Automated Inspection Of Soldered Joints For Surface Mount Technology

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Surface Mount Technology

Author : Ray Prasad
Publisher : Springer Science & Business Media
ISBN 13 : 1461540844
Total Pages : 791 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis Surface Mount Technology by : Ray Prasad

Download or read book Surface Mount Technology written by Ray Prasad and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 791 pages. Available in PDF, EPUB and Kindle. Book excerpt: A foreword is usually prepared by someone who knows the author or who knows enough to provide additional insight on the purpose of the work. When asked to write this foreword, I had no problem with what I wanted to say about the work or the author. I did, however, wonder why people read a foreword. It is probably of value to know the background of the writer of a book; it is probably also of value to know the background of the individual who is commenting on the work. I consider myself a good friend of the author, and when I was asked to write a few words I felt honored to provide my view of Ray Prasad, his expertise, and the contribution that he has made to our industry. This book is about the industry, its technology, and its struggle to learn and compete in a global market bursting with new ideas to satisfy a voracious appetite for new and innovative electronic products. I had the good fortune to be there at the beginning (or almost) and have witnessed the growth and excitement in the opportunities and challenges afforded the electronic industries' engineering and manufacturing talents. In a few years my involve ment will span half a century.

Fine Pitch Surface Mount Technology

Author : Phil Marcoux
Publisher : Springer Science & Business Media
ISBN 13 : 1461535328
Total Pages : 351 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis Fine Pitch Surface Mount Technology by : Phil Marcoux

Download or read book Fine Pitch Surface Mount Technology written by Phil Marcoux and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 351 pages. Available in PDF, EPUB and Kindle. Book excerpt: Fine pitch high lead count integrated circuit packages represent a dramatic change from the conventional methods of assembling electronic components to a printed interconnect circuit board. To some, these FPTpackages appear to bean extension of the assembly technology called surface mount or SMT. Many of us who have spent a significant amount of time developing the process and design techniques for these fine pitchpackages haveconcluded that these techniquesgobeyondthose commonly useed for SMT. In 1987 the presentauthor, convincedofthe uniqueness ofthe assembly and design demands ofthese packages, chaired ajoint committee where the members agreed to use fine pitch technology (FPT) as the defining term for these demands. The committee was unique in several ways, one being that it was the first time three U. S. standards organizations, the IPC (Lincolnwood, IL), theEIA(Washington, D. C. ),and theASTM (Philadelphia),cametogether tocreate standards before a technology was in high demand. The term fine pitch technology and its acronym FPT have since become widely accepted in the electronics industry. The knowledge of the terms and demands of FPT currently exceed the usage of FPT packaged components, but this is changing rapidly because of the size, performance, and cost savings of FPT. I have resisted several past invitations to write other technical texts. However, I feel there are important advantages and significant difficulties to be encountered with FPT.

Lead-free Soldering Process Development and Reliability

Author : Jasbir Bath
Publisher : John Wiley & Sons
ISBN 13 : 1119481937
Total Pages : 512 pages
Book Rating : 4.1/5 (194 download)

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Book Synopsis Lead-free Soldering Process Development and Reliability by : Jasbir Bath

Download or read book Lead-free Soldering Process Development and Reliability written by Jasbir Bath and published by John Wiley & Sons. This book was released on 2020-06-23 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: · Developments in process engineering (SMT, Wave, Rework, Paste Technology) · Low temperature, high temperature and high reliability alloys · Intermetallic compounds · PCB surface finishes and laminates · Underfills, encapsulants and conformal coatings · Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book’s explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.

Surface Mount and Related Technologies

Author : Gerald L. Ginsberg
Publisher : CRC Press
ISBN 13 : 9780824780739
Total Pages : 416 pages
Book Rating : 4.7/5 (87 download)

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Book Synopsis Surface Mount and Related Technologies by : Gerald L. Ginsberg

Download or read book Surface Mount and Related Technologies written by Gerald L. Ginsberg and published by CRC Press. This book was released on 1989-04-24 with total page 416 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Computer Vision: Craft, Engineering, and Science

Author : David Vernon
Publisher : Springer Science & Business Media
ISBN 13 : 9783540572114
Total Pages : 116 pages
Book Rating : 4.5/5 (721 download)

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Book Synopsis Computer Vision: Craft, Engineering, and Science by : David Vernon

Download or read book Computer Vision: Craft, Engineering, and Science written by David Vernon and published by Springer Science & Business Media. This book was released on 1994-01-19 with total page 116 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume assesses approaches to the construction of computer vision systems. It shows that there is a spectrum of approaches with different degrees of maturity and robustness. The useful exploitation of computer vision in industry and elsewhere and the development of the discipline itself depend on understanding the way these approaches influence one another. The chief topic discussed is autonomy.True autonomy may not be achievable in machines in the near future, and the workshop concluded that it may be more desirable - and is certainly more pragmatic - to leave a person in the processing loop. The second conclusion of the workshop concerns the manner in which a system is designedfor an application. It was agreed that designers should first specify the required functionality, then identify the knowledge appropriate to that task, and finally choose the appropriate techniques and algorithms. The third conclusion concerns the methodologies employed in developing vision systems: craft, engineering, and science are mutually relevant and contribute to one another. The contributors place heavy emphasis on providing the reader with concrete examples of operational systems. The book is based on a workshop held as part of the activities of an ESPRIT Basic Research Action.

