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Asme 2007 Interpack Conference
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Book Synopsis Natural Convective Heat Transfer from Short Inclined Cylinders by : Patrick H. Oosthuizen
Download or read book Natural Convective Heat Transfer from Short Inclined Cylinders written by Patrick H. Oosthuizen and published by Springer Science & Business Media. This book was released on 2013-12-11 with total page 133 pages. Available in PDF, EPUB and Kindle. Book excerpt: Natural Convective Heat Transfer from Short Inclined Cylinders examines a heat transfer situation of significant, practical importance not adequately dealt with in existing textbooks or in any widely available review papers. Specifically, the book introduces the reader to recent studies of natural convection from short cylinders mounted on a flat insulated base where there is an “exposed” upper surface. The author considers the effects of the cylinder cross-sectional shape, the cylinder inclination angle, and the length-to-cross sectional size of the cylinder. Both numerical and experimental studies are discussed and correlation equations based on the results of these studies are reviewed. This book is ideal for professionals involved with thermal management and related systems, researchers, and graduate students in the field of natural convective heat transfer, instructors in graduate level courses in convective heat transfer.
Book Synopsis Advances in Heat Transfer by : Ephraim M. Sparrow
Download or read book Advances in Heat Transfer written by Ephraim M. Sparrow and published by Academic Press. This book was released on 2018-11-07 with total page 396 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advances in Heat Transfer, Volume 50, provides in-depth review articles from a broader scope than in traditional journals or texts, with this comprehensive release covering chapters on Heat Transfer in Rotating Channels, Advances in Liquid Metal Science and Technology in Chip Cooling and Thermal Management, Heat Transfer in Rotating Cooling Channel, Anomalous Heat Transfer: Examples, Fundamentals, and Fractional Calculus Models, and much more. - Fills the information gap between regularly scheduled journals and university-level textbooks by providing in-depth review articles over a broader scope than in traditional journals or texts - Essential reading for all mechanical, chemical and industrial engineers working in the field of heat transfer, or in graduate schools or industry
Book Synopsis Data Center Handbook by : Hwaiyu Geng
Download or read book Data Center Handbook written by Hwaiyu Geng and published by John Wiley & Sons. This book was released on 2014-12-01 with total page 720 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides the fundamentals, technologies, and best practices in designing, constructing and managing mission critical, energy efficient data centers Organizations in need of high-speed connectivity and nonstop systems operations depend upon data centers for a range of deployment solutions. A data center is a facility used to house computer systems and associated components, such as telecommunications and storage systems. It generally includes multiple power sources, redundant data communications connections, environmental controls (e.g., air conditioning, fire suppression) and security devices. With contributions from an international list of experts, The Data Center Handbook instructs readers to: Prepare strategic plan that includes location plan, site selection, roadmap and capacity planning Design and build "green" data centers, with mission critical and energy-efficient infrastructure Apply best practices to reduce energy consumption and carbon emissions Apply IT technologies such as cloud and virtualization Manage data centers in order to sustain operations with minimum costs Prepare and practice disaster reovery and business continuity plan The book imparts essential knowledge needed to implement data center design and construction, apply IT technologies, and continually improve data center operations.
Book Synopsis Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set) by :
Download or read book Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set) written by and published by World Scientific. This book was released on 2019-08-27 with total page 1079 pages. Available in PDF, EPUB and Kindle. Book excerpt: Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories.The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging 'learning curve,' the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications.
Book Synopsis Energy Efficient Thermal Management of Data Centers by : Yogendra Joshi
Download or read book Energy Efficient Thermal Management of Data Centers written by Yogendra Joshi and published by Springer Science & Business Media. This book was released on 2012-03-23 with total page 635 pages. Available in PDF, EPUB and Kindle. Book excerpt: Energy Efficient Thermal Management of Data Centers examines energy flow in today's data centers. Particular focus is given to the state-of-the-art thermal management and thermal design approaches now being implemented across the multiple length scales involved. The impact of future trends in information technology hardware, and emerging software paradigms such as cloud computing and virtualization, on thermal management are also addressed. The book explores computational and experimental characterization approaches for determining temperature and air flow patterns within data centers. Thermodynamic analyses using the second law to improve energy efficiency are introduced and used in proposing improvements in cooling methodologies. Reduced-order modeling and robust multi-objective design of next generation data centers are discussed.
