Ectc 2016

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3D Microelectronic Packaging

Author : Yan Li
Publisher : Springer Nature
ISBN 13 : 9811570906
Total Pages : 629 pages
Book Rating : 4.8/5 (115 download)

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Book Synopsis 3D Microelectronic Packaging by : Yan Li

Download or read book 3D Microelectronic Packaging written by Yan Li and published by Springer Nature. This book was released on 2020-11-23 with total page 629 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.

Chiplet Design and Heterogeneous Integration Packaging

Author : John H. Lau
Publisher : Springer Nature
ISBN 13 : 9811999171
Total Pages : 542 pages
Book Rating : 4.8/5 (119 download)

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Book Synopsis Chiplet Design and Heterogeneous Integration Packaging by : John H. Lau

Download or read book Chiplet Design and Heterogeneous Integration Packaging written by John H. Lau and published by Springer Nature. This book was released on 2023-03-27 with total page 542 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Intermetallic Compounds

Author : Mahmood Aliofkhazraei
Publisher : BoD – Books on Demand
ISBN 13 : 1789231787
Total Pages : 228 pages
Book Rating : 4.7/5 (892 download)

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Book Synopsis Intermetallic Compounds by : Mahmood Aliofkhazraei

Download or read book Intermetallic Compounds written by Mahmood Aliofkhazraei and published by BoD – Books on Demand. This book was released on 2018-05-30 with total page 228 pages. Available in PDF, EPUB and Kindle. Book excerpt: Intermetallic compounds are usually brittle with high melting points. Their properties are often found among ceramic and metallic materials. In most cases, their hot corrosion resistance and simultaneously hardness are important. One of the main applications of intermetallic compounds is for superalloy turbine blades in which they show appropriate high-temperature-related properties. This book collects new developments about intermetallic compounds and their recent usages.

Assembly and Reliability of Lead-Free Solder Joints

Author : John H. Lau
Publisher : Springer Nature
ISBN 13 : 9811539200
Total Pages : 545 pages
Book Rating : 4.8/5 (115 download)

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Book Synopsis Assembly and Reliability of Lead-Free Solder Joints by : John H. Lau

Download or read book Assembly and Reliability of Lead-Free Solder Joints written by John H. Lau and published by Springer Nature. This book was released on 2020-05-29 with total page 545 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.

Fan-Out Wafer-Level Packaging

Author : John H. Lau
Publisher : Springer
ISBN 13 : 9811088845
Total Pages : 319 pages
Book Rating : 4.8/5 (11 download)

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Book Synopsis Fan-Out Wafer-Level Packaging by : John H. Lau

Download or read book Fan-Out Wafer-Level Packaging written by John H. Lau and published by Springer. This book was released on 2018-04-05 with total page 319 pages. Available in PDF, EPUB and Kindle. Book excerpt: This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP – such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. – are not well understood. Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.

More-than-Moore 2.5D and 3D SiP Integration

Author : Riko Radojcic
Publisher : Springer
ISBN 13 : 3319525484
Total Pages : 192 pages
Book Rating : 4.3/5 (195 download)

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Book Synopsis More-than-Moore 2.5D and 3D SiP Integration by : Riko Radojcic

Download or read book More-than-Moore 2.5D and 3D SiP Integration written by Riko Radojcic and published by Springer. This book was released on 2017-02-08 with total page 192 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore’s Law track, and leveraging some of the More-than-Moore technology options for their next microelectronic product.

Handbook of Thin Film Deposition

Author : Krishna Seshan
Publisher : William Andrew
ISBN 13 : 0128123125
Total Pages : 472 pages
Book Rating : 4.1/5 (281 download)

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Book Synopsis Handbook of Thin Film Deposition by : Krishna Seshan

Download or read book Handbook of Thin Film Deposition written by Krishna Seshan and published by William Andrew. This book was released on 2018-02-23 with total page 472 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Thin Film Deposition, Fourth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, materials for memory applications and methods for thin film optical processes. The book is broken up into three sections: scaling, equipment and processing, and applications. In this newly revised edition, the handbook will also explore the limits of thin film applications, most notably as they relate to applications in manufacturing, materials, design and reliability. - Offers a practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance, applications and the limitations faced by those processes - Covers core processes and applications in the semiconductor industry and new developments within the photovoltaic and optical thin film industries - Features a new chapter discussing Gates Dielectrics

