Development Of Wideband Millimeter Wave Receiver Front End Modules Components And Packaging On Multilayer Organic Substrates

Download Development Of Wideband Millimeter Wave Receiver Front End Modules Components And Packaging On Multilayer Organic Substrates full books in PDF, epub, and Kindle. Read online Development Of Wideband Millimeter Wave Receiver Front End Modules Components And Packaging On Multilayer Organic Substrates ebook anywhere anytime directly on your device. Fast Download speed and no annoying ads. We cannot guarantee that every ebooks is available!

Development of Wideband Millimeter Wave Receiver Front-end Modules, Components and Packaging on Multilayer Organic Substrates

Author : Manish Auro Mamidanna
Publisher :
ISBN 13 : 9780355969283
Total Pages : pages
Book Rating : 4.9/5 (692 download)

DOWNLOAD NOW!

Book Synopsis Development of Wideband Millimeter Wave Receiver Front-end Modules, Components and Packaging on Multilayer Organic Substrates by : Manish Auro Mamidanna

Download or read book Development of Wideband Millimeter Wave Receiver Front-end Modules, Components and Packaging on Multilayer Organic Substrates written by Manish Auro Mamidanna and published by . This book was released on 2018 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The current and rising number of applications in the millimeter wave frequency bands has facilitated the use of new materials, interconnect, and electromagnetic modal transitions for traditional heterodyne receiver front ends. In terms of materials, LCP has emerged as a highly suitable material for applications requiring near-hermetic packaging. LCP’s light weight, low cost, flexibility, and low fabrication tolerances make it a pragmatic choice for integrated systems. In addition, its electrical performance features low loss, and stability of material properties up to high frequencies (DC – 170 GHz), and over wide range of environmental conditions. The work in this research proposal presents millimeter wave heterodyne front ends with electromagnetic transitions for both satellite communications, and Tokamak plasma imaging applications.In addition to presenting work in LCP, this work also introduces new diplexing structures for wideband, millimeter wave frequency extension applications of high sensitivity measurement instrumentation. The diplexing structures are incorporated into existing 1 mm coaxial-waveguide modal transitions, to achieve front-end instrumentation extension from 50 GHz up to 110 GHz. By combining both coaxial and waveguide filtering structures, low loss, good isolation, compactness, and high measurement system sensitivity can be achieved. Future work will focus on theoretical analysis, and optimization of the complex coaxial-waveguide diplexer junction problem, and offer novel insight into the operation and continued design of such devices for any front-end application.

Three-dimensional Integration and Modeling

Author : Jong-Hoon Lee
Publisher : Morgan & Claypool Publishers
ISBN 13 : 1598292447
Total Pages : 114 pages
Book Rating : 4.5/5 (982 download)

DOWNLOAD NOW!

Book Synopsis Three-dimensional Integration and Modeling by : Jong-Hoon Lee

Download or read book Three-dimensional Integration and Modeling written by Jong-Hoon Lee and published by Morgan & Claypool Publishers. This book was released on 2008 with total page 114 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules.

Modern Receiver Front-Ends

Author : Joy Laskar
Publisher : John Wiley & Sons
ISBN 13 : 047147486X
Total Pages : 240 pages
Book Rating : 4.4/5 (714 download)

DOWNLOAD NOW!

Book Synopsis Modern Receiver Front-Ends by : Joy Laskar

Download or read book Modern Receiver Front-Ends written by Joy Laskar and published by John Wiley & Sons. This book was released on 2004-04-09 with total page 240 pages. Available in PDF, EPUB and Kindle. Book excerpt: Architectures BABAK MATINPOUR and JOY LASKAR * Describes the actual implementation of receiver architectures from the initial design to an IC-based product * Presents many tricks-of-the-trade not usually covered in textbooks * Covers a range of practical issues including semiconductor technology selection, cost versus performance, yield, packaging, prototype development, testing, and analysis * Discusses architectures that are employed in modern broadband wireless systems

Multi-Chip Module (MCM) Design for Millimeter-wave Applications

Author : Ghulam Mehdi
Publisher :
ISBN 13 : 9781726601672
Total Pages : 123 pages
Book Rating : 4.6/5 (16 download)

DOWNLOAD NOW!