Book Synopsis Encyclopedia Of Two-phase Heat Transfer And Flow Iv: Modeling Methodologies, Boiling Of Co2, And Micro-two-phase Cooling (A 4-volume Set) by : John R Thome
Download or read book Encyclopedia Of Two-phase Heat Transfer And Flow Iv: Modeling Methodologies, Boiling Of Co2, And Micro-two-phase Cooling (A 4-volume Set) written by John R Thome and published by World Scientific Publishing. This book was released on 2018-05-15 with total page 1353 pages. Available in PDF, EPUB and Kindle. Book excerpt: Set IV is a new addition to the previous Sets I, II and III. It contains 23 invited chapters from international specialists on the topics of numerical modeling of pulsating heat pipes and of slug flows with evaporation; lattice Boltzmann modeling of pool boiling; fundamentals of boiling in microchannels and microfin tubes, CO2 and nanofluids; testing and modeling of micro-two-phase cooling systems for electronics; and various special topics (flow separation in microfluidics, two-phase sensors, wetting of anisotropic surfaces, ultra-compact heat exchangers, etc.). The invited authors are leading university researchers and well-known engineers from leading corporate research laboratories (ABB, IBM, Nokia Bell Labs). Numerous 'must read' chapters are also included here for the two-phase community. Set IV constitutes a 'must have' engineering and research reference together with previous Sets I, II and III for thermal engineering researchers and practitioners.
Book Synopsis Information Computing and Applications by : Chunfeng Liu
Download or read book Information Computing and Applications written by Chunfeng Liu and published by Springer. This book was released on 2012-09-07 with total page 880 pages. Available in PDF, EPUB and Kindle. Book excerpt: This two-volume set of CCIS 307 and CCIS 308 constitutes the refereed proceedings of the Third International Conference on Information Computing and Applications, ICICA 2012, held in Chengde, China, in September 2012. The 330 revised full papers presented in both volumes were carefully reviewed and selected from 1089 submissions. The papers are organized in topical sections on internet computing and applications; multimedia networking and computing; intelligent computing and applications; computational statistics and applications; knowledge management and applications; communication technology and applications; information management system; control engineering and applications; business intelligence and applications; cloud and evolutionary computing; computational genomics and proteomics; engineering management and applications.
Book Synopsis Encyclopedia Of Thermal Packaging - Set 1: Thermal Packaging Techniques (A 6-volume Set) by :
Download or read book Encyclopedia Of Thermal Packaging - Set 1: Thermal Packaging Techniques (A 6-volume Set) written by and published by World Scientific. This book was released on 2012-09-25 with total page 1582 pages. Available in PDF, EPUB and Kindle. Book excerpt: remove This Encyclopedia comes in 3 sets. To check out Set 2 and Set 3, please visit Set 2: Thermal Packaging Tools and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging — the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 1: Thermal Packaging TechniquesThe first set of the Encyclopedia, Thermal Packaging Techniques, focuses on the technology “building blocks” used to assemble a complete thermal management system and provide detailed descriptions of the underlying phenomena, modeling equations, and correlations, as well as guidance for achieving the optimal designs of individual “building blocks” and their insertion in the overall thermal solution. Specific volumes deal with microchannel coolers, cold plates, immersion cooling modules, thermoelectric microcoolers, and cooling devices for solid state lighting systems, as well as techniques and procedures for the experimental characterization of thermal management components. These “building blocks” are the essential elements in the creation of a complete, cost-effective thermal management system.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.
Book Synopsis Fluid Mechanics and Fluid Power, Volume 1 by : Krishna Mohan Singh
Download or read book Fluid Mechanics and Fluid Power, Volume 1 written by Krishna Mohan Singh and published by Springer Nature. This book was released on 2024-01-06 with total page 849 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book comprises select peer-reviewed proceedings of the 9th International and 49th National Conference on Fluid Mechanics and Fluid Power (FMFP 2022). This book brings together scientific ideas and engineering solutions put forth by researchers and practitioners from academia and industry in the important and ubiquitous field of fluid mechanics. The contents of this book focus on fundamental issues and perspective in fluid mechanics, measurement techniques in fluid mechanics, computational fluid and gas dynamics, instability, transition and turbulence, fluid-structure interaction, multiphase flows, microfluidics, bio-inspired fluid mechanics, aerodynamics, turbomachinery, propulsion and power and other miscellaneous topics in the broad domain of fluid mechanics. This book is a useful reference to researchers and professionals working in the broad field of mechanics.
