 505 pages
Book Rating : 4.6/5 (62 download)

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Book Synopsis Predictive Simulation of Semiconductor Processing by : Jarek Dabrowski

Download or read book Predictive Simulation of Semiconductor Processing written by Jarek Dabrowski and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 505 pages. Available in PDF, EPUB and Kindle. Book excerpt: Predictive Simulation of Semiconductor Processing enables researchers and developers to extend the scaling range of semiconductor devices beyond the parameter range of empirical research. It requires a thorough understanding of the basic mechanisms employed in device fabrication, such as diffusion, ion implantation, epitaxy, defect formation and annealing, and contamination. This book presents an in-depth discussion of our current understanding of key processes and identifies areas that require further work in order to achieve the goal of a comprehensive, predictive process simulation tool.

Proceedings of the Symposia on Interconnects, Contact Metallization, and Multilevel Metallization and Reliability for Semiconductor Devices, Interconnects, and Thin Insulator Materials

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Publisher :
ISBN 13 :
Total Pages : 520 pages
Book Rating : 4.:/5 (2 download)

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Book Synopsis Proceedings of the Symposia on Interconnects, Contact Metallization, and Multilevel Metallization and Reliability for Semiconductor Devices, Interconnects, and Thin Insulator Materials by : T. O. Herndon

Download or read book Proceedings of the Symposia on Interconnects, Contact Metallization, and Multilevel Metallization and Reliability for Semiconductor Devices, Interconnects, and Thin Insulator Materials written by T. O. Herndon and published by . This book was released on 1993 with total page 520 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Electrothermal Analysis of VLSI Systems

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Publisher : Springer Science & Business Media
ISBN 13 : 079237861X
Total Pages : 220 pages
Book Rating : 4.7/5 (923 download)

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Book Synopsis Electrothermal Analysis of VLSI Systems by : Yi-Kan Cheng

Download or read book Electrothermal Analysis of VLSI Systems written by Yi-Kan Cheng and published by Springer Science & Business Media. This book was released on 2000-06-30 with total page 220 pages. Available in PDF, EPUB and Kindle. Book excerpt: This useful book addresses electrothermal problems in modern VLSI systems. It discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires. The authors present three important applications of VLSI electrothermal analysis: temperature-dependent electromigration diagnosis, cell-level thermal placement, and temperature-driven power and timing analysis.

Materials Reliability in Microelectronics

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Publisher :
ISBN 13 :
Total Pages : 616 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Materials Reliability in Microelectronics by :

Download or read book Materials Reliability in Microelectronics written by and published by . This book was released on 1996 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Proceedings of the Symposium on Electromigration of Metals and First International Symposium on Multilevel Metallization and Packaging

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Publisher :
ISBN 13 :
Total Pages : 214 pages
Book Rating : 4.0/5 ( download)

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Book Synopsis Proceedings of the Symposium on Electromigration of Metals and First International Symposium on Multilevel Metallization and Packaging by : James R. Lloyd

Download or read book Proceedings of the Symposium on Electromigration of Metals and First International Symposium on Multilevel Metallization and Packaging written by James R. Lloyd and published by . This book was released on 1985 with total page 214 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Materials Reliability in Microelectronics VI: Volume 428

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ISBN 13 :
Total Pages : 616 pages
Book Rating : 4.:/5 (318 download)

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Book Synopsis Materials Reliability in Microelectronics VI: Volume 428 by : William F. Filter

Download or read book Materials Reliability in Microelectronics VI: Volume 428 written by William F. Filter and published by . This book was released on 1996-11-18 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: MRS books on materials reliability in microelectronics have become the snapshot of progress in this field. Reduced feature size, increased speed, and larger area are all factors contributing to the continual performance and functionality improvements in integrated circuit technology. These same factors place demands on the reliability of the individual components that make up the IC. Achieving increased reliability requires an improved understanding of both thin-film and patterned-feature materials properties and their degradation mechanisms, how materials and processes used to fabricate ICs interact, and how they may be tailored to enable reliability improvements. This book focuses on the physics and materials science of microelectronics reliability problems rather than the traditional statistical, accelerated electrical testing aspects. Studies are grouped into three large sections covering electromigration, gate oxide reliability and mechanical stress behavior. Topics include: historical summary; reliability issues for Cu metallization; characterization of electromigration phenomena; modelling; microstructural evolution and influences; oxide and device reliability; thin oxynitride dielectrics; noncontact diagnostics; stress effects in thin films and interconnects and microbeam X-ray techniques for stress measurements.

Multicomponent and Multilayered Thin Films for Advanced Microtechnologies: Techniques, Fundamentals and Devices

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Publisher : Springer Science & Business Media
ISBN 13 : 9401117276
Total Pages : 625 pages
Book Rating : 4.4/5 (11 download)

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Book Synopsis Multicomponent and Multilayered Thin Films for Advanced Microtechnologies: Techniques, Fundamentals and Devices by : O. Auciello

