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Author : David Dahl
Publisher :
ISBN 13 : 9783844060096
Total Pages : pages
Book Rating : 4.0/5 (6 download)
Download or read book Electromagnetic Modeling and Optimization of Through Silicon Vias written by David Dahl and published by . This book was released on 2018 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Xing-Chang Wei
Publisher : CRC Press
ISBN 13 : 1315305852
Total Pages : 251 pages
Book Rating : 4.3/5 (153 download)
Download or read book Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging written by Xing-Chang Wei and published by CRC Press. This book was released on 2017-09-19 with total page 251 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems. This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.
Author : Reza K. Amineh
Publisher : MDPI
ISBN 13 : 303936300X
Total Pages : 242 pages
Book Rating : 4.0/5 (393 download)
Download or read book Applications of Electromagnetic Waves written by Reza K. Amineh and published by MDPI. This book was released on 2021-01-20 with total page 242 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electromagnetic (EM) waves carry energy through propagation in space. This radiation associates with entangled electric and magnetic fields which must exist simultaneously. Although all EM waves travel at the speed of light in vacuum, they cover a wide range of frequencies called the EM spectrum. The various portions of the EM spectrum are referred to by various names based on their different attributes in the emission, transmission, and absorption of the corresponding waves and also based on their different practical applications. There are no certain boundaries separating these various portions, and the ranges tend to overlap. Overall, the EM spectrum, from the lowest to the highest frequency (longest to shortest wavelength) contains the following waves: radio frequency (RF), microwaves, millimeter waves, terahertz, infrared, visible light, ultraviolet, X-rays, and gamma rays. This Special Issue consists of sixteen papers covering a broad range of topics related to the applications of EM waves, from the design of filters and antennas for wireless communications to biomedical imaging and sensing and beyond.
Author : D. Dobrotă
Publisher : IOS Press
ISBN 13 : 1643682237
Total Pages : 764 pages
Book Rating : 4.6/5 (436 download)
Download or read book Proceedings of the 2nd International Conference on Green Energy, Environment and Sustainable Development (GEESD2021) written by D. Dobrotă and published by IOS Press. This book was released on 2021-12-21 with total page 764 pages. Available in PDF, EPUB and Kindle. Book excerpt: The need for green technologies and solutions which will deliver the energy requirements of both the developed and developing world to support sustainability and protect the environment worldwide has never been more urgent. This book contains the proceedings of the 2nd International Conference on Green Energy, Environment and Sustainable Development (GEESD2021) which, due to the COVID-19 pandemic around the world and with the strict travel restrictions in China, was held as a hybrid conference (both physically and online via Zoom) in Shanghai, China on 26 and 27 June 2021. It provided an opportunity to bring together an international community of leading scientists, researchers, engineers and academics, as well as industrial professionals, to exchange and share their experiences and research results in the energy, environment and sustainable development sector. In total, 80 participants were able to exchange knowledge and discuss the latest developments in the field. GEESD2021 attracted more than 250 submissions, 88 of which were accepted after an extensive period of peer review by more than 100 reviewers and members of the program committee. These are included here, grouped into 3 sections, with 28 papers on sustainable energy; 34 on ecology; and 26 papers covering environmental pollution and protection. Offering an overview of the most up-to-date findings and technologies in the field of sustainable energy and environmental protection, the book will be of interest to all those working in this field.
