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Electrochemical Processing In Ulsi Fabrication And Semiconductor Metal Deposition
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Book Synopsis Electrochemical Processing in ULSI Fabrication and Semiconductor/metal Deposition II by : Panayotis C. Andricacos
Download or read book Electrochemical Processing in ULSI Fabrication and Semiconductor/metal Deposition II written by Panayotis C. Andricacos and published by The Electrochemical Society. This book was released on 1999 with total page 418 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Electrochemical Processing in ULSI Fabrication and Semiconductor/metal Deposition by :
Download or read book Electrochemical Processing in ULSI Fabrication and Semiconductor/metal Deposition written by and published by . This book was released on 1999 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Proceedings of the Symposia on Electrochemical Processing in ULSI Fabrication I by : Electrochemical Society. Dielectric Science and Technology Division
Download or read book Proceedings of the Symposia on Electrochemical Processing in ULSI Fabrication I written by Electrochemical Society. Dielectric Science and Technology Division and published by . This book was released on 1999 with total page 290 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Electrochemical Processing in ULSI Fabrication III by : Panayotis C. Andricacos
Download or read book Electrochemical Processing in ULSI Fabrication III written by Panayotis C. Andricacos and published by The Electrochemical Society. This book was released on 2002 with total page 262 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Held May 2000 in Toronto, Canada, as part of the 197th meeting of the Electrochemical Society."--Pref.
Book Synopsis Morphological Evolution of Electrodeposits and Electrochemical Processing in ULSI Fabrication and Electrodeposition of and on Semiconductors IV by : Kazuo Kondo
Download or read book Morphological Evolution of Electrodeposits and Electrochemical Processing in ULSI Fabrication and Electrodeposition of and on Semiconductors IV written by Kazuo Kondo and published by The Electrochemical Society. This book was released on 2005 with total page 422 pages. Available in PDF, EPUB and Kindle. Book excerpt: Papers in this volume are from the 199th ECS Meeting, held in Washington, DC, Spring 2001. Morphology evolution encompasses electrochemical processing in ULSI fabrication, shape evolution, growth habit, and microstructure of electrodeposits. The most prominent example at present is the electrochemical deposition of copper for ULSI interconnects. Many other electrochemical processes at various stages of emergence and development hold promise for the electronics industry and beyond.
Book Synopsis Electrochemical Processing in ULSI and MEMS 3 by : John O. Dukovic
Download or read book Electrochemical Processing in ULSI and MEMS 3 written by John O. Dukovic and published by The Electrochemical Society. This book was released on 2007-09 with total page 288 pages. Available in PDF, EPUB and Kindle. Book excerpt: The papers in this issue describe the latest advances in fundamental and practical aspects of electrochemical processes for fabrication of microelectronic devices and related structures. Topics range from plating to etching, chips to packages, mechanisms to models, through-silicon vias to nanotubes, tin to ruthenium, capping to cooling, porous gold to porous alumina, probe-card springs to solder balls, electroless deposition to CMP, TFT-LCDs to magnetic nanowires and beyond.
Book Synopsis Fundamental Aspects of Electrochemical Deposition and Dissolution by : M. Matlosz
Download or read book Fundamental Aspects of Electrochemical Deposition and Dissolution written by M. Matlosz and published by The Electrochemical Society. This book was released on 2000 with total page 456 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Electrochemical Surface Modification by : Richard C. Alkire
Download or read book Electrochemical Surface Modification written by Richard C. Alkire and published by John Wiley & Sons. This book was released on 2008-11-21 with total page 360 pages. Available in PDF, EPUB and Kindle. Book excerpt: In this topical volume, the authors provide in-depth coverage of the vital relationship between electrochemistry and the morphology of thin films and surfaces. Clearly divided into four major sections, the book covers nanoscale dielectric films for electronic devices, superconformal film growth, electrocatalytic properties of transition metal macrocycles, and the use of synchrotron techniques in electrochemistry. All the chapters offer a concise introduction to the relevant topic, as well as supplying numerous references for easy access to further reading and the original literature. The result is must-have reading for electrochemists, physical and surface chemists and physicists, as well as materials scientists and engineers active in the field of spectroscopic methods in electrochemistry.
Book Synopsis Electrochemical Processes in ULSI and MEMS by : Hariklia Deligianni
Download or read book Electrochemical Processes in ULSI and MEMS written by Hariklia Deligianni and published by The Electrochemical Society. This book was released on 2005 with total page 494 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Electrochemical Engineering by : Richard C. Alkire
Download or read book Electrochemical Engineering written by Richard C. Alkire and published by John Wiley & Sons. This book was released on 2018-08-24 with total page 344 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume in the "Advances in Electrochemical Sciences and Engineering" series focuses on problem-solving, illustrating how to translate basic science into engineering solutions. The book's concept is to bring together engineering solutions across the range of nano-bio-photo-micro applications, with each chapter co-authored by an academic and an industrial expert whose collaboration led to reusable methods that are relevant beyond their initial use. Examples of experimental and/or computational methods are used throughout to facilitate the task of moving atomistic-scale discoveries and understanding toward well-engineered products and processes based on electrochemical phenomena.
Book Synopsis Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications by : Yosi Shacham-Diamand
Download or read book Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications written by Yosi Shacham-Diamand and published by Springer Science & Business Media. This book was released on 2009-09-19 with total page 545 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.
