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Carbon Nanotubes As Vertical Interconnects In 3d Integrated Circuits
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Book Synopsis Carbon Nanotubes for Interconnects by : Aida Todri-Sanial
Download or read book Carbon Nanotubes for Interconnects written by Aida Todri-Sanial and published by Springer. This book was released on 2016-07-09 with total page 340 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.
Book Synopsis Micro- and Nanoelectronics by : Tomasz Brozek
Download or read book Micro- and Nanoelectronics written by Tomasz Brozek and published by CRC Press. This book was released on 2017-12-19 with total page 388 pages. Available in PDF, EPUB and Kindle. Book excerpt: Micro- and Nanoelectronics: Emerging Device Challenges and Solutions presents a comprehensive overview of the current state of the art of micro- and nanoelectronics, covering the field from fundamental science and material properties to novel ways of making nanodevices. Containing contributions from experts in both industry and academia, this cutting-edge text: Discusses emerging silicon devices for CMOS technologies, fully depleted device architectures, characteristics, and scaling Explains the specifics of silicon compound devices (SiGe, SiC) and their unique properties Explores various options for post-CMOS nanoelectronics, such as spintronic devices and nanoionic switches Describes the latest developments in carbon nanotubes, iii-v devices structures, and more Micro- and Nanoelectronics: Emerging Device Challenges and Solutions provides an excellent representation of a complex engineering field, examining emerging materials and device architecture alternatives with the potential to shape the future of nanotechnology.
Book Synopsis Integrated Interconnect Technologies for 3D Nanoelectronic Systems by : Muhannad S. Bakir
Download or read book Integrated Interconnect Technologies for 3D Nanoelectronic Systems written by Muhannad S. Bakir and published by Artech House. This book was released on 2008-11-30 with total page 551 pages. Available in PDF, EPUB and Kindle. Book excerpt: This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.
Book Synopsis Nanoelectronic Device Applications Handbook by : James E. Morris
Download or read book Nanoelectronic Device Applications Handbook written by James E. Morris and published by CRC Press. This book was released on 2017-11-22 with total page 942 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nanoelectronic Device Applications Handbook gives a comprehensive snapshot of the state of the art in nanodevices for nanoelectronics applications. Combining breadth and depth, the book includes 68 chapters on topics that range from nano-scaled complementary metal–oxide–semiconductor (CMOS) devices through recent developments in nano capacitors and AlGaAs/GaAs devices. The contributors are world-renowned experts from academia and industry from around the globe. The handbook explores current research into potentially disruptive technologies for a post-CMOS world. These include: Nanoscale advances in current MOSFET/CMOS technology Nano capacitors for applications such as electronics packaging and humidity sensors Single electron transistors and other electron tunneling devices Quantum cellular automata and nanomagnetic logic Memristors as switching devices and for memory Graphene preparation, properties, and devices Carbon nanotubes (CNTs), both single CNT and random network Other CNT applications such as terahertz, sensors, interconnects, and capacitors Nano system architectures for reliability Nanowire device fabrication and applications Nanowire transistors Nanodevices for spintronics The book closes with a call for a new generation of simulation tools to handle nanoscale mechanisms in realistic nanodevice geometries. This timely handbook offers a wealth of insights into the application of nanoelectronics. It is an invaluable reference and source of ideas for anyone working in the rapidly expanding field of nanoelectronics.
Download or read book Nanopackaging written by James E. Morris and published by Springer. This book was released on 2018-09-22 with total page 1007 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.
Book Synopsis Carbon-Based Nanoelectromagnetics by : Antonio Maffucci
Download or read book Carbon-Based Nanoelectromagnetics written by Antonio Maffucci and published by Elsevier. This book was released on 2019-06-08 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt: Carbon-Based Nanoelectromagnetics provides detailed insights into the electromagnetic interactions of carbon-based nanostructured materials such as graphene and carbon nanotubes. Chapters within the book offer a comprehensive overview on this discipline, starting with an introduction to the field-matter interaction, its features, and finally, its applications in microwave, THz and optical frequency ranges. Electromagnetics at the nanoscale level has become a major research area in recent years as the synthesis of a variety of carbon-based nanostructures has progressed dramatically, thus opening the era of nanoelectronics and nanophotonics. To meet the challenges of these new fields, a thorough knowledge is required of the peculiar properties of the electromagnetic field. The novel behavior of the electromagnetic fields interacting with nano-sized elements and nano-structured has motivated the birth of this new research discipline, 'Nanoelectromagnetics'. - Presents a one-stop resource that explores the emerging field of nanoelectromagnetics - Focuses on modeling, simulation, analysis, design and characterization, with an emphasis on applications of nanoelectromagnetics - Explores the optical properties and applications of a range of carbon-based nanomaterials
Book Synopsis Carbon Nanotubes for Interconnects by : Aida Todri-Sanial
Download or read book Carbon Nanotubes for Interconnects written by Aida Todri-Sanial and published by Springer. This book was released on 2018-05-30 with total page 333 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.
Book Synopsis Communication Architectures for Systems-on-Chip by : José L. Ayala
Download or read book Communication Architectures for Systems-on-Chip written by José L. Ayala and published by CRC Press. This book was released on 2018-09-03 with total page 434 pages. Available in PDF, EPUB and Kindle. Book excerpt: A presentation of state-of-the-art approaches from an industrial applications perspective, Communication Architectures for Systems-on-Chip shows professionals, researchers, and students how to attack the problem of data communication in the manufacture of SoC architectures. With its lucid illustration of current trends and research improving the performance, quality, and reliability of transactions, this is an essential reference for anyone dealing with communication mechanisms for embedded systems, systems-on-chip, and multiprocessor architectures—or trying to overcome existing limitations. Exploring architectures currently implemented in manufactured SoCs—and those being proposed—this book analyzes a wide range of applications, including: Well-established communication buses Less common networks-on-chip Modern technologies that include the use of carbon nanotubes (CNTs) Optical links used to speed up data transfer and boost both security and quality of service (QoS) The book’s contributors pay special attention to newer problems, including how to protect transactions of critical on-chip information (personal data, security keys, etc.) from an external attack. They examine mechanisms, revise communication protocols involved, and analyze overall impact on system performance.