Author : Hengyun Zhang
Publisher : Woodhead Publishing
ISBN 13 : 0081025335
Total Pages : 436 pages
Book Rating : 4.0/5 (81 download)
Download or read book Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore written by Hengyun Zhang and published by Woodhead Publishing. This book was released on 2019-11-14 with total page 436 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. - Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging - Features experimental characterization and qualifications for the analysis and verification of electronic packaging design - Provides multiphysics modeling and analysis techniques of electronic packaging
Author : Shenglin Ma
Publisher : Elsevier
ISBN 13 : 0323996035
Total Pages : 294 pages
Book Rating : 4.3/5 (239 download)
Download or read book TSV 3D RF Integration written by Shenglin Ma and published by Elsevier. This book was released on 2022-04-27 with total page 294 pages. Available in PDF, EPUB and Kindle. Book excerpt: TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters. A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology. - Provides a detailed demonstration of the design and process development of HR-Si (High-Resistivity Silicon) interposer technology - Presents a series of implementation case studies that detail modeling and simulation, integration, qualification and testing methods - Offers a systematic and comparative literature review of HR-Si interposer technology by topic - Offers solutions to problems with TSV (through silicon via) interposer technology, including high frequency loss and cooling problems - Gives a systematic and accessible accounting on this leading technology
Author : Albert Heuberger
Publisher : Springer Science & Business Media
ISBN 13 : 3642230717
Total Pages : 366 pages
Book Rating : 4.6/5 (422 download)
Download or read book Microelectronic Systems written by Albert Heuberger and published by Springer Science & Business Media. This book was released on 2011-12-27 with total page 366 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is dedicated to Prof. Dr. Heinz Gerhäuser on the occasion of his retirement both from the position of Executive Director of the Fraunhofer Institute for Integrated Circuits IIS and from the Endowed Chair of Information Technologies with a Focus on Communication Electronics (LIKE) at the Friedrich-Alexander-Universität Erlangen-Nürnberg. Heinz Gerhäuser's vision and entrepreneurial spirit have made the Fraunhofer IIS one of the most successful and renowned German research institutions. He has been Director of the Fraunhofer IIS since 1993, and under his leadership it has grown to become the largest of Germany's 60 Fraunhofer Institutes, a position it retains to this day, currently employing over 730 staff. Likely his most important scientific as well as application-related contribution was his pivotal role in the development of the mp3 format, which would later become a worldwide success. The contributions to this Festschrift were written by both Fraunhofer IIS staff and external project team members in appreciation of Prof. Dr. Gerhäuser's lifetime academic achievements and his inspiring leadership at the Fraunhofer IIS. The papers reflect the broad spectrum of the institute's research activities and are grouped into sections on circuits, information systems, visual computing, and audio and multimedia. They provide academic and industrial researchers in fields like signal processing, sensor networks, microelectronics, and integrated circuits with an up-to-date overview of research results that have a huge potential for cutting-edge industrial applications.
Author : Ruby Srivastava
Publisher : BoD – Books on Demand
ISBN 13 : 1838809325
Total Pages : 82 pages
Book Rating : 4.8/5 (388 download)
Download or read book Bio-Inspired Technology written by Ruby Srivastava and published by BoD – Books on Demand. This book was released on 2019-09-18 with total page 82 pages. Available in PDF, EPUB and Kindle. Book excerpt: Biomimetic devices are designed and produced by materials, structures, and systems that are modelled on biological entities and processes. These devices are used to synthesize novel materials and their functions at the multiscale level for various applications. Molecular computing biological devices play a key role in the logical processing of the cellular machinery of all living organisms. This book includes information on both biomedical and technological applications of bioactive devices for hard tissue regeneration; design of chip-based disease diagnostic platforms; neuromorphic computing biomaterials that transfer techniques of neuroscience to a silicon chip; various top-down and bottom-up designs; and electrical characterization and transport mechanisms of DNA as nanowires.