The Electronics Assembly Handbook

Author : Frank Riley
Publisher : Springer Science & Business Media
ISBN 13 : 3662131617
Total Pages : 576 pages
Book Rating : 4.6/5 (621 download)

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Book Synopsis The Electronics Assembly Handbook by : Frank Riley

Download or read book The Electronics Assembly Handbook written by Frank Riley and published by Springer Science & Business Media. This book was released on 2013-06-29 with total page 576 pages. Available in PDF, EPUB and Kindle. Book excerpt: The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in "Assembly Engineering" and "Electronic Packaging and Production", will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.

Japan Research and Development Policy Handbook Volume 1 Strategic Information and Programs

Author : IBP USA
Publisher : Lulu.com
ISBN 13 : 1433063190
Total Pages : 312 pages
Book Rating : 4.4/5 (33 download)

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Book Synopsis Japan Research and Development Policy Handbook Volume 1 Strategic Information and Programs by : IBP USA

Download or read book Japan Research and Development Policy Handbook Volume 1 Strategic Information and Programs written by IBP USA and published by Lulu.com. This book was released on 2013-08 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: 2011 Updated Reprint. Updated Annually. Japan Research & Development Policy Handbook

Computer-Aided Design, Engineering, and Manufacturing

Author : Cornelius T. Leondes
Publisher : CRC Press
ISBN 13 : 9781420050035
Total Pages : 312 pages
Book Rating : 4.0/5 (5 download)

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Book Synopsis Computer-Aided Design, Engineering, and Manufacturing by : Cornelius T. Leondes

Download or read book Computer-Aided Design, Engineering, and Manufacturing written by Cornelius T. Leondes and published by CRC Press. This book was released on 2019-04-23 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the competitive business arena companies must continually strive to create new and better products faster, more efficiently, and more cost effectively than their competitors to gain and keep the competitive advantage. Computer-aided design (CAD), computer-aided engineering (CAE), and computer-aided manufacturing (CAM) are now the industry standa

Electronic Materials Handbook

Author :
Publisher : ASM International
ISBN 13 : 9780871702852
Total Pages : 1234 pages
Book Rating : 4.7/5 (28 download)

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Book Synopsis Electronic Materials Handbook by :

Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.

The Electronic Packaging Handbook

Author : Glenn R. Blackwell
Publisher : CRC Press
ISBN 13 : 9781420049848
Total Pages : 648 pages
Book Rating : 4.0/5 (498 download)

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Book Synopsis The Electronic Packaging Handbook by : Glenn R. Blackwell

Download or read book The Electronic Packaging Handbook written by Glenn R. Blackwell and published by CRC Press. This book was released on 2017-12-19 with total page 648 pages. Available in PDF, EPUB and Kindle. Book excerpt: The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.

Soldering

Author : Mel Schwartz
Publisher : ASM International
ISBN 13 : 1627080589
Total Pages : 207 pages
Book Rating : 4.6/5 (27 download)

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Book Synopsis Soldering by : Mel Schwartz

Download or read book Soldering written by Mel Schwartz and published by ASM International. This book was released on 2014-03-01 with total page 207 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covers various soldering methods and techniques as well as the latest on solder alloys, solder films, surface preparation, fluxes and cleaning methods, heating methods, inspection techniques, and quality control and reliability. Geared to scientists, material engineers, designers, manufacturing engineers, and technologists who need immediate practical guidance rather than theoretical instruction.

Intelligent Systems

Author : Cornelius T. Leondes
Publisher : CRC Press
ISBN 13 : 1420040812
Total Pages : 2400 pages
Book Rating : 4.4/5 (2 download)

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Book Synopsis Intelligent Systems by : Cornelius T. Leondes

Download or read book Intelligent Systems written by Cornelius T. Leondes and published by CRC Press. This book was released on 2018-10-08 with total page 2400 pages. Available in PDF, EPUB and Kindle. Book excerpt: Intelligent systems, or artificial intelligence technologies, are playing an increasing role in areas ranging from medicine to the major manufacturing industries to financial markets. The consequences of flawed artificial intelligence systems are equally wide ranging and can be seen, for example, in the programmed trading-driven stock market crash of October 19, 1987. Intelligent Systems: Technology and Applications, Six Volume Set connects theory with proven practical applications to provide broad, multidisciplinary coverage in a single resource. In these volumes, international experts present case-study examples of successful practical techniques and solutions for diverse applications ranging from robotic systems to speech and signal processing, database management, and manufacturing.

