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Electromagnetic Modeling Of Interconnections In Three Dimensional Integration
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Book Synopsis Electromagnetic Modeling of Interconnections in Three-dimensional Integration by : Ki Jin Han
Download or read book Electromagnetic Modeling of Interconnections in Three-dimensional Integration written by Ki Jin Han and published by . This book was released on 2009 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: As the convergence of multiple functions in a single electronic device drives current electronic trends, the need for increasing integration density is becoming more emphasized than in the past. To keep up with the industrial need and realize the new system integration law, three-dimensional (3-D) integration called System-on-Package (SoP) is becoming necessary. However, the commercialization of 3-D integration should overcome several technical barriers, one of which is the difficulty for the electrical design of interconnections. The 3-D interconnection design is difficult because of the modeling challenge of electrical coupling from the complicated structures of a large number of interconnections. In addition, mixed-signal design requires broadband modeling, which covers a large frequency spectrum for integrated microsystems. By using currently available methods, the electrical modeling of 3-D interconnections can be a very challenging task. This dissertation proposes a new method for constructing a broadband model of a large number of 3-D interconnections. The basic idea to address the many interconnections is using modal basis functions that capture electrical effects in interconnections. Since the use of global modal basis functions alleviates the need for discretization process of the interconnection structure, the computational cost is reduced considerably. The resultant interconnection model is a RLGC model that describes the broadband electrical behavior including losses and couplings. The smaller number of basis functions makes the interconnection model simpler, and therefore allows the generation of network parameters at reduced computational cost. Focusing on the modeling of bonding wires in stacked ICs and through-silicon via (TSV) interconnections, this research validates the interconnection modeling approach using several examples from 3-D full-wave EM simulation results.
Book Synopsis Towards a Modeling Synthesis of Two or Three-Dimensional Circuits Through Substrate Coupling and Interconnections: Noises and Parasites by : Christian Gontrand
Download or read book Towards a Modeling Synthesis of Two or Three-Dimensional Circuits Through Substrate Coupling and Interconnections: Noises and Parasites written by Christian Gontrand and published by Bentham Science Publishers. This book was released on 2014-04-21 with total page 225 pages. Available in PDF, EPUB and Kindle. Book excerpt: The number of transistors in integrated circuits doubles every two years, as stipulated by Moore’s law, and this has been the driving force for the huge development of the microelectronics industry in the past 50 years – currently advanced to the nanometric scale. This e-book is dedicated to electronic noises and parasites, accounting for issues involving substrate coupling and interconnections, in the perspective of the 3D integration: a second track for enhancing integration, also compatible with Moore’s law. This reference explains the modeling of 3D circuits without delving into the latest advances, but highlights crucial problems, for instance electro-thermo-mechanical problems, which could be addressed through 3D modeling. The book also explains electromagnetic interferences , at different modeling levels (device and circuit) oriented towards 3D integration technologies. It also covers substrate noise, such as disturbances of digital blocks, power bounces, phase noise in oscillators, both at the device level, such as carriers or field fluctuations, and circuit levels. The entanglement between interconnect and substrate is also discussed. This e-book serves as a reference for advanced graduates or researchers in the field of micro and nano electronics interested in topics relevant to electromagnetic interference or the ‘noise’ domain, at device or circuit and system levels
Book Synopsis Design and Modeling for 3D ICs and Interposers by : Madhavan Swaminathan
Download or read book Design and Modeling for 3D ICs and Interposers written by Madhavan Swaminathan and published by World Scientific. This book was released on 2013-11-05 with total page 379 pages. Available in PDF, EPUB and Kindle. Book excerpt: 3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.
Book Synopsis Arbitrary Modeling of TSVs for 3D Integrated Circuits by : Khaled Salah
Download or read book Arbitrary Modeling of TSVs for 3D Integrated Circuits written by Khaled Salah and published by Springer. This book was released on 2014-08-21 with total page 181 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.