Author : Vasilis F. Pavlidis
Publisher : Newnes
ISBN 13 : 0124104843
Total Pages : 770 pages
Book Rating : 4.1/5 (241 download)
Download or read book Three-Dimensional Integrated Circuit Design written by Vasilis F. Pavlidis and published by Newnes. This book was released on 2017-07-04 with total page 770 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization
Author : Fengyuan Sun
Publisher : Editions Publibook
ISBN 13 : 2753903298
Total Pages : 178 pages
Book Rating : 4.7/5 (539 download)
Download or read book Analyse Et Caractérisation Des Couplages Substrat Et de la Connectique Dans Les Circuits 3D written by Fengyuan Sun and published by Editions Publibook. This book was released on 2016 with total page 178 pages. Available in PDF, EPUB and Kindle. Book excerpt: The proposal of doubling the number of transistors on an IC chip (with minimum costs and subtle innovations) every 24 months by Gordon Moore in 1965 (the so-called called Moore's law) has been the most powerful driver for the emphasis of the microelectronics industry in the past 50 years. This law enhances lithography scaling and integration, in 2D, of all functions on a single chip, increasingly through system-on-chip (SOC). On the other hand, the integration of all these functions can be achieved through 3D integrations . Generally speaking, 3D integration consists of 3D IC packaging, 3D IC integration, and 3D Si integration. They are different and mostly the TSV (through-silicon via) separates 3D IC packaging from 3D IC/Si integrations since the latter two uses TSVs, but 3D IC packaging does not. TSV (with a new concept that every chip or interposer could have two surfaces with circuits) is the heart of 3D IC/Si integrations. Continued technology scaling together with the integration of disparate technologies in a single chip means that device performance continues to outstrip interconnect and packaging capabilities, and hence there exist many difficult engineering challenges, most notably in power management, noise isolation, and intra and inter-chip communication. 3D Si integration is the right way to go and compete with Moore's law (more than Moore versus more Moore). However, it is still a long way to go. In this book, Fengyuan SUN proposes new substrate network extraction techniques. Using this latter, the substrate coupling and loss in IC's can be analyzed. He implements some Green/TLM (Transmission Line Matrix) algorithms in MATLAB. It permits to extract impedances between any number of embedded contacts or/and TSVS. He does investigate models of high aspect ratio TSV, on both analytical and numerical methods electromagnetic simulations. This model enables to extract substrate and TSV impedance, S parameters and parasitic elements, considering the variable resistivity of the substrate. It is full compatible with SPICE-like solvers and should allow an investigation in depth of TSV impact on circuit performance.
Author : Massimo Rudan
Publisher : Springer Nature
ISBN 13 : 3030798275
Total Pages : 1680 pages
Book Rating : 4.0/5 (37 download)
Download or read book Springer Handbook of Semiconductor Devices written by Massimo Rudan and published by Springer Nature. This book was released on 2022-11-10 with total page 1680 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Springer Handbook comprehensively covers the topic of semiconductor devices, embracing all aspects from theoretical background to fabrication, modeling, and applications. Nearly 100 leading scientists from industry and academia were selected to write the handbook's chapters, which were conceived for professionals and practitioners, material scientists, physicists and electrical engineers working at universities, industrial R&D, and manufacturers. Starting from the description of the relevant technological aspects and fabrication steps, the handbook proceeds with a section fully devoted to the main conventional semiconductor devices like, e.g., bipolar transistors and MOS capacitors and transistors, used in the production of the standard integrated circuits, and the corresponding physical models. In the subsequent chapters, the scaling issues of the semiconductor-device technology are addressed, followed by the description of novel concept-based semiconductor devices. The last section illustrates the numerical simulation methods ranging from the fabrication processes to the device performances. Each chapter is self-contained, and refers to related topics treated in other chapters when necessary, so that the reader interested in a specific subject can easily identify a personal reading path through the vast contents of the handbook.
Author : Mikael Sahrling
Publisher : Cambridge University Press
ISBN 13 : 1108579760
Total Pages : 257 pages
Book Rating : 4.1/5 (85 download)
Download or read book Fast Techniques for Integrated Circuit Design written by Mikael Sahrling and published by Cambridge University Press. This book was released on 2019-08-15 with total page 257 pages. Available in PDF, EPUB and Kindle. Book excerpt: Do you want to deepen your understanding of complex systems and design integrated circuits more quickly? Learn how with this step-by-step guide that shows, from first principles, how to employ estimation techniques to analyze and solve complex problems in IC design using a simplified modeling approach. Applications are richly illustrated using real-world examples from across IC design, from simple circuit theory, to the electromagnetic effects and high frequency design, and systems such as data converters and phase-locked loops. Basic concepts like inductance and capacitance are related to one other and other RF phenomena inside a modern chip, enhancing understanding without the need for simulators. Use the easy-to-follow models presented to start designing your own products, from inductors and amplifiers to more complex systems. Whether you are an early-career professional or researcher, graduate student, or established IC engineer looking to reduce your reliance on commercial software packages, this is essential reading.