Download or read book Multicomponent and Multilayered Thin Films for Advanced Microtechnologies: Techniques, Fundamentals and Devices written by O. Auciello and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 625 pages. Available in PDF, EPUB and Kindle. Book excerpt: The synthesis of multicomponent/multilayered superconducting, conducting, semiconducting and insulating thin films has become the subject of an intensive, worldwide, interdisciplinary research effort. The development of deposition-characterization techniques and the science and technology related to the synthesis of these films are critical for the successful evolution of this interdisciplinary field of research and the implementation of the new materials in a whole new generation of advanced microdevices. This book contains the lectures and contributed papers on various scientific and technological aspects of multicomponent and multilayered thin films presented at a NATO/ASI. Compared to other recent books on thin films, the distinctive character of this book is the interdisciplinary treatment of the various fields of research related to the different thin film materials mentioned above. The wide range of topics discussed in this book include vacuum-deposition techniques, synthesis-processing, characterization, and devices of multicomponent/multilayered oxide high temperature superconducting, ferroelectric, electro-optic, optical, metallic, silicide, and compound semiconductor thin films. The book presents an unusual intedisciplinary exchange of ideas between researchers with cross-disciplinary backgrounds and it will be useful to established investigators as well as postdoctoral and graduate students.

Multilevel Interconnect Technology

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Publisher : McGraw-Hill Companies
ISBN 13 :
Total Pages : 250 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Multilevel Interconnect Technology by : Gopal K. Rao

Download or read book Multilevel Interconnect Technology written by Gopal K. Rao and published by McGraw-Hill Companies. This book was released on 1993 with total page 250 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first book on a key topic in IC technology. Table of Contents: Multilevel Interconnection Design; Multilevel Interconnect Processing; Manufacturing; Reliability; Index. 100 illustrations.

Advanced Metallization and Interconnect Systems for ULSI Applications in 1996: Volume 12

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Publisher : Mrs Conference Proceedings
ISBN 13 :
Total Pages : 640 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Advanced Metallization and Interconnect Systems for ULSI Applications in 1996: Volume 12 by : Robert Havemann

Download or read book Advanced Metallization and Interconnect Systems for ULSI Applications in 1996: Volume 12 written by Robert Havemann and published by Mrs Conference Proceedings. This book was released on 1997 with total page 640 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Eighth International IEEE VLSI Multilevel Interconnection Conference, 1991

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Publisher : Institute of Electrical & Electronics Engineers(IEEE)
ISBN 13 :
Total Pages : 478 pages
Book Rating : 4.X/5 (2 download)

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Book Synopsis Eighth International IEEE VLSI Multilevel Interconnection Conference, 1991 by : IEEE Electron Devices Society

Download or read book Eighth International IEEE VLSI Multilevel Interconnection Conference, 1991 written by IEEE Electron Devices Society and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1991 with total page 478 pages. Available in PDF, EPUB and Kindle. Book excerpt:

BiCMOS Technology and Applications

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Publisher : Springer Science & Business Media
ISBN 13 : 1475720297
Total Pages : 345 pages
Book Rating : 4.4/5 (757 download)

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Book Synopsis BiCMOS Technology and Applications by : Antonio R. Alvarez

Download or read book BiCMOS Technology and Applications written by Antonio R. Alvarez and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 345 pages. Available in PDF, EPUB and Kindle. Book excerpt: The topic of bipolar compatible CMOS (BiCMOS) is a fascinating one and of ever-growing practical importance. The "technology pendulum" has swung from the two extremes of preeminence of bipolar in the 1950s and 60s to the apparent endless horizons for VLSI NMOS technology during the 1970s and 80s. Yet starting in the 1980s severallimits were clouding the horizon for pure NMOS technology. CMOS reemerged as a· viable high density, high performance technology. Similarly by the mid 1980s scaled bipolar devices had not only demonstrated new high speed records, but early versions of mixed bipolar/CMOS technology were being produced. Hence the paradigm of either high density . Q[ high speed was metamorphasizing into an opportunity for both speed and density via a BiCMOS approach. Now as we approach the 1990s there have been a number of practical demonstrations of BiCMOS both for memory and logic applications and I expect the trend to escalate over the next decade. This book makes a timely contribution to the field of BiCMOS technology and circuit development. The evolution is now indeed rapid so that it is difficult to make such a book exhaustive of current developments. Probably equally difficult is the fact that the new technology opens a range of novel circuit opportunities that are as yet only formative in their development. Given these obstacles it is a herculean task to try to assemble a book on BiCMOS.

Proceedings of the Symposia on Reliability of Semiconductor Devices and Interconnection and Multilevel Metallization, Interconnection, and Contact Technologies

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Publisher :
ISBN 13 :
Total Pages : 516 pages
Book Rating : 4.F/5 ( download)

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Book Synopsis Proceedings of the Symposia on Reliability of Semiconductor Devices and Interconnection and Multilevel Metallization, Interconnection, and Contact Technologies by : Harzara S. Rathore

Download or read book Proceedings of the Symposia on Reliability of Semiconductor Devices and Interconnection and Multilevel Metallization, Interconnection, and Contact Technologies written by Harzara S. Rathore and published by . This book was released on 1989 with total page 516 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Fundamentals of Electromigration-Aware Integrated Circuit Design

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Publisher : Springer
ISBN 13 : 3319735586
Total Pages : 171 pages
Book Rating : 4.3/5 (197 download)

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Book Synopsis Fundamentals of Electromigration-Aware Integrated Circuit Design by : Jens Lienig

Download or read book Fundamentals of Electromigration-Aware Integrated Circuit Design written by Jens Lienig and published by Springer. This book was released on 2018-02-23 with total page 171 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. It introduces the physical process of electromigration, which gives the reader the requisite understanding and knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration’s negative impact on circuit reliability.