Computer Aided Design of Optoelectronic Multi-chip Modules

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Publisher :
ISBN 13 :
Total Pages : 404 pages
Book Rating : 4.:/5 (318 download)

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Book Synopsis Computer Aided Design of Optoelectronic Multi-chip Modules by : Jiao Fan

Download or read book Computer Aided Design of Optoelectronic Multi-chip Modules written by Jiao Fan and published by . This book was released on 1994 with total page 404 pages. Available in PDF, EPUB and Kindle. Book excerpt:

High Performance Design Automation for Multi-chip Modules and Packages

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Publisher : World Scientific
ISBN 13 : 9789810223076
Total Pages : 272 pages
Book Rating : 4.2/5 (23 download)

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Book Synopsis High Performance Design Automation for Multi-chip Modules and Packages by : Jun-Dong Cho

Download or read book High Performance Design Automation for Multi-chip Modules and Packages written by Jun-Dong Cho and published by World Scientific. This book was released on 1996 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt: Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages.

Scientific and Technical Aerospace Reports

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Publisher :
ISBN 13 :
Total Pages : 652 pages
Book Rating : 4.:/5 (319 download)

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Book Synopsis Scientific and Technical Aerospace Reports by :

Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1995 with total page 652 pages. Available in PDF, EPUB and Kindle. Book excerpt: Lists citations with abstracts for aerospace related reports obtained from world wide sources and announces documents that have recently been entered into the NASA Scientific and Technical Information Database.

Computer-aided Design of Optoelectronic Integrated Circuits and Systems

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Publisher : Prentice Hall
ISBN 13 :
Total Pages : 384 pages
Book Rating : 4.F/5 ( download)

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Book Synopsis Computer-aided Design of Optoelectronic Integrated Circuits and Systems by : James J. Morikuni

Download or read book Computer-aided Design of Optoelectronic Integrated Circuits and Systems written by James J. Morikuni and published by Prentice Hall. This book was released on 1997 with total page 384 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Physical Design for Multichip Modules

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Publisher : Springer Science & Business Media
ISBN 13 : 1461526825
Total Pages : 205 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis Physical Design for Multichip Modules by : Mysore Sriram

Download or read book Physical Design for Multichip Modules written by Mysore Sriram and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 205 pages. Available in PDF, EPUB and Kindle. Book excerpt: Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as well as original work by the authors. All major aspects of MCM physical design are discussed, including interconnect analysis and modeling, system partitioning and placement, and multilayer routing. For readers unfamiliar with MCMs, this book presents an overview of the different MCM technologies available today. An in-depth discussion of various recent approaches to interconnect analysis are also presented. Remaining chapters discuss the problems of partitioning, placement, and multilayer routing, with an emphasis on timing performance. For the first time, data from a wide range of sources is integrated to present a clear picture of a new, challenging and very important research area. For students and researchers looking for interesting research topics, open problems and suggestions for further research are clearly stated. Points of interest include : Clear overview of MCM technology and its relationship to physical design; Emphasis on performance-driven design, with a chapter devoted to recent techniques for rapid performance analysis and modeling of MCM interconnects; Different approaches to multilayer MCM routing collected together and compared for the first time; Explanation of algorithms is not overly mathematical, yet is detailed enough to give readers a clear understanding of the approach; Quantitative data provided wherever possible for comparison of different approaches; A comprehensive list of references to recent literature on MCMs provided.

Selected Papers on Optical Interconnects and Packaging

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Publisher : SPIE-International Society for Optical Engineering
ISBN 13 :
Total Pages : 744 pages
Book Rating : 4.E/5 ( download)

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Book Synopsis Selected Papers on Optical Interconnects and Packaging by : Sing H. Lee

Download or read book Selected Papers on Optical Interconnects and Packaging written by Sing H. Lee and published by SPIE-International Society for Optical Engineering. This book was released on 1997 with total page 744 pages. Available in PDF, EPUB and Kindle. Book excerpt: SPIE Milestones are collections of seminal papers from the world literature covering important discoveries and developments in optics and photonics.