Book Synopsis Full-wave Surface Integral Equation Method for Electromagnetic-circuit Simulation of Three-dimensional Interconnects in Layered Media by : Nur Karsilayan
Download or read book Full-wave Surface Integral Equation Method for Electromagnetic-circuit Simulation of Three-dimensional Interconnects in Layered Media written by Nur Karsilayan and published by . This book was released on 2011 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: A new full-wave surface impedance integral equation method is presented for three-dimensional arbitrary-shaped interconnect parasitic extraction in layered media. Various new ways of applying voltage and current excitations for electromagnetic-circuit simulation are introduced. A new algorithm is proposed for matrix formation of electromagnetic-circuit simulation, low frequency solution and layered media so that it can be easily integrated to a Rao-Wilton-Glisson based method of moment code. Two mixed potential integral equation forms of the electric field integral equation are adapted along with the Michalski-Mosig formulations for layered kernels to model electromagnetic interactions of interconnects in layered media over a conducting substrate. The layered kernels are computed directly for controllable accuracy. The proposed methods are validated against existing methods for both electromagnetic and electromagnetic-circuit problems.
Book Synopsis Three-Dimensional Integration of Semiconductors by : Kazuo Kondo
Download or read book Three-Dimensional Integration of Semiconductors written by Kazuo Kondo and published by Springer. This book was released on 2015-12-09 with total page 423 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.
Book Synopsis Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging by : Xing-Chang Wei
Download or read book Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging written by Xing-Chang Wei and published by CRC Press. This book was released on 2017-09-19 with total page 251 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems. This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.
Book Synopsis Digital Technologies and Applications by : Saad Motahhir
Download or read book Digital Technologies and Applications written by Saad Motahhir and published by Springer Nature. This book was released on 2021-06-26 with total page 1836 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book gathers selected research papers presented at the First International Conference on Digital Technologies and Applications (ICDTA 21), held at Sidi Mohamed Ben Abdellah University, Fez, Morocco, on 29–30 January 2021. highlighting the latest innovations in digital technologies as: artificial intelligence, Internet of things, embedded systems, network technology, information processing, and their applications in several areas such as hybrid vehicles, renewable energy, robotic, and COVID-19. The respective papers encourage and inspire researchers, industry professionals, and policymakers to put these methods into practice.
Book Synopsis The Nystrom Method in Electromagnetics by : Mei Song Tong
Download or read book The Nystrom Method in Electromagnetics written by Mei Song Tong and published by John Wiley & Sons. This book was released on 2020-06-29 with total page 528 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive, step-by-step reference to the Nyström Method for solving Electromagnetic problems using integral equations Computational electromagnetics studies the numerical methods or techniques that solve electromagnetic problems by computer programming. Currently, there are mainly three numerical methods for electromagnetic problems: the finite-difference time-domain (FDTD), finite element method (FEM), and integral equation methods (IEMs). In the IEMs, the method of moments (MoM) is the most widely used method, but much attention is being paid to the Nyström method as another IEM, because it possesses some unique merits which the MoM lacks. This book focuses on that method—providing information on everything that students and professionals working in the field need to know. Written by the top researchers in electromagnetics, this complete reference book is a consolidation of advances made in the use of the Nyström method for solving electromagnetic integral equations. It begins by introducing the fundamentals of the electromagnetic theory and computational electromagnetics, before proceeding to illustrate the advantages unique to the Nyström method through rigorous worked out examples and equations. Key topics include quadrature rules, singularity treatment techniques, applications to conducting and penetrable media, multiphysics electromagnetic problems, time-domain integral equations, inverse scattering problems and incorporation with multilevel fast multiple algorithm. Systematically introduces the fundamental principles, equations, and advantages of the Nyström method for solving electromagnetic problems Features the unique benefits of using the Nyström method through numerical comparisons with other numerical and analytical methods Covers a broad range of application examples that will point the way for future research The Nystrom Method in Electromagnetics is ideal for graduate students, senior undergraduates, and researchers studying engineering electromagnetics, computational methods, and applied mathematics. Practicing engineers and other industry professionals working in engineering electromagnetics and engineering mathematics will also find it to be incredibly helpful.