Proceedings of the Technical Program

Author :
Publisher :
ISBN 13 :
Total Pages : 792 pages
Book Rating : 4.:/5 (318 download)

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Book Synopsis Proceedings of the Technical Program by :

Download or read book Proceedings of the Technical Program written by and published by . This book was released on 1991 with total page 792 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Artificial Intelligence and the Fourth Industrial Revolution

Author : Utpal Chakraborty
Publisher : CRC Press
ISBN 13 : 1000367886
Total Pages : 312 pages
Book Rating : 4.0/5 (3 download)

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Book Synopsis Artificial Intelligence and the Fourth Industrial Revolution by : Utpal Chakraborty

Download or read book Artificial Intelligence and the Fourth Industrial Revolution written by Utpal Chakraborty and published by CRC Press. This book was released on 2022-05-26 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the overall technology spectrum in artificial intelligence (AI) and the Fourth Industrial Revolution, which is set to revolutionize the world. It discusses their various aspects and related case studies from industry, academics, administration, law, finance, and accounting as well as educational technology. The contributors, who are experts in their respective fields and from industry and academia, focus on a gesture-recognition prototype for specially abled people; jurisprudential approach to AI and legal reasoning; automated chatbot for autism spectrum disorder using AI assistance; Big Data analytics and Internet of Things (IoT); role of AI in advancement of drug discovery; development, opportunities, and challenges of the Fourth Industrial Revolution; legal, ethical, and policy implications of AI; Internet of Health Things for smart healthcare and digital wellbeing; machine learning and computer vision; computer vision-based system for automation and industrial applications; AI-IoT in home-based healthcare; and AI in super-precision human brain and spine surgery. Buttressed with comprehensive theoretical, methodological, well-established, and validated empirical examples, the book covers the interests of a broad audience from basic science to engineering and technology experts and learners. It will be greatly helpful for CEOs, entrepreneurs, academic leaders, researchers, and students of engineering, biomedicine, and master’s programs in science as well as the vast workforce and students with technical or non-technical backgrounds. It also serves common public interest by presenting new methods to improve the quality of life in general, with a better integration into society.

Advances in Electrical Engineering and Electrical Machines

Author : Dehuai Zheng
Publisher : Springer Science & Business Media
ISBN 13 : 3642259057
Total Pages : 741 pages
Book Rating : 4.6/5 (422 download)

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Book Synopsis Advances in Electrical Engineering and Electrical Machines by : Dehuai Zheng

Download or read book Advances in Electrical Engineering and Electrical Machines written by Dehuai Zheng and published by Springer Science & Business Media. This book was released on 2012-02-01 with total page 741 pages. Available in PDF, EPUB and Kindle. Book excerpt: With success of ICEEE 2010 in Wuhan, China, and December 4 to 5, 2010, the second International Conference of Electrical and Electronics Engineering (ICEEE 2011) will be held in Macau, China, and December 1 to 2, 2011. ICEEE is an annual conference to call together researchers, engineers, academicians as well as industrial professionals from all over the world to present their research results and development activities in Electrical and Electronics Engineering along with Computer Science and Technology, Communication Technology, Artificial Intelligence, Information Technology, etc. This year ICEEE is sponsored by International Industrial Electronics Center, Hong Kong. And based on the deserved reputation, more than 750 papers have been submitted to ICEEE 2011, from which about 98 high quality original papers have been selected for the conference presentation and inclusion in the “Electrical and Electronics Engineering” book based on the referees’ comments from peer-refereed. We expect that the Electrical and Electronics Engineering book will be a trigger for further related research and technology improvements in the importance subject including Power Engineering, Telecommunication, Integrated Circuit, Electronic amplifier , Nano-technologies, Circuits and networks, Microelectronics, Analog circuits, Digital circuits, Circuits design, Silicon devices, Thin film technologies, VLSI, Sensors, CAD tools, Molecular computing, Superconductivity circuits, Antennas technology, System architectures, etc.

Science Abstracts

Author :
Publisher :
ISBN 13 :
Total Pages : 1360 pages
Book Rating : 4.3/5 (243 download)

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Book Synopsis Science Abstracts by :

Download or read book Science Abstracts written by and published by . This book was released on 1995 with total page 1360 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Lead-Free Solder Process Development

Author : Gregory Henshall
Publisher : John Wiley & Sons
ISBN 13 : 1118102746
Total Pages : 241 pages
Book Rating : 4.1/5 (181 download)

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Book Synopsis Lead-Free Solder Process Development by : Gregory Henshall

Download or read book Lead-Free Solder Process Development written by Gregory Henshall and published by John Wiley & Sons. This book was released on 2011-03-29 with total page 241 pages. Available in PDF, EPUB and Kindle. Book excerpt: Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distribution Examines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB) Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD) Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.