Book Synopsis Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques (a 6-Volume Set) by : Avram Bar-Cohen
Download or read book Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques (a 6-Volume Set) written by Avram Bar-Cohen and published by World Scientific. This book was released on 2012-02-01 with total page 1582 pages. Available in PDF, EPUB and Kindle. Book excerpt: Packaging, the physical design and implementation of electronic systems is responsible for much of the progress in miniaturization, reliability and functional density achieved by the full range of electronic, microelectronic and nanoelectronic products during the past several decades. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal management on the critical path of nearly every organization dealing with traditional electronic product development, as well as emerging, product categories. Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of critical importance in the refinement of traditional products and in the development of products for new applications.The Encyclopedia of Thermal Packaging, compiled into four 5-volume sets (Thermal Packaging Techniques, Thermal Packaging Configurations, Thermal Packaging Tools and Thermal Packaging Applications), will provide comprehensive, one-stop treatment of the techniques, configurations, tools and applications of electronic thermal packaging. Each volume in a set comprises 250–350 pages and is written by world experts in thermal management of electronics.
Book Synopsis Encyclopedia Of Thermal Packaging, Set 2: Thermal Packaging Tools (A 4-volume Set) by :
Download or read book Encyclopedia Of Thermal Packaging, Set 2: Thermal Packaging Tools (A 4-volume Set) written by and published by World Scientific. This book was released on 2014-10-23 with total page 1397 pages. Available in PDF, EPUB and Kindle. Book excerpt: remove This Encyclopedia comes in 3 sets. To check out Set 1 and Set 3, please visit Set 1: Thermal Packaging Techniques and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 2: Thermal Packaging ToolsThe second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order “compact” thermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve “correct by design” thermal packaging solutions.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.
Book Synopsis Aerogels for Energy Saving and Storage by : Meldin Mathew
Download or read book Aerogels for Energy Saving and Storage written by Meldin Mathew and published by John Wiley & Sons. This book was released on 2024-07-02 with total page 548 pages. Available in PDF, EPUB and Kindle. Book excerpt: Explore the energy storage applications of a wide variety of aerogels made from different materials In Aerogels for Energy Saving and Storage, an expert team of researchers delivers a one-stop resource covering the state-of-the-art in aerogels for energy applications. The book covers their morphology, properties, and processability and serves as a valuable resource for researchers and professionals working in materials science and environmentally friendly energy and power technology. The authors offer a comprehensive review of highly efficient energy applications of aerogels that bridges the gap between engineering, science, and chemistry and advances the field of materials development. They provide a Life Cycle Assessment of aerogels in energy systems, as well as discussions of their impact on the environment. Aerogel synthesis, characterization, fabrication, morphology, properties, energy-related applications, and simulations are all explored, and likely future research directions are provided. Readers will also find: A thorough introduction to aerogels in energy, including state-of-the-art advancements and challenges newly encountered Comprehensive explorations of chitin-based and cellulose-derived aerogels, as well as lignin-, clay-, and carbon nanotube-based aerogels Practical discussions of organic, natural, and inorganic aerogels, with further analyses of the lifecycle of aerogels In-depth examinations of the theory, modeling, and simulation of aerogels Perfect for chemical and environmental engineers, Aerogels for Energy Saving and Storage will also earn a place in the libraries of chemistry and materials science researchers in academia and industry.
Book Synopsis Functionality, Advancements and Industrial Applications of Heat Pipes by : Bahman Zohuri
Download or read book Functionality, Advancements and Industrial Applications of Heat Pipes written by Bahman Zohuri and published by Academic Press. This book was released on 2020-03-24 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt: Functionality, Advancements and Industrial Applications of Heat Pipes introduces heat pipe technologies and highlights a variety of applications for passive thermal control. The book begins with a thorough analysis of heat pipe infrastructure, including principles of operation, temperature limits, reliability and lessons learned from worked examples and case studies. It also presents a concise design guideline for the assembly of heat pipes. The second part moves on to consider a variety of modern day applications for the heat pipe principles discussed, covering nuclear and solar thermal energy engineering facilities as well as applications in space, in the sea and in the air. A final section works through manufacturing elements of different types of heat pipe to ensure they are well maintained and remain fully operational. This section includes the cleaning of parts, the assembly of the heat pipe, an analysis of gas blockages and how to deal with them, as well as performance versification. - Analyzes a wide variety of heat pipes used in various settings, including constant-conductance heat pipes, loop heat pipes and wrap around heat pipes - Considers applications at sea, in the air, on land and in space, including the nuclear and solar energy industries, heat pipes in spacecraft and heat pipe reactors - Includes a heat pipe assembly and design guide, as well as an analysis of lessons learned from different case studies
Book Synopsis Energy Storage Systems by : V. K. Mathew
Download or read book Energy Storage Systems written by V. K. Mathew and published by Springer Nature. This book was released on 2022-10-04 with total page 475 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses generalized applications of energy storage systems using experimental, numerical, analytical, and optimization approaches. The book includes novel and hybrid optimization techniques developed for energy storage systems. It provides a range of applications of energy storage systems on a single platform. The book broadly covers—thermal management of electronic components in portable electronic devices; modeling and optimization aspects of energy storage systems; management of power generation systems involving renewable energy; testing, evaluation, and life cycle assessment of energy storage systems, etc. This book will serve as a reference resource for researchers and practitioners in academia and industry.