Book Synopsis Design and Process for Three-dimensional Heterogeneous Integration by : Shulu Chen
Download or read book Design and Process for Three-dimensional Heterogeneous Integration written by Shulu Chen and published by Stanford University. This book was released on 2010 with total page 186 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since the invention of the integrated circuit (IC) in the late 1950s, the semiconductor industry has experienced dramatic growth driven by both technology and manufacturing improvements. Over the past 40 years, the industry's growth trend has been predicted by Moore's law, and driven by the constant electrical field scaling design methodology. While the intrinsic performance of each device improves over generations, the corresponding interconnects do not. To alleviate this interconnect issue, a three-dimensional (3D) integration concept of transforming longer side to side interconnects into shorter vertical vias by using multiple active layers has attracted much attention. The focus of this thesis is on providing the foundation for 3D heterogeneous integration by investigating methods of growing single crystal materials on the silicon platform and the subsequent low-temperature process flow, through experimental demonstration, theoretical modeling and device structure simplification. First, thin film single crystal GaAs and GaSb were grown on dielectric layers on bulk silicon substrates by the rapid melt growth (RMG) method, using both rapid thermal annealing (RTA) and laser annealing. The relationship between stoichiometry and the crystal structure is discussed according to the theoretical phase diagram and the experimental results. A modified RMG structure is also proposed and demonstrated to solve the potential issue involved in integrating the RMG method into a three-dimensional integrated circuits (3D-IC) process with thick isolation layers. In order to estimate the outcome of the crystallization and to provide further understanding of the physics behind this RMG process, compact models are derived based on classical crystallization theory. Mathematical models including the geometry, the thermal environment and the outcome of the crystallization are built. The initial cooling rate is identified as the key factor for the RMG process. With the ability of integrating multiple materials on silicon substrates, the subsequent process flows using low-temperature-fabrication or simplified device structures are proposed and evaluated to achieve high density 3D integration. A "bonding substrate/monolithic contact" approach is proposed to relieve the thermal constraint from getting the starting single crystal layer without sacrificing the interconnect performance. A low-temperature process using germanium as the channel material is also discussed. Finally, gated thin film resistor structures are designed and compared to the conventional MOSFET structure with a focus on their relative performance and process complexity trade-off for future 3D-IC implementation.
Book Synopsis Handbook of 3D Integration, Volume 1 by : Philip Garrou
Download or read book Handbook of 3D Integration, Volume 1 written by Philip Garrou and published by John Wiley & Sons. This book was released on 2011-09-22 with total page 798 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.
Book Synopsis Three-Dimensional Integrated Circuit Design by : Vasilis F. Pavlidis
Download or read book Three-Dimensional Integrated Circuit Design written by Vasilis F. Pavlidis and published by Newnes. This book was released on 2017-07-04 with total page 770 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization
Book Synopsis Three-dimensional Electromagnetics by : Michael L. Oristaglio
Download or read book Three-dimensional Electromagnetics written by Michael L. Oristaglio and published by SEG Books. This book was released on 1999 with total page 720 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers major techniques used to compute, analyze, visualize, and understand 3D electromagnetic fields in every major application of electrical geophysics. The 44 papers, written especially for this volume, are divided between techniques of 3D modeling and inversion (21 papers) and applications (23 papers). The latter include exploration for minerals and hydrocarbons, regional crustal studies, and environmental surveys. These contributions represent the work of 95 authors from 56 institutions in 13 countries.
Book Synopsis Electrical Modeling and Design for 3D System Integration by : Er-Ping Li
Download or read book Electrical Modeling and Design for 3D System Integration written by Er-Ping Li and published by John Wiley & Sons. This book was released on 2012-04-10 with total page 394 pages. Available in PDF, EPUB and Kindle. Book excerpt: New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures. Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through: The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards An equivalent circuit model of through-silicon vias Metal-oxide-semiconductor capacitance effects of through-silicon vias Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.