Book Synopsis Multi-Chip Module (MCM) Design for Millimeter-wave Applications by : Ghulam Mehdi

Download or read book Multi-Chip Module (MCM) Design for Millimeter-wave Applications written by Ghulam Mehdi and published by . This book was released on 2018-10 with total page 123 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the advancement in the era of monolithic microwave integrated circuits (MMIC) technology, the trend for realization of radio systems is shifting towards millimeter-wave (mmW) frequencies. The obvious advantages at mmW bands are higher bandwidth, fine spatial resolution and producibility of miniaturized radio systems with high level integration. The wide spectrum of applications at mmW frequencies encompasses various applications such as satellite communication, radar systems, remote sensing, communication data links etc. The MMIC technology enables the fabrication of miniaturized, low-cost, high-performance and highly reliable mmW radio systems. However, due to the scale downsizing of the circuits proportional to the wavelength, the design of mmW multi-chips module (MCM) is challenging. One of the emerging applications in mmW bands is passive imager for security screening purposes. Such imagers are deployed for detection of the concealed hazardous objects on human body and contraband items. The 2-D synthetic aperture interferometric technique is being extensively employed in passive imaging systems due to its distinct features such as larger field of view (FOV) and high imaging rate. In the first part of this book, design and development of Ka-band MCM receivers at 34 GHz is presented. The receiver employs single-stage heterodyne architecture at 2 GHz intermediate frequency (IF). The complete MCM is realized on a single substrate except for the IF and power distribution section. This facilitates seamless integration, ease of manufacturing and results in a cost effective solution for mass production of such receivers. Further, a two-layer planar technology is adopted for compact realization. Experimental results of the front-end module fabricated with laser structuring are presented as well. Presence of Foreign object debris (FOD) at airport runways is an immense threat to flight safety. Such objects may cause potential damage to the aircraft especially during the critical phases like take off and landing. In the second part of the book, a capability demonstration model for a Ka-band FOD detection sensor employing multi-layer system-on-substrate (SoS) approach is presented. The concept of multi-layer system-on-substrate is introduced. The frequency modulated continuous-wave (FMCW) front-end transceiver and the integrated transmit and receive antennas are realized in multi-layer configuration. The front-end transceiver is mainly designed employing substrate integrated waveguide (SIW) circuits on low-cost 12 mil thick R4003C substrate. The front-end transceiver comprises of MMICs and passive structures such as SIW band-pass filters, SIW Wilkinson power divider and SIW-to-microstrip transitions. In order to couple two SIW substrate layers with different thicknesses, a coaxial bead is introduced for low-loss coupling between the two channels. Further, the design of a planar travelling-wave type slot array antenna in SIW technology is presented. Unlike conventional coaxial matched loads used in one of the reported SIW traveling-wave linear slot array, a resistive match is introduced for termination of such antenna in SIW technology. A virtually grounded thin film resistor (TFR) is employed for array termination. An 8x8 array is designed with antenna feed network. Two-layer topology is adopted for compact realization and this mitigates the unwanted radiations from the feed network. The whole integrated antenna is simulated in Ansoft HFSS®. The proposed approach considerably reduces the cost and weight of the antenna while the conformability of the antenna is retained as well. The antenna can be integrated with rest of the planar hardware of a millimeter-wave system. The proposed antenna can be used for a variety of mmW broadband commercial applications. The simulation results of the proposed antenna and front-end components are presented.

Compact RF/microwave Passive Components and Modules on Multilayer Organic Substrates

Author : Hai Hoang Ta
Publisher :
ISBN 13 : 9781267969842
Total Pages : pages
Book Rating : 4.9/5 (698 download)

DOWNLOAD NOW!