Semiconductor Advanced Packaging

Author : John H. Lau
Publisher : Springer Nature
ISBN 13 : 9811613761
Total Pages : 513 pages
Book Rating : 4.8/5 (116 download)

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Book Synopsis Semiconductor Advanced Packaging by : John H. Lau

Download or read book Semiconductor Advanced Packaging written by John H. Lau and published by Springer Nature. This book was released on 2021-05-17 with total page 513 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Advances in Embedded and Fan-Out Wafer Level Packaging Technologies

Author : Beth Keser
Publisher : John Wiley & Sons
ISBN 13 : 1119313988
Total Pages : 634 pages
Book Rating : 4.1/5 (193 download)

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Book Synopsis Advances in Embedded and Fan-Out Wafer Level Packaging Technologies by : Beth Keser

Download or read book Advances in Embedded and Fan-Out Wafer Level Packaging Technologies written by Beth Keser and published by John Wiley & Sons. This book was released on 2019-02-20 with total page 634 pages. Available in PDF, EPUB and Kindle. Book excerpt: Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.

The Rise of EU Police Cooperation

Author : Franca König
Publisher : Taylor & Francis
ISBN 13 : 1000818179
Total Pages : 312 pages
Book Rating : 4.0/5 (8 download)

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Book Synopsis The Rise of EU Police Cooperation by : Franca König

Download or read book The Rise of EU Police Cooperation written by Franca König and published by Taylor & Francis. This book was released on 2022-12-30 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides an in-depth empirical analysis and theoretical history of the institutional development of EU police cooperation, with a focus on the creation and integration of Europol. Presenting a thoroughly comprehensive analysis, the book systematically traces integration dynamics and the evolution of EU police cooperation over a 40-year period, assessing the influence of cross-country interdependencies, politicisation and policy entrepreneurship on Member States’ behaviour and institutional choice. By combining a wealth of sources including previously unpublished sources and personal insights from key decision-makers, it explores which driving factors shape processes of differentiation and integration in this sovereignty-sensitive policy domain, and how, and attempts to explain state preferences on international police cooperation in the light of major theories of European integration. The book will be of key interest to students, scholars and practitioners working in or on the fields of police cooperation, Justice and Home Affairs policy, EU governance and security studies, both at national and European level.

TSV 3D RF Integration

Author : Shenglin Ma
Publisher : Elsevier
ISBN 13 : 0323996035
Total Pages : 294 pages
Book Rating : 4.3/5 (239 download)

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Book Synopsis TSV 3D RF Integration by : Shenglin Ma

Download or read book TSV 3D RF Integration written by Shenglin Ma and published by Elsevier. This book was released on 2022-04-27 with total page 294 pages. Available in PDF, EPUB and Kindle. Book excerpt: TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters. A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology. - Provides a detailed demonstration of the design and process development of HR-Si (High-Resistivity Silicon) interposer technology - Presents a series of implementation case studies that detail modeling and simulation, integration, qualification and testing methods - Offers a systematic and comparative literature review of HR-Si interposer technology by topic - Offers solutions to problems with TSV (through silicon via) interposer technology, including high frequency loss and cooling problems - Gives a systematic and accessible accounting on this leading technology

EU Criminal Policy: Advances and Challenges

Author : Gert Vermeulen
Publisher : Maklu
ISBN 13 : 9046611345
Total Pages : 189 pages
Book Rating : 4.0/5 (466 download)

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Book Synopsis EU Criminal Policy: Advances and Challenges by : Gert Vermeulen

Download or read book EU Criminal Policy: Advances and Challenges written by Gert Vermeulen and published by Maklu. This book was released on 2022-11-01 with total page 189 pages. Available in PDF, EPUB and Kindle. Book excerpt: Until the end of the 1990s, EU integration in the area of criminal law centred primarily around the regional deepening of traditional judicial cooperation in criminal matters and the development of law enforcement cooperation (including the setting up of Europol as a support agency). By the end of the 1990s respectively 2000s, the EU also gained (limited) supranational competence in the areas of substantive respectively procedural criminal law. Both judicial and law enforcement cooperation were furthered over the years via the principles of mutual recognition respectively availability, and through the setting up (and development) of Eurojust, the establishment of a European Public Prosecutor’s Office and the further development of Europol. After three decennia, the EU criminal law corpus is impressive – a core component of the EU’s ‘Area of Freedom, Security and Justice’, building on and adding to (both real and presumed) trust between the Member States. No time for stand-still, though. Since 2020, the European Commission has launched a tsunami of new legislative proposals, including in the sphere of EU criminal law, strongly framed in its new EU Security Union Strategy. This special issue on ‘EU criminal policy. Advances and challenges’ discusses and assesses some of the newest developments, both in an overarching fashion and in focused papers, relating to key 2022 novelties for Europol (ie the competence to conduct AI-based pre-analysis in (big) data sets, and extended cooperation with private parties), the sensitive debate since 2020 on criminalising (LGBTIQ) hate speech and hate crime at EU level, the 2022 Cybersecurity Directive, the potential of the 2020 Conditionality Regulation to address rule of law issues undermining the trustworthiness of Member States when issuing European Arrest Warrants, and concerns about free speech limitation by the 2021 Terrorist Content Online Regulation.

