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Design For Manufacturability With Advanced Lithography
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Book Synopsis Design for Manufacturability with Advanced Lithography by : Bei Yu
Download or read book Design for Manufacturability with Advanced Lithography written by Bei Yu and published by Springer. This book was released on 2015-10-28 with total page 173 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book introduces readers to the most advanced research results on Design for Manufacturability (DFM) with multiple patterning lithography (MPL) and electron beam lithography (EBL). The authors describe in detail a set of algorithms/methodologies to resolve issues in modern design for manufacturability problems with advanced lithography. Unlike books that discuss DFM from the product level or physical manufacturing level, this book describes DFM solutions from a circuit design level, such that most of the critical problems can be formulated and solved through combinatorial algorithms.
Book Synopsis Design for Manufacturing with Advanced Lithography by : Bei Yu
Download or read book Design for Manufacturing with Advanced Lithography written by Bei Yu and published by . This book was released on 2014 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt: Shrinking the feature size of very large scale integrated circuits (VLSI) with advanced lithography has been a holy grail for the semiconductor industry. However, the gap between manufacturing capability and the expectation of design performance becomes critically challenged in sub-16nm technology nodes. To bridge this gap, design for manufacturing (DFM) is a must to co-optimize both design and lithography process at the same time. DFM for advanced lithography could be defined very differently under different circumstances. In general, progress in advanced lithography happens along three different directions: (1) New patterning technique (e.g., layout decomposition for different patterning techniques); (2) New design methodology (e.g., lithography aware standard cell design and physical design); (3) New illumination system (e.g., layout fracturing for EBL system, stencil planning for EBL system). In this dissertation, we present our research results on design for manufacturing (DFM) with multiple patterning lithography (MPL) and electron beam lithography (EBL) addressing these three DFM research directions in advanced lithography. For the research direction of new patterning technique, we study the layout decomposition problems for different patterning technique and explore four important topics: (1) layout decomposition for triple patterning; (2) density balanced layout decomposition for triple patterning; (3) layout decomposition for triple patterning with end-cutting; (4) layout decomposition for quadruple patterning and beyond. We present the proof that triple patterning layout decomposition is NP-hard. Besides, we propose a number of CAD optimization and integration techniques to solve different problems. For the research direction of new design methodology, we will show the limitation of traditional design flow. That is, ignoring triple patterning lithography (TPL) in early stages may limit the potential to resolve all the TPL conflicts. We propose a coherent framework, including standard cell compliance and detailed placement, to enable TPL friendly design. Considering TPL constraints during early design stages, such as standard cell compliance, improves the layout decomposability. With the pre-coloring solutions of standard cells, we present a TPL aware detailed placement where the layout decomposition and placement can be resolved simultaneously. In addition, we propose a linear dynamic programming to solve TPL aware detailed placement with maximum displacement, which can achieve good trade-off in terms of runtime and performance. For the EBL illumination system, we focus on two topics to improve the throughput of the whole EBL system: (1) overlapping aware stencil planning under MCC system; (2) L-shape based layout fracturing for mask preparation. With simulations and experiments, we demonstrate the critical role and effectiveness of DFM techniques for the advanced lithography, as the semiconductor industry marches forward in the deeper sub-micron domain.
Book Synopsis Physical Design and Mask Synthesis for Directed Self-Assembly Lithography by : Seongbo Shim
Download or read book Physical Design and Mask Synthesis for Directed Self-Assembly Lithography written by Seongbo Shim and published by Springer. This book was released on 2018-03-21 with total page 144 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses physical design and mask synthesis of directed self-assembly lithography (DSAL). It covers the basic background of DSAL technology, physical design optimizations such as placement and redundant via insertion, and DSAL mask synthesis as well as its verification. Directed self-assembly lithography (DSAL) is a highly promising patterning solution in sub-7nm technology.
