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Author :
Publisher :
ISBN 13 :
Total Pages : 542 pages
Book Rating : 4.:/5 (319 download)
Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1995 with total page 542 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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Publisher :
ISBN 13 :
Total Pages : 1316 pages
Book Rating : 4.3/5 (91 download)
Download or read book Advances in Electronic Packaging written by and published by . This book was released on 1997 with total page 1316 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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ISBN 13 :
Total Pages : 2240 pages
Book Rating : 4.3/5 (243 download)
Download or read book Electrical & Electronics Abstracts written by and published by . This book was released on 1997 with total page 2240 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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ISBN 13 :
Total Pages : 676 pages
Book Rating : 4.3/5 (91 download)
Download or read book 27th International Symposium on Microelectronics written by and published by . This book was released on 1994 with total page 676 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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ISBN 13 :
Total Pages : 934 pages
Book Rating : 4.E/5 ( download)
Download or read book Proceedings of the Technical Conference written by and published by . This book was released on 1994 with total page 934 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Fatih Kinoglu
Publisher :
ISBN 13 :
Total Pages : 798 pages
Book Rating : 4.3/5 (91 download)
Download or read book Computers in Engineering, 1993 written by Fatih Kinoglu and published by . This book was released on 1993 with total page 798 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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ISBN 13 :
Total Pages : 922 pages
Book Rating : 4.3/5 (91 download)
Download or read book Government Reports Announcements & Index written by and published by . This book was released on 1995 with total page 922 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : S.G. Tzafestas
Publisher : Springer Science & Business Media
ISBN 13 : 9400906099
Total Pages : 521 pages
Book Rating : 4.4/5 (9 download)
Download or read book Real Time Microcomputer Control of Industrial Processes written by S.G. Tzafestas and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 521 pages. Available in PDF, EPUB and Kindle. Book excerpt: The introduction of the microprocessor in computer and system engineering has motivated the development of many new concepts and has simplified the design of many modern industrial systems. During the first decade of their life. microprocessors have shown a tremendous evolution in all possible directions (technology. power. functionality. I/O handling. etc). Of course putting the microprocessors and their environmental devices into properly operating systems is a complex and difficult task requiring high skills for melding and integrating hardware. and systemic components. software This book was motivated by the editors' feeling that a cohesive reference is needed providing a good coverage of modern industrial applications of microprocessor-based real time control, together with latest advanced methodological issues. Unavoidably a single volume cannot be exhaustive. but the present book contains a sufficient number of important real-time applications. The book is divided in two sections. Section I deals with general hardware. software and systemic topics. and involves six chapters. Chapter 1. by Gupta and Toong. presents an overview of the development of microprocessors during their first twelve years of existence. Chapter 2. by Dasgupta. deals with a number of system software concepts for real time microprocessor-based systems (task scheduling. memory management. input-output aspects. programming language reqUirements.
Author : Dietmar Tutsch
Publisher : Springer Science & Business Media
ISBN 13 : 3540343105
Total Pages : 248 pages
Book Rating : 4.5/5 (43 download)
Download or read book Performance Analysis of Network Architectures written by Dietmar Tutsch and published by Springer Science & Business Media. This book was released on 2007-05-17 with total page 248 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three approaches can be applied to determine the performance of parallel and distributed computer systems: measurement, simulation, and mathematical methods. This book introduces various network architectures for parallel and distributed systems as well as for systems-on-chips, and presents a strategy for developing a generator for automatic model derivation. It will appeal to researchers and students in network architecture design and performance analysis.
Author : Tae-Kyu Lee
Publisher : Springer
ISBN 13 : 1461492661
Total Pages : 266 pages
Book Rating : 4.4/5 (614 download)
Download or read book Fundamentals of Lead-Free Solder Interconnect Technology written by Tae-Kyu Lee and published by Springer. This book was released on 2014-11-05 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt: This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.
Author : North Atlantic Treaty Organization. Advisory Group for Aerospace Research and Development
Publisher :
ISBN 13 : 9789283600046
Total Pages : pages
Book Rating : 4.6/5 ( download)
Download or read book AGARD Conference Proceedings written by North Atlantic Treaty Organization. Advisory Group for Aerospace Research and Development and published by . This book was released on 1994 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Joachim Burghartz
Publisher : Springer Science & Business Media
ISBN 13 : 1441972765
Total Pages : 471 pages
Book Rating : 4.4/5 (419 download)
Download or read book Ultra-thin Chip Technology and Applications written by Joachim Burghartz and published by Springer Science & Business Media. This book was released on 2010-11-18 with total page 471 pages. Available in PDF, EPUB and Kindle. Book excerpt: Ultra-thin chips are the "smart skin" of a conventional silicon chip. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, Microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, characterization and the applications of ultra-thin chips.