Author :
Publisher :
ISBN 13 :
Total Pages : 1796 pages
Book Rating : 4.:/5 (31 download)
Download or read book Proceedings written by and published by . This book was released on 2000 with total page 1796 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Yash Agrawal
Publisher : Springer Nature
ISBN 13 : 9819944767
Total Pages : 286 pages
Book Rating : 4.8/5 (199 download)
Download or read book Interconnect Technologies for Integrated Circuits and Flexible Electronics written by Yash Agrawal and published by Springer Nature. This book was released on 2023-10-17 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.
Author : Thomas Noulis
Publisher : CRC Press
ISBN 13 : 1351642782
Total Pages : 555 pages
Book Rating : 4.3/5 (516 download)
Download or read book Noise Coupling in System-on-Chip written by Thomas Noulis and published by CRC Press. This book was released on 2018-01-09 with total page 555 pages. Available in PDF, EPUB and Kindle. Book excerpt: Noise Coupling is the root-cause of the majority of Systems on Chip (SoC) product fails. The book discusses a breakthrough substrate coupling analysis flow and modelling toolset, addressing the needs of the design community. The flow provides capability to analyze noise components, propagating through the substrate, the parasitic interconnects and the package. Using this book, the reader can analyze and avoid complex noise coupling that degrades RF and mixed signal design performance, while reducing the need for conservative design practices. With chapters written by leading international experts in the field, novel methodologies are provided to identify noise coupling in silicon. It additionally features case studies that can be found in any modern CMOS SoC product for mobile communications, automotive applications and readout front ends.
Author : Artur Balasinski
Publisher : CRC Press
ISBN 13 : 1439817154
Total Pages : 249 pages
Book Rating : 4.4/5 (398 download)
Download or read book Semiconductors written by Artur Balasinski and published by CRC Press. This book was released on 2018-09-03 with total page 249 pages. Available in PDF, EPUB and Kindle. Book excerpt: Because of the continuous evolution of integrated circuit manufacturing (ICM) and design for manufacturability (DfM), most books on the subject are obsolete before they even go to press. That’s why the field requires a reference that takes the focus off of numbers and concentrates more on larger economic concepts than on technical details. Semiconductors: Integrated Circuit Design for Manufacturability covers the gradual evolution of integrated circuit design (ICD) as a basis to propose strategies for improving return-on-investment (ROI) for ICD in manufacturing. Where most books put the spotlight on detailed engineering enhancements and their implications for device functionality, in contrast, this one offers, among other things, crucial, valuable historical background and roadmapping, all illustrated with examples. Presents actual test cases that illustrate product challenges, examine possible solution strategies, and demonstrate how to select and implement the right one This book shows that DfM is a powerful generic engineering concept with potential extending beyond its usual application in automated layout enhancements centered on proximity correction and pattern density. This material explores the concept of ICD for production by breaking down its major steps: product definition, design, layout, and manufacturing. Averting extended discussion of technology, techniques, or specific device dimensions, the author also avoids the clumsy chapter architecture that can hinder other books on this subject. The result is an extremely functional, systematic presentation that simplifies existing approaches to DfM, outlining a clear set of criteria to help readers assess reliability, functionality, and yield. With careful consideration of the economic and technical trade-offs involved in ICD for manufacturing, this reference addresses techniques for physical, electrical, and logical design, keeping coverage fresh and concise for the designers, manufacturers, and researchers defining product architecture and research programs.
Author : Ambika Prasad Shah
Publisher : Springer Nature
ISBN 13 : 3031215141
Total Pages : 607 pages
Book Rating : 4.0/5 (312 download)
Download or read book VLSI Design and Test written by Ambika Prasad Shah and published by Springer Nature. This book was released on 2022-12-16 with total page 607 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the proceedings of the 26th International Symposium on VLSI Design and Test, VDAT 2022, which took place in Jammu, India, in July 2022. The 32 regular papers and 16 short papers presented in this volume were carefully reviewed and selected from 220 submissions. They were organized in topical sections as follows: Devices and Technology; Sensors; Analog/Mixed Signal; Digital Design; Emerging Technologies and Memory; System Design.