Book Synopsis Lithography-driven Design for Manufacturing in Nanometer-era VLSI by : Chul-Hong Park
Download or read book Lithography-driven Design for Manufacturing in Nanometer-era VLSI written by Chul-Hong Park and published by . This book was released on 2008 with total page 202 pages. Available in PDF, EPUB and Kindle. Book excerpt: Photolithography has been a key enabler of the aggressive IC technology scaling implicit in Moore's Law. As minimum feature sizes approach the physical limits of lithography and the manufacturing process, resolution enhancement techniques (RETs) dictate certain tradeoffs with various aspects of process and performance. This in turn has led to unpredictable design, unpredictable manufacturing, and low yield. As a result, close communication between designer and manufacturer has become essential to overcome the uncertainties of design and manufacturing. The design for manufacturability (DFM) paradigm has emerged recently to improve communications at the design-manufacturing interface and to reduce manufacturing variability. DFM is a set of technologies and methodologies that both help the designer extract maximum value from silicon process technology and solve "unsolvable" manufacturing challenges. Traditional DFM techniques, which include design rule check (DRC) and optical proximity correction (OPC), have been successfully used until now. However, as the extent and complexity of lithography variations increase, traditional techniques are no longer adequate to accommodate the various lithography demands. This thesis focuses on ways to mitigate the impact of lithography variations on design by establishing new interfaces between design and manufacturing. The motivations for doing so are improved printability, timing and leakage as well as reduced design cost. To improve printability, we propose a detailed placement perturbation technique for improved depth of focus and process window. Using a dynamic programming (DP)-based method for the perturbation, the technique facilitates insertion of scattering bars and etch dummy features, reducing inter-cell forbidden pitches almost completely. We also propose a novel auxiliary pattern-enabled cell-based OPC which can improve the edge placement error over cell-based OPC. The technique improves runtime which has grown unacceptably in model-based OPC, while retaining its runtime advantage as well as timing and leakage optimization. The detailed placement framework is also available to allow opportunistic insertion of auxiliary pattern around cell instances in the design layout. Aberration leads to linewidth variation which is fundamental to achieve timing performance and manufacturing yield. We describe an aberration-aware timing analysis flow that accounts for aberration-induced cell delay variations. We then propose an aberration-aware timing-driven global placement technique which utilizes the predictable slow and fast regions created on the chip due to aberration to improve cycle time. The use of the technique along with field blading achieves significant cycle time improvement. DoseMapper technique adopted in advanced lithography equipments has been used to reduce the across-chip linewidth variation. We propose a novel method to enhance timing yield as well as reduce leakage power by combined dose map and placement optimizations. The new dose map is not determined to have the same critical dimension (CD) in all transistor gates, but optimized to have different linewidths. That is, for devices on setup timing-critical paths, a smaller than nominal CD will be desirable, since this creates a faster-switching transistor. On the other hand, for devices on hold timing-critical paths, a larger than nominal gate CD will be desirable since this creates a less leaky transistor. Last, the golden verification signoff tool using simulation-based approach represents a runtime-quality tradeoff that is high in quality, but also high in runtime. We are motivated to develop a low-runtime pre-filter that reduces the amount of layout area to be analyzed by the golden tool, without compromising the overall quality finding hotspots. We demonstrate a dual graph-based hotspot filtering technique that enables fast and accurate estimation.
Book Synopsis Design for Manufacturability and Yield for Nano-Scale CMOS by : Charles Chiang
Download or read book Design for Manufacturability and Yield for Nano-Scale CMOS written by Charles Chiang and published by Springer Science & Business Media. This book was released on 2007-06-15 with total page 277 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book walks the reader through all the aspects of manufacturability and yield in a nano-CMOS process. It covers all CAD/CAE aspects of a SOC design flow and addresses a new topic (DFM/DFY) critical at 90 nm and beyond. This book is a must read book the serious practicing IC designer and an excellent primer for any graduate student intent on having a career in IC design or in EDA tool development.
Book Synopsis Design for Manufacturability by : Artur Balasinski
Download or read book Design for Manufacturability written by Artur Balasinski and published by Springer Science & Business Media. This book was released on 2013-10-05 with total page 283 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes. It is a valuable guide for layout designers, packaging engineers and quality engineers, covering DfM development from 1D to 4D, involving IC design flow setup, best practices, links to manufacturing and product definition, for process technologies down to 22 nm node, and product families including memories, logic, system-on-chip and system-in-package.