Book Synopsis Compact RF/microwave Passive Components and Modules on Multilayer Organic Substrates by : Hai Hoang Ta

Download or read book Compact RF/microwave Passive Components and Modules on Multilayer Organic Substrates written by Hai Hoang Ta and published by . This book was released on 2012 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: In this Ph.D. research, we demonstrate the developments of microwave integrated passive components and modules on multilayer Liquid Crystal Polymer (LCP) substrates. The main focus is to achieve compact-size and wide-bandwidth passive components and modules by taking advantages of thin-film, multilayer LCP organic substrates. Slow-wave structures such as defected ground structures (DGS) and composite right/left-handed (CRLH) transmission lines are incorporated into the designs to further reduce the size and improve the bandwidth of the components and modules. The design and development of a hybrid coupler and a balun on multilayer LCP substrates are presented. The hybrid coupler is folded on a thin-film multilayer LCP substrate to reduce the size up to 42% compared to the conventional design. This coupler achieves a wide bandwidth from 2 - 18 GHz and has a compact size of 6.3 mm x 14.4 mm. The balun is based on broadside-coupled Marchand topology. The bandwidth of the balun is extended by using DGS. Experimental results show that the balun achieves the bandwidth from 2 - 20 GHz and has a compact size of 4.4 mm x 5.6 mm. The concept of CRLH transmission lines are applied to design and develop super compact Wilkinson power dividers (WPD). The two WPDs that are based on novel CRLH transmission line structures are presented. Both of them are implemented on thin-film multilayer LCP substrates. These two power dividers achieve size reduction of 90% and 97% compared to conventional microstrip designs. Bandpass filters that have compact sizes and wide stopbands are also presented. Two bandpass fitlers are designed based on direct-coupled topology with series resonators and impedance inverters. The resonators are quasi-lumped LC structures that are implemented on multilayer LCP substrates. One filter has a center frequency at 960 MHz, an out-of-band rejection of better than 30 dB up to 5 times the center frequency and a compact size of 5.4 mm x 27 mm. Another filter has dual bands at 1.7 GHz and 4 GHz. This filter has an out-of-band rejection of better than 50 dB up to 10 times the first center frequency and has a compact size of 9.8 mm x 70 mm. A push-pull LNA module and a 4-port power combiner/ filter/ power divider module are presented to demonstrate the benefits of LCP in module development. Both these modules are implemented on multilayer LCP substrates. The push-pull LNA module has a bandwidth from 4 - 18 GHz and provides better than 20 dB in the second harmonic suppression. The 4-port power combiner/filter/divider module has a pass band of 2 - 4 GHz and a very compact size of 0.22 [lambda subscript g] x 0.08 [lambda subscript g], where [lambda subscript g] is the guided wavelength at a center frequency of 3 GHz. Experimental results show that this 4-port module has good in-band and out-of-band performance.

Critical Mm-Wave Components for Synthetic Automatic Test Systems

Author : Michael Hrobak
Publisher :
ISBN 13 : 9783658097646
Total Pages : pages
Book Rating : 4.0/5 (976 download)

DOWNLOAD NOW!

Book Synopsis Critical Mm-Wave Components for Synthetic Automatic Test Systems by : Michael Hrobak

Download or read book Critical Mm-Wave Components for Synthetic Automatic Test Systems written by Michael Hrobak and published by . This book was released on 2015 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Michael Hrobak studied hybrid integrated front end modules for high frequency measurement equipment and especially for synthetic automatic test systems. Recent developments of innovative, critical millimeter-wave components like frequency multipliers, directional couplers, filters, triple balanced mixers and power detectors are illustrated by the author separately and in combination. Contents Synthetic Instruments Resistive Diode Frequency Multipliers Planar Directional Couplers and Filters Triple Balanced Mixers Zero Bias Schottky Power Detectors Integrated Front End Assemblies Target Groups Scientists and students in the field of electrical engineering with main emphasis on high frequency technology Engineers and Practitioners dealing with the development of micro- and millimeter-wave measurement instruments About the Author Dr. Michael Hrobak is with the Microwave Department of the Ferdinand-Braun-Institut (FBH), Berlin, Germany, where he is involved in the development and measurement of monolithic integrated circuits using indium phosphide (InP) double heterojunction bipolar transistors (DHBT). His research interests are in the field of planar realizations of linear and nonlinear broadband components, including directional couplers and filters, balanced mixers, frequency multipliers and power detectors.

Design and Analysis of Key Components for Manufacturable and Low-power CMOS Millimeter-wave Receiver Front End

Author : Shih-Chieh Hsin
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (844 download)

DOWNLOAD NOW!