Book Synopsis Interconnect Technologies for Integrated Circuits and Flexible Electronics by : Yash Agrawal
Download or read book Interconnect Technologies for Integrated Circuits and Flexible Electronics written by Yash Agrawal and published by Springer Nature. This book was released on 2023-10-17 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.
Book Synopsis Nanotube Superfiber Materials by : Mark Schulz
Download or read book Nanotube Superfiber Materials written by Mark Schulz and published by William Andrew. This book was released on 2019-03-12 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nanotube Superfiber Materials: Science, Manufacturing, Commercialization, Second Edition, helps engineers and entrepreneurs understand the science behind the unique properties of nanotube fiber materials, how to efficiency and safely produce them, and how to transition them into commercial products. Each chapter gives an account of the basic science, manufacturing, properties and commercial potential of a specific nanotube material form and its application. New discoveries and technologies are explained, along with experiences in handing-off the improved materials to industry. This book spans nano-science, nano-manufacturing, and the commercialization of nanotube superfiber materials. As such, it opens up the vast commercial potential of nanotube superfiber materials. Applications for nanotube superfiber materials cut across most of the fields of engineering, including spacecraft, automobiles, drones, hyperloop tracks, water and air filters, infrastructure, wind energy, composites, and medicine where nanotube materials enable development of tiny machines that can work inside our bodies to diagnose and treat disease. - Provides up to date information on the applications of nanotube fiber materials - Explores both the manufacturing and commercialization of nanotube superfibers - Sets out the processes for producing macro-scale materials from carbon nanotubes - Describes the unique properties of these materials
Book Synopsis CHIPS 2020 VOL. 2 by : Bernd Höfflinger
Download or read book CHIPS 2020 VOL. 2 written by Bernd Höfflinger and published by Springer. This book was released on 2015-09-19 with total page 342 pages. Available in PDF, EPUB and Kindle. Book excerpt: The release of this second volume of CHIPS 2020 coincides with the 50th anniversary of Moore’s Law, a critical year marked by the end of the nanometer roadmap and by a significantly reduced annual rise in chip performance. At the same time, we are witnessing a data explosion in the Internet, which is consuming 40% more electrical power every year, leading to fears of a major blackout of the Internet by 2020. The messages of the first CHIPS 2020, published in 2012, concerned the realization of quantum steps for improving the energy efficiency of all chip functions. With this second volume, we review these messages and amplify upon the most promising directions: ultra-low-voltage electronics, nanoscale monolithic 3D integration, relevant-data, brain- and human-vision-inspired processing, and energy harvesting for chip autonomy. The team of authors, enlarged by more world leaders in low-power, monolithic 3D, video, and Silicon brains, presents new vistas in nanoelectronics, promising Moore-like exponential growth sustainable through to the 2030s.
Book Synopsis Arbitrary Modeling of TSVs for 3D Integrated Circuits by : Khaled Salah
Download or read book Arbitrary Modeling of TSVs for 3D Integrated Circuits written by Khaled Salah and published by Springer. This book was released on 2014-08-21 with total page 181 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.
Book Synopsis Design and Crosstalk Analysis in Carbon Nanotube Interconnects by : P. Uma Sathyakam
Download or read book Design and Crosstalk Analysis in Carbon Nanotube Interconnects written by P. Uma Sathyakam and published by Springer Nature. This book was released on 2020-10-31 with total page 134 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a single-source reference on carbon nanotubes for interconnect applications. It presents the recent advances in modelling and challenges of carbon nanotube (CNT)-based VLSI interconnects. Starting with a background of carbon nanotubes and interconnects, this book details various aspects of CNT interconnect models, the design metrics of CNT interconnects, crosstalk analysis of recently proposed CNT interconnect structures, and geometries. Various topics covered include the use of semiconducting CNTs around metallic CNTs, CNT interconnects with air gaps, use of emerging ultra low-k materials and their integration with CNT interconnects, and geometry-based crosstalk reduction techniques. This book will be useful for researchers and design engineers working on carbon nanotubes for interconnects for both 2D and 3D integrated circuits.
Book Synopsis Handbook of 3D Integration, Volume 1 by : Philip Garrou
Download or read book Handbook of 3D Integration, Volume 1 written by Philip Garrou and published by John Wiley & Sons. This book was released on 2011-09-22 with total page 798 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.
Book Synopsis Through Silicon Vias by : Brajesh Kumar Kaushik
Download or read book Through Silicon Vias written by Brajesh Kumar Kaushik and published by CRC Press. This book was released on 2016-11-30 with total page 165 pages. Available in PDF, EPUB and Kindle. Book excerpt: Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.
Book Synopsis Designing TSVs for 3D Integrated Circuits by : Nauman Khan
Download or read book Designing TSVs for 3D Integrated Circuits written by Nauman Khan and published by Springer Science & Business Media. This book was released on 2012-09-22 with total page 82 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks. Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a floorplan are available. Finally, the authors explore the use of Carbon Nanotubes for power grid design as a futuristic alternative to Copper.
Book Synopsis Interconnect Technology and Design for Gigascale Integration by : Jeffrey A. Davis
Download or read book Interconnect Technology and Design for Gigascale Integration written by Jeffrey A. Davis and published by Taylor & Francis US. This book was released on 2003-10-31 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in-depth exploration into interconnect-aware computer architectures.