Book Synopsis Design for Manufacturability and Statistical Design by : Michael Orshansky
Download or read book Design for Manufacturability and Statistical Design written by Michael Orshansky and published by Springer Science & Business Media. This book was released on 2007-10-28 with total page 319 pages. Available in PDF, EPUB and Kindle. Book excerpt: Design for Manufacturability and Statistical Design: A Comprehensive Approach presents a comprehensive overview of methods that need to be mastered in understanding state-of-the-art design for manufacturability and statistical design methodologies. Broadly, design for manufacturability is a set of techniques that attempt to fix the systematic sources of variability, such as those due to photolithography and CMP. Statistical design, on the other hand, deals with the random sources of variability. Both paradigms operate within a common framework, and their joint comprehensive treatment is one of the objectives of this book and an important differentation.
Book Synopsis Lithography Aware Physical Design and Layout Optimization for Manufacturability by : Jhih-Rong Gao
Download or read book Lithography Aware Physical Design and Layout Optimization for Manufacturability written by Jhih-Rong Gao and published by . This book was released on 2014 with total page 326 pages. Available in PDF, EPUB and Kindle. Book excerpt: As technology continues to scale down, semiconductor manufacturing with 193nm lithography is greatly challenging because the required half pitch size is beyond the resolution limit. In order to bridge the gap between design requirements and manufacturing limitations, various resolution enhancement techniques have been proposed to avoid potentially problematic patterns and to improve product yield. In addition, co-optimization between design performance and manufacturability can further provide flexible and significant yield improvement, and it has become necessary for advanced technology nodes. This dissertation presents the methodologies to consider the lithography impact in different design stages to improve layout manufacturability. Double Patterning Lithography (DPL) has been a promising solution for sub-22nm node volume production. Among DPL techniques, self-aligned double patterning (SADP) provides good overlay controllability when two masks are not aligned perfectly. However, SADP process places several limitations on design flexibility and still exists many challenges in physical design stages. Starting from the early design stage, we analyze the standard cell designs and construct a set of SADP-aware cell placement candidates, and show that placement legalization based on this SADP awareness information can effectively resolve DPL conflicts. In the detailed routing stage, we propose a new routing cost formulation based on SADP-compliant routing guidelines, and achieve routing and layout decomposition simultaneously. In the case that limited routing perturbation is allowed, we propose a post-routing flow based on lithography simulation and lithography-aware design rules. Both routing methods, one in detailed routing stage and one in post routing stage, reduce DPL conflicts/violations significantly with negligible wire length impact. In the layout decomposition stage, layout modification is restricted and thus the manufacturability is even harder to guaranteed. By taking the advantage of complementary lithography, we present a new layout decomposition approach with e-beam cutting, which optimizes SADP overlay error and e-beam lithography throughput simultaneously. After the mask layout is defined, optical proximity correction (OPC) is one of the resolution enhancement techniques that is commonly required to compensate the image distortion from the lithography process. We propose an inverse lithography technique to solve the OPC problem considering design target and process window co-optimization. Our mask optimization is pixel based and thus can enable better contour fidelity. In the final physical verification stage, a complex and time-consuming lithography simulation needs to be performed to identify faulty patterns. We provide a classification method based on support vector machine and principle component analysis that detects lithographic hotspots efficiently and accurately.