Author : Daniel Lu
Publisher : Springer
ISBN 13 : 3319450980
Total Pages : 974 pages
Book Rating : 4.3/5 (194 download)
Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Author : Kurt Wick
Publisher : Morgan & Claypool Publishers
ISBN 13 : 1681746638
Total Pages : 190 pages
Book Rating : 4.6/5 (817 download)
Download or read book Applied Digital Logic Exercises Using FPGAs written by Kurt Wick and published by Morgan & Claypool Publishers. This book was released on 2017-10-03 with total page 190 pages. Available in PDF, EPUB and Kindle. Book excerpt: FPGAs have almost entirely replaced the traditional Application Specific Standard Parts (ASSP) such as the 74xx logic chip families because of their superior size, versatility, and speed. For example, FPGAs provide over a million fold increase in gates compared to ASSP parts. The traditional approach for hands-on exercises has relied on ASSP parts, primarily because of their simplicity and ease of use for the novice. Not only is this approach technically outdated, but it also severely limits the complexity of the designs that can be implemented. By introducing the readers to FPGAs, they are being familiarized with current digital technology and the skills to implement complex, sophisticated designs. However, working with FGPAs comes at a cost of increased complexity, notably the mastering of an HDL language, such as Verilog. Therefore, this book accomplishes the following: first, it teaches basic digital design concepts and then applies them through exercises; second, it implements these digital designs by teaching the user the syntax of the Verilog language while implementing the exercises. Finally, it employs contemporary digital hardware, such as the FPGA, to build a simple calculator, a basic music player, a frequency and period counter and it ends with a microprocessor being embedded in the fabric of the FGPA to communicate with the PC. In the process, readers learn about digital mathematics and digital-to-analog converter concepts through pulse width modulation.
Author : Winn Rosh
Publisher :
ISBN 13 : 9781566861892
Total Pages : 1572 pages
Book Rating : 4.8/5 (618 download)
Download or read book The Winn Rosh Hardware Bible written by Winn Rosh and published by . This book was released on 1994-07 with total page 1572 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Avram Bar-Cohen
Publisher : World Scientific
ISBN 13 : 9814313785
Total Pages : 1582 pages
Book Rating : 4.8/5 (143 download)
Download or read book Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques (a 6-Volume Set) written by Avram Bar-Cohen and published by World Scientific. This book was released on 2012-02-01 with total page 1582 pages. Available in PDF, EPUB and Kindle. Book excerpt: Packaging, the physical design and implementation of electronic systems is responsible for much of the progress in miniaturization, reliability and functional density achieved by the full range of electronic, microelectronic and nanoelectronic products during the past several decades. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal management on the critical path of nearly every organization dealing with traditional electronic product development, as well as emerging, product categories. Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of critical importance in the refinement of traditional products and in the development of products for new applications.The Encyclopedia of Thermal Packaging, compiled into four 5-volume sets (Thermal Packaging Techniques, Thermal Packaging Configurations, Thermal Packaging Tools and Thermal Packaging Applications), will provide comprehensive, one-stop treatment of the techniques, configurations, tools and applications of electronic thermal packaging. Each volume in a set comprises 250–350 pages and is written by world experts in thermal management of electronics.
Author : Mark F. Horstemeyer
Publisher : John Wiley & Sons
ISBN 13 : 1119018382
Total Pages : 654 pages
Book Rating : 4.1/5 (19 download)
Download or read book Integrated Computational Materials Engineering (ICME) for Metals written by Mark F. Horstemeyer and published by John Wiley & Sons. This book was released on 2018-03-01 with total page 654 pages. Available in PDF, EPUB and Kindle. Book excerpt: Focuses entirely on demystifying the field and subject of ICME and provides step-by-step guidance on its industrial application via case studies This highly-anticipated follow-up to Mark F. Horstemeyer’s pedagogical book on Integrated Computational Materials Engineering (ICME) concepts includes engineering practice case studies related to the analysis, design, and use of structural metal alloys. A welcome supplement to the first book—which includes the theory and methods required for teaching the subject in the classroom—Integrated Computational Materials Engineering (ICME) For Metals: Concepts and Case Studies focuses on engineering applications that have occurred in industries demonstrating the ICME methodologies, and aims to catalyze industrial diffusion of ICME technologies throughout the world. The recent confluence of smaller desktop computers with enhanced computing power coupled with the emergence of physically-based material models has created the clear trend for modeling and simulation in product design, which helped create a need to integrate more knowledge into materials processing and product performance. Integrated Computational Materials Engineering (ICME) For Metals: Case Studies educates those seeking that knowledge with chapters covering: Body Centered Cubic Materials; Designing An Interatomic Potential For Fe-C Alloys; Phase-Field Crystal Modeling; Simulating Dislocation Plasticity in BCC Metals by Integrating Fundamental Concepts with Macroscale Models; Steel Powder Metal Modeling; Hexagonal Close Packed Materials; Multiscale Modeling of Pure Nickel; Predicting Constitutive Equations for Materials Design; and more. Presents case studies that connect modeling and simulation for different materials' processing methods for metal alloys Demonstrates several practical engineering problems to encourage industry to employ ICME ideas Introduces a new simulation-based design paradigm Provides web access to microstructure-sensitive models and experimental database Integrated Computational Materials Engineering (ICME) For Metals: Case Studies is a must-have book for researchers and industry professionals aiming to comprehend and employ ICME in the design and development of new materials.