Book Synopsis Multigrid Finite Element Methods for Electromagnetic Field Modeling by : Yu Zhu
Download or read book Multigrid Finite Element Methods for Electromagnetic Field Modeling written by Yu Zhu and published by John Wiley & Sons. This book was released on 2006-02-03 with total page 453 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is the first comprehensive monograph that features state-of-the-art multigrid methods for enhancing the modeling versatility, numerical robustness, and computational efficiency of one of the most popular classes of numerical electromagnetic field modeling methods: the method of finite elements. The focus of the publication is the development of robust preconditioners for the iterative solution of electromagnetic field boundary value problems (BVPs) discretized by means of finite methods. Specifically, the authors set forth their own successful attempts to utilize concepts from multigrid and multilevel methods for the effective preconditioning of matrices resulting from the approximation of electromagnetic BVPs using finite methods. Following the authors' careful explanations and step-by-step instruction, readers can duplicate the authors' results and take advantage of today's state-of-the-art multigrid/multilevel preconditioners for finite element-based iterative electromagnetic field solvers. Among the highlights of coverage are: * Application of multigrid, multilevel, and hybrid multigrid/multilevel preconditioners to electromagnetic scattering and radiation problems * Broadband, robust numerical modeling of passive microwave components and circuits * Robust, finite element-based modal analysis of electromagnetic waveguides and cavities * Application of Krylov subspace-based methodologies for reduced-order macromodeling of electromagnetic devices and systems * Finite element modeling of electromagnetic waves in periodic structures The authors provide more than thirty detailed algorithms alongside pseudo-codes to assist readers with practical computer implementation. In addition, each chapter includes an applications section with helpful numerical examples that validate the authors' methodologies and demonstrate their computational efficiency and robustness. This groundbreaking book, with its coverage of an exciting new enabling computer-aided design technology, is an essential reference for computer programmers, designers, and engineers, as well as graduate students in engineering and applied physics.
Book Synopsis Through Silicon Vias by : Brajesh Kumar Kaushik
Download or read book Through Silicon Vias written by Brajesh Kumar Kaushik and published by CRC Press. This book was released on 2016-11-30 with total page 165 pages. Available in PDF, EPUB and Kindle. Book excerpt: Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.
Book Synopsis Circuit Oriented Electromagnetic Modeling Using the PEEC Techniques by : Albert Ruehli
Download or read book Circuit Oriented Electromagnetic Modeling Using the PEEC Techniques written by Albert Ruehli and published by John Wiley & Sons. This book was released on 2017-05-30 with total page 609 pages. Available in PDF, EPUB and Kindle. Book excerpt: Bridges the gap between electromagnetics and circuits by addressing electrometric modeling (EM) using the Partial Element Equivalent Circuit (PEEC) method This book provides intuitive solutions to electromagnetic problems by using the Partial Element Equivalent Circuit (PEEC) method. This book begins with an introduction to circuit analysis techniques, laws, and frequency and time domain analyses. The authors also treat Maxwell's equations, capacitance computations, and inductance computations through the lens of the PEEC method. Next, readers learn to build PEEC models in various forms: equivalent circuit models, non-orthogonal PEEC models, skin-effect models, PEEC models for dielectrics, incident and radiate field models, and scattering PEEC models. The book concludes by considering issues like stability and passivity, and includes five appendices some with formulas for partial elements. Leads readers to the solution of a multitude of practical problems in the areas of signal and power integrity and electromagnetic interference Contains fundamentals, applications, and examples of the PEEC method Includes detailed mathematical derivations Circuit Oriented Electromagnetic Modeling Using the PEEC Techniques is a reference for students, researchers, and developers who work on the physical layer modeling of IC interconnects and Packaging, PCBs, and high speed links.