Book Synopsis Encyclopedia of Chemical Processing by : Sunggyu Lee
Download or read book Encyclopedia of Chemical Processing written by Sunggyu Lee and published by Taylor & Francis US. This book was released on 2006 with total page 768 pages. Available in PDF, EPUB and Kindle. Book excerpt: Supplying nearly 350 expertly-written articles on technologies that can maximize and enhance the research and production phases of current and emerging chemical manufacturing practices and techniques, this second edition provides gold standard articles on the methods, practices, products, and standards recently influencing the chemical industries. New material includes: design of key unit operations involved with chemical processes; design, unit operation, and integration of reactors and separation systems; process system peripherals such as pumps, valves, and controllers; analytical techniques and equipment; current industry practices; and pilot plant design and scale-up criteria.
Book Synopsis Encyclopedia of Chemical Processing (Online) by : Sunggyu Lee
Download or read book Encyclopedia of Chemical Processing (Online) written by Sunggyu Lee and published by CRC Press. This book was released on 2005-11-01 with total page 3338 pages. Available in PDF, EPUB and Kindle. Book excerpt: This second edition Encyclopedia supplies nearly 350 gold standard articles on the methods, practices, products, and standards influencing the chemical industries. It offers expertly written articles on technologies at the forefront of the field to maximize and enhance the research and production phases of current and emerging chemical manufacturing practices and techniques. This collecting of information is of vital interest to chemical, polymer, electrical, mechanical, and civil engineers, as well as chemists and chemical researchers. A complete reconceptualization of the classic reference series the Encyclopedia of Chemical Processing and Design, whose first volume published in 1976, this resource offers extensive A-Z treatment of the subject in five simultaneously published volumes, with comprehensive indexing of all five volumes in the back matter of each tome. It includes material on the design of key unit operations involved with chemical processes; the design, unit operation, and integration of reactors and separation systems; process system peripherals such as pumps, valves, and controllers; analytical techniques and equipment; and pilot plant design and scale-up criteria. This reference contains well-researched sections on automation, equipment, design and simulation, reliability and maintenance, separations technologies, and energy and environmental issues. Authoritative contributions cover chemical processing equipment, engineered systems, and laboratory apparatus currently utilized in the field. It also presents expert overviews on key engineering science topics in property predictions, measurements and analysis, novel materials and devices, and emerging chemical fields. ALSO AVAILABLE ONLINE This Taylor & Francis encyclopedia is also available through online subscription, offering a variety of extra benefits for both researchers, students, and librarians, including: Citation tracking and alerts Active reference linking Saved searches and marked lists HTML and PDF format options Contact Taylor and Francis for more information or to inquire about subscription options and print/online combination packages. US: (Tel) 1.888.318.2367; (E-mail) [email protected] International: (Tel) +44 (0) 20 7017 6062; (E-mail) [email protected]
Book Synopsis Copper Electrodeposition for Nanofabrication of Electronics Devices by : Kazuo Kondo
Download or read book Copper Electrodeposition for Nanofabrication of Electronics Devices written by Kazuo Kondo and published by Springer Science & Business Media. This book was released on 2013-11-20 with total page 280 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon copper nanowiring • Printed circuit boards • Stacked semiconductors • Through Silicon Via • Smooth copper foil for Lithium-Ion battery electrodes. This book is ideal for nanotechnologists, industry professionals, and practitioners.
Book Synopsis Semiconductor Technology (ISTC 2001) by : Ming Yang
Download or read book Semiconductor Technology (ISTC 2001) written by Ming Yang and published by . This book was released on 2001 with total page 664 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Handbook of Silicon Wafer Cleaning Technology by : Karen Reinhardt
Download or read book Handbook of Silicon Wafer Cleaning Technology written by Karen Reinhardt and published by William Andrew. This book was released on 2018-03-16 with total page 760 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Silicon Wafer Cleaning Technology, Third Edition, provides an in-depth discussion of cleaning, etching and surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet and plasma processing are reviewed, including surface and colloidal aspects. This revised edition includes the developments of the last ten years to accommodate a continually involving industry, addressing new technologies and materials, such as germanium and III-V compound semiconductors, and reviewing the various techniques and methods for cleaning and surface conditioning. Chapters include numerous examples of cleaning technique and their results. The book helps the reader understand the process they are using for their cleaning application and why the selected process works. For example, discussion of the mechanism and physics of contamination, metal, particle and organic includes information on particle removal, metal passivation, hydrogen-terminated silicon and other processes that engineers experience in their working environment. In addition, the handbook assists the reader in understanding analytical methods for evaluating contamination. The book is arranged in an order that segments the various cleaning techniques, aqueous and dry processing. Sections include theory, chemistry and physics first, then go into detail for the various methods of cleaning, specifically particle removal and metal removal, amongst others. Focuses on cleaning techniques including wet, plasma and other surface conditioning techniques used to manufacture integrated circuits Reliable reference for anyone that manufactures integrated circuits or supplies the semiconductor and microelectronics industries Covers processes and equipment, as well as new materials and changes required for the surface conditioning process
Book Synopsis Nanostructured Materials by : Heinrich Hofmann
Download or read book Nanostructured Materials written by Heinrich Hofmann and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 203 pages. Available in PDF, EPUB and Kindle. Book excerpt: The articles in this book summarize the work presented at the mid-term workshop of the COST (European Cooperation in the Fields of Scientific and Technical Research) action on Nanostructured Materials, which was held in October 2001 in Limerick, Ireland. The collection gives an excellent overview of the state-of-the-art, topical research areas in this field, and the progress made by the coordinated research projects. The articles cover synthesis, physical properties and characterization of nanostructured materials, such as magnetic and ferroelectric nanoparticles, nanoparticles in biological systems, metallic nanoparticles, nanocomposites, particle-reinforced polymers, semiconductor nanoparticles and thin films.