Book Synopsis Design and Analysis of Key Components for Manufacturable and Low-power CMOS Millimeter-wave Receiver Front End by : Shih-Chieh Hsin

Download or read book Design and Analysis of Key Components for Manufacturable and Low-power CMOS Millimeter-wave Receiver Front End written by Shih-Chieh Hsin and published by . This book was released on 2012 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The objective of this dissertation is to develop key components of a CMOS heterodyne millimeter-wave receiver front end. Robust designs are necessary to overcome PVT variations as well as modeling inaccuracies, while with minimum power consumption overhead to facilitate low-power radio for portable applications. Heterodyne receiver topology is adopted because of its robust performances at millimeter-wave frequencies. Device models for both passive and active devices are developed and used in the circuit designs in this dissertation.\r : Two low-noise amplifiers (LNAs) are developed in this dissertation. The first LNA features a proposed temperature-compensation biasing technique, which confines the gain variation within 5 dB for temperature variation from -5 to 85 Celsius degree. The measured gain and NF are 21 and 6.5 dB, respectively, for 49-mW power dissipation. The second LNA reveals a design technique to tolerate a low-accuracy model at millimeter-wave frequencies. Both LNAs provide full coverage of the FCC 60-GHz band (57-64 GHz).\r : For the frequency generation circuits, both the IF QVCO and mm-wave VCO are investigated. The inherent bimodal oscillation of QVCOs is analyzed and, for the first time, a systematic measurement technique is proposed to intentionally control the oscillation mode. This technique is further utilized to extend the tuning range of the QVCO, which possesses dual tuning curves without penalty on phase noise. The measurement results of a 13-GHz QVCO in 90-nm CMOS reveals a 21.4% tuning range for continuously tuning from 11.7 to 14.5 GHz. The measured phase noise is -108 dBc/Hz at 1 MHz offset with a core power consumption of 10.8 mW. A millimeter-wave VCO is designed and fabricated in 65-nm CMOS. The VCO is fully characterized under voltage stress to examine the hot-carrier injection effects affecting the performance of a millimeter-wave VCO. The 41.6-47.4 GHz VCO is further integrated into a millimeter-wave down converter. The power-hungry buffer amplifiers are neglected by proper floor planning. Conversion loss of 1.4 dB is obtained with total power consumption of 72.5 mW.\r : Lastly, a power management system consisting of low-dropout (LDO) regulators is designed and integrated in a 90-nm CMOS millimeter-wave transceiver to provide stable and low-noise supply voltages. Voltage variation issues are alleviated by the LDOs.

Antenna-in-Package Technology and Applications

Author : Duixian Liu
Publisher : John Wiley & Sons
ISBN 13 : 1119556635
Total Pages : 416 pages
Book Rating : 4.1/5 (195 download)

DOWNLOAD NOW!

Book Synopsis Antenna-in-Package Technology and Applications by : Duixian Liu

Download or read book Antenna-in-Package Technology and Applications written by Duixian Liu and published by John Wiley & Sons. This book was released on 2020-03-31 with total page 416 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.

RF System-on-Package (SOP) Development for Compact Low Cost Wireless Front-end Systems

Author :
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (632 download)

DOWNLOAD NOW!

Book Synopsis RF System-on-Package (SOP) Development for Compact Low Cost Wireless Front-end Systems by :

Download or read book RF System-on-Package (SOP) Development for Compact Low Cost Wireless Front-end Systems written by and published by . This book was released on 2002 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: This paper presents the development of RF System-on-Package (SOP) architectures for compact and low cost wireless radio front -end systems. A novel 3D integration approach for SOP-based solutions for wireless communication applications is proposed and utilized for the implementation of a C band Wireless LAN (WLAN) RF front-end module by means of stacking LTCC substrates using mBGA technology. Results from the characterization and the modeling of RF vertical board -to-board transitions using mBGA process are presented for the first time. LTCC designs of high-performance multilayer embedded bandpass filters and novel stacked cavity-backed patch antennas are also reported. In addition, the fabrication of very high Q-factor inductors and embedded filter in organic substrates demonstrate the satisfactory performance of multilayer organic packages.

Development of Highly Integrated 3D Microwave - Millimeter Wave Radio Front-End System-on-Package (SOP).