Book Synopsis Advanced Applications in Manufacturing Engineering by : Mangey Ram
Download or read book Advanced Applications in Manufacturing Engineering written by Mangey Ram and published by Woodhead Publishing. This book was released on 2018-10-29 with total page 280 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Applications in Manufacturing Engineering presents the latest research and development in manufacturing engineering across a range of areas, treating manufacturing engineering on an international and transnational scale. It considers various tools, techniques, strategies and methods in manufacturing engineering applications. With the latest knowledge in technology for engineering design and manufacture, this book provides systematic and comprehensive coverage on a topic that is a key driver in rapid economic development, and that can lead to economic benefits and improvements to quality of life on a large-scale. Presents the latest research and developments in manufacturing engineering Covers a comprehensive spread of manufacturing engineering areas for different tasks Discusses tools, techniques, strategies and methods in manufacturing engineering applications Considers manufacturing engineering at an international and transnational scale Enables the reader to learn advanced applications in manufacturing engineering
Book Synopsis Analog Design for Manufacturability by : Xuan Dong
Download or read book Analog Design for Manufacturability written by Xuan Dong and published by . This book was released on 2017 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: As transistor sizes shrink over time in the advanced nanometer technologies, lithography effects have become a dominant contributor of integrated circuit (IC) yield degradation. Random manufacturing variations, such as photolithographic defect or spot defect, may cause fatal functional failures, while systematic process variations, such as dose fluctuation and defocus, can result in wafer pattern distortions and in turn ruin circuit performance. This dissertation is focused on yield optimization at the circuit design stage or so-called design for manufacturability (DFM) with respect to analog ICs, which has not yet been sufficiently addressed by traditional DFM solutions. On top of a graph-based analog layout retargeting framework, in this dissertation the photolithographic defects and lithography process variations are alleviated by geometrical layout manipulation operations including wire widening, wire shifting, process variation band (PV-band) shifting, and optical proximity correction (OPC). The ultimate objective of this research is to develop efficient algorithms and methodologies in order to achieve lithography-robust analog IC layout design without circuit performance degradation.
Book Synopsis Design for Manufacturability and Reliability Through Learning and Optimization by : Wei Ye (Ph. D.)
Download or read book Design for Manufacturability and Reliability Through Learning and Optimization written by Wei Ye (Ph. D.) and published by . This book was released on 2020 with total page 332 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modern society relies on technologies with integrated circuits (ICs) at their heart. In the last several decades, as the performance and complexity of ICs keep escalating, the semiconductor industry has demonstrated an ability to develop new process techniques and product designs that are both manufacturable and reliable. However, as the transistor feature size is further shrunk into extreme scaling (e.g., 10 nm and beyond), large scale integration of transistors and interconnects brings ever-increasing challenges revolving around manufacturability and reliability. The major issues in manufacturability and reliability for modern ICs come from three aspects: (1) layout-dependent manufacturability (e.g., manufacturing yield sensitive to design patterns); (2) time-consuming process modeling (e.g., complex lithography systems); (3) design-sensitive reliability (e.g., lifetime related to layout designs). In order to close the gap between design and manufacturing and enhance design reliability, automated layout generation requires cross-layer information feed-forward and feedback, such as accurate process modeling and reliability-guided design optimization. This dissertation attempts to address the aforementioned challenges in manufacturing closure and reliability signoff through efficient machine learning techniques for lithography hotspot detection and lithography modeling, and synergistic design optimization for electromigration (EM). Our research includes efficient lithography hotspot detection, learning-based lithography modeling, and EM-aware physical design to achieve efficient manufacturing closure and reliability signoff. For lithography hotspot detection, due to the increasingly complicated design patterns, early and quick feedback for lithography hotspots is desired to guide design closure in early stages. Machine learning approaches have been successfully applied to hotspot detection while demonstrating a remarkable capability of generalization to unseen hotspot patterns. However, most of the proposed machine learning approaches are not yet able to answer two critical questions: model confidence and model efficiency. This study develops a lithography hotspot detection framework capable of providing modeling confidence with fewer training data and fewer expensive lithography simulations needed, and also provides a holistic measure for the intrinsic class imbalance in lithography hotspot detection. For lithography modeling, one of the major limitations in process modeling is considered: the trade-off between modeling efficiency and accuracy. The steady decrease of the feature sizes, along with the growing complexity and variation of the manufacturing