Proceedings of the First International Workshop on Massively Parallel Processing Using Interconnections, April 26-27, 1994, Cancún, Mexico

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Publisher :
ISBN 13 :
Total Pages : 352 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Proceedings of the First International Workshop on Massively Parallel Processing Using Interconnections, April 26-27, 1994, Cancún, Mexico by :

Download or read book Proceedings of the First International Workshop on Massively Parallel Processing Using Interconnections, April 26-27, 1994, Cancún, Mexico written by and published by . This book was released on 1994 with total page 352 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Field-Programmable Analog Arrays

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Publisher : Springer Science & Business Media
ISBN 13 : 1475752245
Total Pages : 166 pages
Book Rating : 4.4/5 (757 download)

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Book Synopsis Field-Programmable Analog Arrays by : Edmund Pierzchala

Download or read book Field-Programmable Analog Arrays written by Edmund Pierzchala and published by Springer Science & Business Media. This book was released on 2013-06-29 with total page 166 pages. Available in PDF, EPUB and Kindle. Book excerpt: Field-Programmable Analog Arrays brings together in one place important contributions and up-to-date research results in this fast moving area. Field-Programmable Analog Arrays serves as an excellent reference, providing insight into some of the most challenging research issues in the field.

Chip On Board

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Publisher : Springer Science & Business Media
ISBN 13 : 9780442014414
Total Pages : 584 pages
Book Rating : 4.0/5 (144 download)

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Book Synopsis Chip On Board by : John H. Lau

Download or read book Chip On Board written by John H. Lau and published by Springer Science & Business Media. This book was released on 1994-06-30 with total page 584 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.

Physics Briefs

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Publisher :
ISBN 13 :
Total Pages : 1224 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Physics Briefs by :

Download or read book Physics Briefs written by and published by . This book was released on 1994 with total page 1224 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Optical Computing, Proceedings of the INT Conference, Heriot-Watt University, Edinburgh, UK, August 22-25, 1994

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Author :
Publisher : CRC Press
ISBN 13 :
Total Pages : 690 pages
Book Rating : 4.X/5 (2 download)

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Book Synopsis Optical Computing, Proceedings of the INT Conference, Heriot-Watt University, Edinburgh, UK, August 22-25, 1994 by : Brian S. Wherrett

Download or read book Optical Computing, Proceedings of the INT Conference, Heriot-Watt University, Edinburgh, UK, August 22-25, 1994 written by Brian S. Wherrett and published by CRC Press. This book was released on 1995 with total page 690 pages. Available in PDF, EPUB and Kindle. Book excerpt: This proceedings volume covers architectures & algorithms for optical computing, optical interconnections & switching, devices & components, & quantum optoelectronics.

Electrothermal Analysis of VLSI Systems

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Publisher : Springer Science & Business Media
ISBN 13 : 0306470241
Total Pages : 220 pages
Book Rating : 4.3/5 (64 download)

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Book Synopsis Electrothermal Analysis of VLSI Systems by : Yi-Kan Cheng

Download or read book Electrothermal Analysis of VLSI Systems written by Yi-Kan Cheng and published by Springer Science & Business Media. This book was released on 2005-12-01 with total page 220 pages. Available in PDF, EPUB and Kindle. Book excerpt: This useful book addresses electrothermal problems in modern VLSI systems. It discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires. The authors present three important applications of VLSI electrothermal analysis: temperature-dependent electromigration diagnosis, cell-level thermal placement, and temperature-driven power and timing analysis.

The Electronic Packaging Handbook

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Publisher : CRC Press
ISBN 13 : 9781420049848
Total Pages : 648 pages
Book Rating : 4.0/5 (498 download)

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Book Synopsis The Electronic Packaging Handbook by : Glenn R. Blackwell

Download or read book The Electronic Packaging Handbook written by Glenn R. Blackwell and published by CRC Press. This book was released on 2017-12-19 with total page 648 pages. Available in PDF, EPUB and Kindle. Book excerpt: The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.