Author :
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (632 download)

DOWNLOAD NOW!

Book Synopsis Development of Highly Integrated 3D Microwave - Millimeter Wave Radio Front-End System-on-Package (SOP). by :

Download or read book Development of Highly Integrated 3D Microwave - Millimeter Wave Radio Front-End System-on-Package (SOP). written by and published by . This book was released on 2001 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: We present the development, implementation and measurement of a 3D-deployed RF front-end System-on-Package (SOP) topology in a standard low-loss multi-layer ceramic (LTCC) technology. A compact 14 GHz GaAs MESFET-based satellite transmitter integrated with a low-loss embedded filter for outdoor units were built on a 400 × 310 × 35.2 mil 3 943AT tapes. The LTCC stripline filter exhibits a measured maximum insertion loss of 1.8 dB while the entire transmitter chain yields a 32-34 dB of gain in the 13.5 to 14.5 GHz range. These results suggest the feasibility of building highly SOP integrated microwave and millimeter wave radio front ends. In addition, a highly integrated transceiver module for OFDM Communication System using Multilayer Packaging technology as well as Multilayer Integrated Passives using Fully Organic SOP technology demonstrate the capabilities of SOP for other applications such as the OFDM Wireless LAN and LMDS.

Study of Some Key Components for Millimeter-wave Receiver Front-end Applications

Author :
Publisher :
ISBN 13 :
Total Pages : 256 pages
Book Rating : 4.:/5 (817 download)

DOWNLOAD NOW!

Book Synopsis Study of Some Key Components for Millimeter-wave Receiver Front-end Applications by :

Download or read book Study of Some Key Components for Millimeter-wave Receiver Front-end Applications written by and published by . This book was released on 2007 with total page 256 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Design and Characterization of Modules for Millimeter-wave Imaging Applications

Author : Rownak Shireen
Publisher :
ISBN 13 : 9781124479880
Total Pages : pages
Book Rating : 4.4/5 (798 download)

DOWNLOAD NOW!

Book Synopsis Design and Characterization of Modules for Millimeter-wave Imaging Applications by : Rownak Shireen

Download or read book Design and Characterization of Modules for Millimeter-wave Imaging Applications written by Rownak Shireen and published by . This book was released on 2011 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Interest in the millimeter-wave spectra is growing rapidly as numerous radio frequency (RF) applications are migrating to higher frequencies. In particular, imaging receivers are finding new applications that promise unique advantages and improved performance. However, the successful implementation of millimeter-wave frequencies depends on how researchers resolve the new set of challenges and constraints associated with these applications. To address some of these challenges, I present my work on the development of W-band modules for millimeter-wave detection at 95 GHz that opens the door for imaging applications in a simpler and cost-effective way. Accordingly, an unique approach used a broadband modulator to upconvert the W-band signals to the optical domain. This modulator must be packaged in such a way that it can be coupled to an antenna efficiently. In this regard, I present two different transitions from the modulator coplanar waveguide (CPW) to rectangular waveguide for the packaging. The first method is applicable to the vertical integration of a horn antenna. Full W-band operation was achieved using a slot coupled stacked patch antenna to excite the fundamental waveguide mode. The second model was designed for an in-line transition using a cosine shaped metallic fin to gradually lift and rotate the electric field of the CPW to match the field of the waveguide. These two transitions were developed to individually package the modulators. However, the key to successful integration of detector elements, especially in the case of large imaging arrays (~200 elements), is to use multi-chip module (MCM) integration. The MCM technique allows for the integration of multi-functional chips in a single package and thus it not only reduces the size and weight of a system but also brings down the packaging cost. A scheme for integrating the modulator with other imager circuit elements was developed using a ribbon bonding technique. This involved the proper choice of material for the chip carrier substrate and an investigation of the CPW and ribbon bonding parameters. Following this, a transition to the rectangular waveguide was introduced using a rectangular probe to couple the electric field from a microstrip to the waveguide. Metallic vias were used to synthetically reduce the electrical size of the substrate, which facilitated direct integration of the probe on a much wider chip substrate without exciting the unwanted modes. Further reduction of the volume can be achieved by using a distributed aperture technique, which provides a large effective aperture for high resolution images without the associated volumetric scaling. However, the bandwidth of such a system is limited by the maximum baseline of the aperture and field of view. Therefore, to reject the undesired signal and improve the image contrast, a bandpass filter was designed. A major part of this research work was carried out for waveguide-based packaging of lithium niobate (LiNbO3) modulators for direct connection to the horn antennas. However, when the operating frequency is above 100 GHz, the machining of the waveguides and horn antennas becomes expensive due to the high mechanical tolerance. Therefore, an alternate approach is demonstrated for direct integration of the modulator with a planar antenna. To obtain compatible gain patterns as the horn antenna, a silicon lens was incorporated onto the back surface of the substrate.