process, has tremendously increased the lithography modeling complexity and prolonged the already-slow simulation procedure. Different modeling frameworks are proposed in this study, leveraging recent advancements in machine learning, particularly generative adversarial learning, to generate virtually simulated silicon image efficiently without running detailed optical simulations. With our proposed deep learning techniques, a significant improvement in modeling efficiency is achieved while maintaining high modeling accuracy. For EM-aware physical design, we demonstrate the limitation of conventional design and EM signoff flow when faced with the ever-growing EM violations in advanced technology nodes. Two essential directions are explored with practical algorithms and new design flows: (1) Power grid EM detection and optimization with several detailed placement techniques; (2) Learning-based signal EM prediction and mitigation at different physical design stages. The effectiveness of proposed design optimization and machine learning techniques is demonstrated with extensive experiments on industrial-strength benchmarks. Our approaches are capable of reducing turn-around time, saving modeling costs, and enabling fast manufacturing closure and reliability signoff
Book Synopsis Nano-CMOS Design for Manufacturability by : Ban P. Wong
Download or read book Nano-CMOS Design for Manufacturability written by Ban P. Wong and published by John Wiley & Sons. This book was released on 2008-12-29 with total page 408 pages. Available in PDF, EPUB and Kindle. Book excerpt: Discover innovative tools that pave the way from circuit and physical design to fabrication processing Nano-CMOS Design for Manufacturability examines the challenges that design engineers face in the nano-scaled era, such as exacerbated effects and the proven design for manufacturability (DFM) methodology in the midst of increasing variability and design process interactions. In addition to discussing the difficulties brought on by the continued dimensional scaling in conformance with Moore's law, the authors also tackle complex issues in the design process to overcome the difficulties, including the use of a functional first silicon to support a predictable product ramp. Moreover, they introduce several emerging concepts, including stress proximity effects, contour-based extraction, and design process interactions. This book is the sequel to Nano-CMOS Circuit and Physical Design, taking design to technology nodes beyond 65nm geometries. It is divided into three parts: Part One, Newly Exacerbated Effects, introduces the newly exacerbated effects that require designers' attention, beginning with a discussion of the lithography aspects of DFM, followed by the impact of layout on transistor performance Part Two, Design Solutions, examines how to mitigate the impact of process effects, discussing the methodology needed to make sub-wavelength patterning technology work in manufacturing, as well as design solutions to deal with signal, power integrity, WELL, stress proximity effects, and process variability Part Three, The Road to DFM, describes new tools needed to support DFM efforts, including an auto-correction tool capable of fixing the layout of cells with multiple optimization goals, followed by a look ahead into the future of DFM Throughout the book, real-world examples simplify complex concepts, helping readers see how they can successfully handle projects on Nano-CMOS nodes. It provides a bridge that allows engineers to go from physical and circuit design to fabrication processing and, in short, make designs that are not only functional, but that also meet power and performance goals within the design schedule.
Book Synopsis Extending Moore's Law through Advanced Semiconductor Design and Processing Techniques by : Wynand Lambrechts
Download or read book Extending Moore's Law through Advanced Semiconductor Design and Processing Techniques written by Wynand Lambrechts and published by CRC Press. This book was released on 2018-09-13 with total page 345 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a methodological understanding of the theoretical and technical limitations to the longevity of Moore’s law. The book presents research on factors that have significant impact on the future of Moore’s law and those factors believed to sustain the trend of the last five decades. Research findings show that boundaries of Moore’s law primarily include physical restrictions of scaling electronic components to levels beyond that of ordinary manufacturing principles and approaching the bounds of physics. The research presented in this book provides essential background and knowledge to grasp the following principles: Traditional and modern photolithography, the primary limiting factor of Moore’s law Innovations in semiconductor manufacturing that makes current generation CMOS processing possible Multi-disciplinary technologies that could drive Moore's law forward significantly Design principles for microelectronic circuits and components that take advantage of technology miniaturization The semiconductor industry economic market trends and technical driving factors The complexity and cost associated with technology scaling have compelled researchers in the disciplines of engineering and physics to optimize previous generation nodes to improve system-on-chip performance. This is especially relevant to participate in the increased attractiveness of the Internet of Things (IoT). This book additionally provides scholarly and practical examples of principles in microelectronic circuit design and layout to mitigate technology limits of previous generation nodes. Readers are encouraged to intellectually apply the knowledge derived from this book to further research and innovation in prolonging Moore’s law and associated principles.