Book Synopsis Metallic Films for Electronic, Optical and Magnetic Applications by : Katayun Barmak
Download or read book Metallic Films for Electronic, Optical and Magnetic Applications written by Katayun Barmak and published by Woodhead Publishing. This book was released on 2014-02-13 with total page 671 pages. Available in PDF, EPUB and Kindle. Book excerpt: Metallic films play an important role in modern technologies such as integrated circuits, information storage, displays, sensors, and coatings. Metallic Films for Electronic, Optical and Magnetic Applications reviews the structure, processing and properties of metallic films. Part one explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy. This part also encompasses the processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations. Chapters in part two focus on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties. Metallic Films for Electronic, Optical and Magnetic Applications is a technical resource for electronics components manufacturers, scientists, and engineers working in the semiconductor industry, product developers of sensors, displays, and other optoelectronic devices, and academics working in the field. - Explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy - Discusses processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations - Focuses on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties
Book Synopsis Heat Pipes and Solid Sorption Transformations by : L.L Vasiliev
Download or read book Heat Pipes and Solid Sorption Transformations written by L.L Vasiliev and published by CRC Press. This book was released on 2013-05-08 with total page 539 pages. Available in PDF, EPUB and Kindle. Book excerpt: Developing clean energy and utilizing waste energy has become increasingly vital. Research targeting the advancement of thermally powered adsorption cooling technologies has progressed in the past few decades, and the awareness of fuel cells and thermally activated (heat pipe heat exchangers) adsorption systems using natural refrigerants and/or alternatives to hydrofluorocarbon-based refrigerants is becoming ever more important. Heat Pipes and Solid Sorption Transformations: Fundamentals and Practical Applications concentrates on state-of-the-art adsorption research and technologies for relevant applications based on the use of efficient heat transfer devices—heat pipe and two-phase thermosyphons—with the objectives of energy efficiency and sustainability. This book also discusses heat pipe thermal control as it relates to spacecraft applications. The first few chapters of Heat Pipes and Solid Sorption Transformations: Fundamentals and Practical Applications focus on heating and cooling, the principles of adsorption, adsorption dynamics, and the availability of three-phase boundaries. Other chapters cover successful heat pipe applications and heat-pipe-based thermal control of fuel cells, solid sorption transformers, and electronic components and air-condition devices. The final chapters summarize the achievements in the field of heat and mass transfer study in heat pipes with variable properties such as gas loaded heat pipes. Several configurations of thermosyphons are showcased, with suggested applications. A number of examples of equipment using the thermosyphon technology are presented and, in the final chapter, the concept of flow boiling and flow condensation heat transfer in micochannels is analyzed in detail.
Book Synopsis Optimum Cooling of Data Centers by : Jun Dai
Download or read book Optimum Cooling of Data Centers written by Jun Dai and published by Springer Science & Business Media. This book was released on 2013-11-20 with total page 196 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes the use of free air cooling to improve the efficiency of, and cooling of, equipment for use in telecom infrastructures. Discussed at length is the cooling of communication installation rooms such as data centers or base stations, and this is intended as a valuable tool for the people designing and manufacturing key parts of communication networks. This book provides an introduction to current cooling methods used for energy reduction, and also compares present cooling methods in use in the field. The qualification methods and standard reliability assessments are reviewed, and their inability to assess the risks of free air cooling is discussed. The method of identifying the risks associated with free air cooling on equipment performance and reliability is introduced. A novel method of assessment for free air cooling is also proposed that utilizes prognostics and health management (PHM). This book also: Describes how the implementation of free air cooling can save energy for cooling within the telecommunications infrastructure. Analyzes the potential risks and failures of mechanisms possible in the implementation of free air cooling, which benefits manufacturers and equipment designers. Presents prognostics-based assessments to identify and mitigate the risks of telecommunications equipment under free air cooling conditions, which can provide the early warning of equipment failures at operation stage without disturbing the data centers' service. Optimum Cooling for Data Centers is an ideal book for researchers and engineers interested in designing and manufacturing equipment for use in telecom infrastructures.