System and Circuit Design Techniques for Silicon-based Multi-band/multi-standard Receivers

Author : Mohamed A. El-Nozahi
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (747 download)

DOWNLOAD NOW!

Book Synopsis System and Circuit Design Techniques for Silicon-based Multi-band/multi-standard Receivers by : Mohamed A. El-Nozahi

Download or read book System and Circuit Design Techniques for Silicon-based Multi-band/multi-standard Receivers written by Mohamed A. El-Nozahi and published by . This book was released on 2011 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Today, the advances in Complementary MetalOxideSemiconductor (CMOS) technology have guided the progress in the wireless communications circuits and systems area. Various new communication standards have been developed to accommodate a variety of applications at different frequency bands, such as cellular communications at 900 and 1800 MHz, global positioning system (GPS) at 1.2 and 1.5 GHz, and Bluetooth andWiFi at 2.4 and 5.2 GHz, respectively. The modern wireless technology is now motivated by the global trend of developing multi-band/multistandard terminals for low-cost and multifunction transceivers. Exploring the unused 10-66 GHz frequency spectrum for high data rate communication is also another trend in the wireless industry. In this dissertation, the challenges and solutions for designing a multi-band/multistandard mobile device is addressed from system-level analysis to circuit implementation. A systematic system-level design methodology for block-level budgeting is proposed. The system-level design methodology focuses on minimizing the power consumption of the overall receiver. Then, a novel millimeter-wave dual-band receiver front-end architecture is developed to operate at 24 and 31 GHz. The receiver relies on a newly introduced concept of harmonic selection that helps to reduce the complexity of the dual-band receiver. Wideband circuit techniques for millimeterwave frequencies are also investigated and new bandwidth extension techniques are proposed for the dual-band 24/31 GHz receiver. These new techniques are applied for the low noise amplifier and millimeter-wave mixer resulting in the widest reported operating bandwidth in K-band, while consuming less power consumption. Additionally, various receiver building blocks, such as a low noise amplifier with reconfigurable input matching network for multi-band receivers, and a low drop-out regulator with high power supply rejection are analyzed and proposed. The low noise amplifier presents the first one with continuously reconfigurable input matching network, while achieving a noise figure comparable to the wideband techniques. The low drop-out regulator presented the first one with high power supply rejection in the mega-hertz frequency range. All the proposed building blocks and architecture in this dissertation are implemented using the existing silicon-based technologies, and resulted in several publications in IEEE Journals and Conferences.

Development of Micromachined Millimeter Wave Modules for Wireless Communication Systems

Author : Yuan Li
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (68 download)

DOWNLOAD NOW!

Book Synopsis Development of Micromachined Millimeter Wave Modules for Wireless Communication Systems by : Yuan Li

Download or read book Development of Micromachined Millimeter Wave Modules for Wireless Communication Systems written by Yuan Li and published by . This book was released on 2010 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: This research discusses the design, fabrication, integration, and characterization of micromachined millimeter-wave components and a signal source for THz multiplier source using the deep reactive ion etching technique. A wide range of advanced micromachined millimeter-wave components are proposed and fully validated with the measurement. These micromachined millimeter-wave passives include: the W-band straight and meander waveguides, W-band three-pole filter, waveguide hybrid and power divider, a novel CPW-to-waveguide transition and filter, and a novel cavity resonator for 60-GHz reconfigurable applications. The proposed THz multiplier source is a broadband 900-GHz silicon micromachined two-anode frequency tripler with the state-of-the-art performance. The research results enable the silicon micromachining technique to build low-loss and low-cost millimeter-wave components and THz signal sources.