Book Synopsis Advanced Gate Stack, Source/Drain, and Channel Engineering for Si-Based CMOS 4: New Materials, Processes, and Equipment by : P. J. Timans
Download or read book Advanced Gate Stack, Source/Drain, and Channel Engineering for Si-Based CMOS 4: New Materials, Processes, and Equipment written by P. J. Timans and published by The Electrochemical Society. This book was released on 2008-05 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt: This issue describes processing, materials and equipment for CMOS front-end integration including gate stack, source/drain and channel engineering. Topics: strained Si/SiGe and Si/SiGe on insulator; high-mobility channels including III-V¿s, etc.; nanowires and carbon nanotubes; high-k dielectrics, metal and FUSI gate electrodes; doping/annealing for ultra-shallow junctions; low-resistivity contacts; advanced deposition (e.g. ALD, CVD, MBE), RTP, UV, plasma and laser-assisted processes.
Book Synopsis Design for Manufacturability by : David M. Anderson
Download or read book Design for Manufacturability written by David M. Anderson and published by CRC Press. This book was released on 2020-05-11 with total page 534 pages. Available in PDF, EPUB and Kindle. Book excerpt: Achieve any cost goals in half the time and achieve stable production with quality designed in right-the-first-time. Design for Manufacturability: How to Use Concurrent Engineering to Rapidly Develop Low-Cost, High-Quality Products for Lean Production is still the definitive work on DFM. This second edition extends the proven methodology to the most advanced product development process with the addition of the following new, unique, and original topics, which have never been addressed previously. These topics show you how to: Cut cost from 1/2 to 1/10 in 9 categories—with ways to remove that much cost from product charges and pricing Commercialize innovation—starting with Manufacturable Research and learning from the new section on scalability, you will learn how to design products and processing equipment to quickly scale up to any needed demand or desired growth. Design product families that can be built "on-demand" in platform cells that also "mass customize" products to-order Make Lean production easier to implement with much more effective results while making build-to-order practical with spontaneous supply chains and eliminating forecasted inventory by including an updated chapter on "Designing Products for Lean Production" The author’s 30 years of experience teaching companies DFM based on pre-class surveys and plant tours is the foundation of this most advanced design process. It includes incorporating dozens of proven DFM guidelines through up-front concurrent-engineering teamwork that cuts the time to stable production in half and curtails change orders for ramps, rework, redesign, substituting cheaper parts, change orders to fix the changes, unstable design specs, part obsolescence, and late discovery of manufacturability issues at periodic design reviews. This second edition is for the whole product development community, including: Engineers who want to learn the most advanced DFM techniques Managers who want to lead the most advanced product development Project team leaders who want to immediately apply all the principles taught in this book in their own micro-climate Improvement leaders and champions who want to implement the above and ensure that the company can design products and versatile processing equipment for low-volume/high-mix product varieties Designing half to a tenth of cost categories can avoid substituting cheap parts, which degrades quality, and encourages standardization and spontaneous supply chains, which will encourage Lean initiatives. Using cellular manufacturing to shift production between lines for mixed production of platforms and build-to-order to offer the fastest order fulfillment can beat any competitors’ delivery time.
Book Synopsis Design and Process Integration for Microelectronic Manufacturing by :
Download or read book Design and Process Integration for Microelectronic Manufacturing written by and published by . This book was released on 2006 with total page 634 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Stereolithography by : Paulo Jorge Bártolo
Download or read book Stereolithography written by Paulo Jorge Bártolo and published by Springer Science & Business Media. This book was released on 2011-03-18 with total page 345 pages. Available in PDF, EPUB and Kindle. Book excerpt: Stereolithography: Materials, Processes and Applications will focus on recent advances in stereolithography covering aspects related to the most recent advances in the field, in terms of fabrication processes (two-photon polymerization, micro-stereolithography, infrared stereolithography and stereo-thermal-lithography), materials (novel resins, hydrogels for medical applications and highly reinforced resins with ceramics and metals), computer simulation and applications.