Program Information Package for Defense Technology Conversion, Reinvestment, and Transition Assistance

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Publisher : DIANE Publishing
ISBN 13 : 9780788103605
Total Pages : 142 pages
Book Rating : 4.1/5 (36 download)

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Book Synopsis Program Information Package for Defense Technology Conversion, Reinvestment, and Transition Assistance by :

Download or read book Program Information Package for Defense Technology Conversion, Reinvestment, and Transition Assistance written by and published by DIANE Publishing. This book was released on 1994 with total page 142 pages. Available in PDF, EPUB and Kindle. Book excerpt: Addresses defense industry and technology base activities under eight separate statutory authority programs and sets forth planned selection criteria by which proposals received under a future solicitation will be evaluated. Covers: technology reinvestment activities (technology development, technology deployment, and manufacturing education and training), and eligibility and statutory programs. Also, planning for submission of proposals.

Dual-Use Space Technology Transfer Conference and Exhibition

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Publisher :
ISBN 13 :
Total Pages : 488 pages
Book Rating : 4.:/5 (317 download)

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Book Synopsis Dual-Use Space Technology Transfer Conference and Exhibition by :

Download or read book Dual-Use Space Technology Transfer Conference and Exhibition written by and published by . This book was released on 1994 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Wavelength Multiplexed Volume Holographic Lens Arrays for Optical Memory Distribution

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Publisher :
ISBN 13 :
Total Pages : 302 pages
Book Rating : 4.:/5 (318 download)

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Book Synopsis Wavelength Multiplexed Volume Holographic Lens Arrays for Optical Memory Distribution by : Brian E. Catanzaro

Download or read book Wavelength Multiplexed Volume Holographic Lens Arrays for Optical Memory Distribution written by Brian E. Catanzaro and published by . This book was released on 1997 with total page 302 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Integrated Optoelectronics

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Publisher : Academic Press
ISBN 13 : 1483288390
Total Pages : 704 pages
Book Rating : 4.4/5 (832 download)

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Book Synopsis Integrated Optoelectronics by : Mario Dagenais

Download or read book Integrated Optoelectronics written by Mario Dagenais and published by Academic Press. This book was released on 2013-10-22 with total page 704 pages. Available in PDF, EPUB and Kindle. Book excerpt: Integrated optoelectronics is becoming ever more important to communications, computer, and consumer industries. It is the enabling technology in a variety of systems, ranging from low-cost, robust optical componentsin consumer electronics to high-performance broadband information networks capable of supporting video and multimedia conferencing. The requirements for producing low-cost, highly reliable components for deployment in these new systems have created a technology challenge. Integrated optoelectronics promises to meet the performance and cost objectives of these applications by integrating both optical and electronic components in a highly functional chip. This book provides an overview of this exciting newtechnology. Integrated Optoelectronics brings together a group of acknowledged experts from both universities and industry around the world to focus on a common theme of integration. These experts have reported not only on the state-of-the-art, but also on the physics and design experience that goes into implementing integrated chips and modules. This book is a cohesive series of articles that includes a discussion of the intimate trade-offs between materials, processes, devices, functional blocks, packaging,and systems requirements in a truly integrated technology. This integration encompasses electrical, optoelectronic, and optical devices onto monolithic or hybrid chips, and into multichip modules. This volume surveys state-of-the-art research activities in integrated optoelectronics and gathers most of the important references into a single place. It outlines the major issues involved in integrating both optical and electronic components, provides an overview of design and fabrication concepts, and discusses the issues involved in bringing these new chips to the marketplace. This exciting new book: Provides a broad overview of the optoelectronic field, including materials processing, devices, and systems applications Features authors who are acknowledged research experts in this field, from both industry and universities around the world Includes new information on device fabrication, including the latest epitaxial growth and lift-off techniques to permit the mixing of dissimilar materials onto single chips Covers planar processed laser fabrication leading to wafer level automated testing Discusses optimization of devices for integration, including a detailed treatment of the vertical emitting laser and theoretical and experimental coverage of optimization of photodetectors for integration into receiver chips Describes design approaches for multifunctional chips, including photonic circuits for all-optical networks and the design of integrated optoelectronic chips with lasers, photodiodes, and electronic ICs Covers the infrastructure needed to support an integrated technology, including automated design systems which treat both optical and electrical circuits, and multichip packaging approaches for both optical and IC chips