Foundations for Microstrip Circuit Design

Author : Terry C. Edwards
Publisher : John Wiley & Sons
ISBN 13 : 1118936175
Total Pages : 688 pages
Book Rating : 4.1/5 (189 download)

DOWNLOAD NOW!

Book Synopsis Foundations for Microstrip Circuit Design by : Terry C. Edwards

Download or read book Foundations for Microstrip Circuit Design written by Terry C. Edwards and published by John Wiley & Sons. This book was released on 2016-02-01 with total page 688 pages. Available in PDF, EPUB and Kindle. Book excerpt: Building on the success of the previous three editions, Foundations for Microstrip Circuit Design offers extensive new, updated and revised material based upon the latest research. Strongly design-oriented, this fourth edition provides the reader with a fundamental understanding of this fast expanding field making it a definitive source for professional engineers and researchers and an indispensable reference for senior students in electronic engineering. Topics new to this edition: microwave substrates, multilayer transmission line structures, modern EM tools and techniques, microstrip and planar transmision line design, transmission line theory, substrates for planar transmission lines, Vias, wirebonds, 3D integrated interposer structures, computer-aided design, microstrip and power-dependent effects, circuit models, microwave network analysis, microstrip passive elements, and slotline design fundamentals.

Aperture Antennas for Millimeter and Sub-Millimeter Wave Applications

Author : Artem Boriskin
Publisher : Springer
ISBN 13 : 3319627732
Total Pages : 494 pages
Book Rating : 4.3/5 (196 download)

DOWNLOAD NOW!

Book Synopsis Aperture Antennas for Millimeter and Sub-Millimeter Wave Applications by : Artem Boriskin

Download or read book Aperture Antennas for Millimeter and Sub-Millimeter Wave Applications written by Artem Boriskin and published by Springer. This book was released on 2017-09-05 with total page 494 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the technology of millimetre waves and Terahertz (THz) antennas. It highlights the importance of moderate and high-gain aperture antennas as key devices for establishing point-to-point and point-to-multipoint radio links for far-field and near-field applications, such as high data-rate communications, intelligent transport, security imaging, exploration and surveillance systems. The book provides a comprehensive overview of the key antenna technologies developed for the mm wave and THz domains, including established ones – such as integrated lens antennas, advanced 2D and 3D horn antennas, transmit and reflect arrays, and Fabry-Perot antennas – as well as emerging metasurface antennas for near-field and far-field applications. It describes the pros and cons of each antenna technology in comparison with other available solutions, a discussion supplemented by practical examples illustrating the step-by-step implementation procedures for each antenna type. The measurement techniques available at these frequency ranges are also presented to close the loop of the antenna development cycle. In closing, the book outlines future trends in various antenna technologies, paving the way for further developments. Presenting content originating from the five-year ESF research networking program ‘Newfocus’ and co-authored by the most active and highly cited research groups in the domain of mm- and sub-mm-wave antenna technologies, the book offers a valuable guide for researchers and engineers in both industry and academia.

Novel Technologies for Microwave and Millimeter — Wave Applications

Author : Jean-Fu Kiang
Publisher : Springer Science & Business Media
ISBN 13 : 1475741561
Total Pages : 617 pages
Book Rating : 4.4/5 (757 download)

DOWNLOAD NOW!

Book Synopsis Novel Technologies for Microwave and Millimeter — Wave Applications by : Jean-Fu Kiang

Download or read book Novel Technologies for Microwave and Millimeter — Wave Applications written by Jean-Fu Kiang and published by Springer Science & Business Media. This book was released on 2013-06-29 with total page 617 pages. Available in PDF, EPUB and Kindle. Book excerpt: Novel Technologies for Microwave and Millimeter-Wave Applications provides an overview of current research status in selected field, to facilitate a learning process from concepts to practices, from component design to system architecture, and from small scale to large scale. Each chapter focuses on a topic and is organized to be self-sufficient. Contents in each chapter include concise description of relevant background information, major issues, current trend and future challenges. Useful references are also listed for further reading. Novel Technologies for Microwave and Millimeter-Wave Applications is suitable as a textbook for senior or graduate courses in microwave engineering.