Artificial Intelligence and Security

Author : Xingming Sun
Publisher : Springer
ISBN 13 : 3030242714
Total Pages : 671 pages
Book Rating : 4.0/5 (32 download)

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Book Synopsis Artificial Intelligence and Security by : Xingming Sun

Download or read book Artificial Intelligence and Security written by Xingming Sun and published by Springer. This book was released on 2019-07-18 with total page 671 pages. Available in PDF, EPUB and Kindle. Book excerpt: The 4-volume set LNCS 11632 until LNCS 11635 constitutes the refereed proceedings of the 5th International Conference on Artificial Intelligence and Security, ICAIS 2019, which was held in New York, USA, in July 2019. The conference was formerly called “International Conference on Cloud Computing and Security” with the acronym ICCCS. The total of 230 full papers presented in this 4-volume proceedings was carefully reviewed and selected from 1529 submissions. The papers were organized in topical sections as follows: Part I: cloud computing; Part II: artificial intelligence; big data; and cloud computing and security; Part III: cloud computing and security; information hiding; IoT security; multimedia forensics; and encryption and cybersecurity; Part IV: encryption and cybersecurity.

ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis

Author : ASM International
Publisher : ASM International
ISBN 13 : 1627080996
Total Pages : 593 pages
Book Rating : 4.6/5 (27 download)

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Book Synopsis ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis by : ASM International

Download or read book ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis written by ASM International and published by ASM International. This book was released on 2018-12-01 with total page 593 pages. Available in PDF, EPUB and Kindle. Book excerpt: The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.

Wireless Sensor Networks

Author : S. R. Vijayalakshmi
Publisher : Stylus Publishing, LLC
ISBN 13 : 1683922263
Total Pages : 413 pages
Book Rating : 4.6/5 (839 download)

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Book Synopsis Wireless Sensor Networks by : S. R. Vijayalakshmi

Download or read book Wireless Sensor Networks written by S. R. Vijayalakshmi and published by Stylus Publishing, LLC. This book was released on 2018-04-25 with total page 413 pages. Available in PDF, EPUB and Kindle. Book excerpt: Wireless Sensor Networks is an essential guide for anyone interested in wireless communications for sensor networks, home networking, or device hacking. It covers a large number of topics encountered in the architecture, application, and recent advancements of a wireless sensor network, including hardware and software architectures, the Internet of Things, routing and security, MANETs, MEMS, Zigbee, TDMA, securing networks for WiFi, ubiquitous sensor networks, underwater, mobile, and multimedia wireless networks. Features: • Includes a wide range of applications to industry, science, transportation, civil infrastructure, and security • Covers the Internet of Things (IoT), MEMS, Zigbee, TDMA, mobile wireless networks, and more • Features article on securing networks for WiFi by the United States Department of Homeland Security (DHS) Cybersecurity Engineering

3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

Author : Lih-Tyng Hwang
Publisher : John Wiley & Sons
ISBN 13 : 1119289661
Total Pages : 602 pages
Book Rating : 4.1/5 (192 download)

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Book Synopsis 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility by : Lih-Tyng Hwang

Download or read book 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility written by Lih-Tyng Hwang and published by John Wiley & Sons. This book was released on 2018-03-29 with total page 602 pages. Available in PDF, EPUB and Kindle. Book excerpt: An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail Provides chapter-wise review questions and powerpoint slides as teaching tools

Heterogeneous Integrations

Author : John H. Lau
Publisher : Springer
ISBN 13 : 9811372241
Total Pages : 381 pages
Book Rating : 4.8/5 (113 download)

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Book Synopsis Heterogeneous Integrations by : John H. Lau

Download or read book Heterogeneous Integrations written by John H. Lau and published by Springer. This book was released on 2019-04-03 with total page 381 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.