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Active Heat Transfer Enhancement In Integrated Fan Heat Sinks
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Book Synopsis Heat Transfer and Fluid Flow in Minichannels and Microchannels by : Satish Kandlikar
Download or read book Heat Transfer and Fluid Flow in Minichannels and Microchannels written by Satish Kandlikar and published by Elsevier. This book was released on 2006 with total page 492 pages. Available in PDF, EPUB and Kindle. Book excerpt: &Quot;This book explores flow through passages with hydraulic diameters from about 1 [mu]m to 3 mm, covering the range of minichannels and microchannels. Design equations along with solved examples and practice problems are also included to serve the needs of practicing engineers and students in a graduate course."--BOOK JACKET.
Book Synopsis Principles of Enhanced Heat Transfer by : Ralph L. Webb
Download or read book Principles of Enhanced Heat Transfer written by Ralph L. Webb and published by Wiley-Interscience. This book was released on 1994-03-28 with total page 584 pages. Available in PDF, EPUB and Kindle. Book excerpt: Indeed, today "second generation" enhancement concepts are routing in the automotive and refrigeration industries to obtain lower cost, smaller heat exchanger size, and higher energy efficiency in system operation. And the aerospace, process, and power generation industries are not far behind.
Book Synopsis Advances in Heat Transfer Enhancement by : Sujoy Kumar Saha
Download or read book Advances in Heat Transfer Enhancement written by Sujoy Kumar Saha and published by Springer. This book was released on 2016-04-23 with total page 128 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Brief addresses the phenomena of heat transfer enhancement. A companion edition in the SpringerBrief Subseries on Thermal Engineering and Applied Science to three other monographs including “Critical Heat Flux in Flow Boiling in Microchannels,” this volume is idea for professionals, researchers, and graduate students concerned with electronic cooling.
Book Synopsis Integrated Interconnect Technologies for 3D Nanoelectronic Systems by : Muhannad S. Bakir
Download or read book Integrated Interconnect Technologies for 3D Nanoelectronic Systems written by Muhannad S. Bakir and published by Artech House. This book was released on 2008-11-30 with total page 551 pages. Available in PDF, EPUB and Kindle. Book excerpt: This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.
Book Synopsis Microfabricated Systems and MEMS VI by : Peter J. Hesketh
Download or read book Microfabricated Systems and MEMS VI written by Peter J. Hesketh and published by The Electrochemical Society. This book was released on 2002 with total page 268 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore by : Hengyun Zhang
Download or read book Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore written by Hengyun Zhang and published by Woodhead Publishing. This book was released on 2019-11-14 with total page 436 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. - Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging - Features experimental characterization and qualifications for the analysis and verification of electronic packaging design - Provides multiphysics modeling and analysis techniques of electronic packaging
Book Synopsis Introduction to Turbomachinery by : David Japikse
Download or read book Introduction to Turbomachinery written by David Japikse and published by . This book was released on 1997 with total page 540 pages. Available in PDF, EPUB and Kindle. Book excerpt: Based on many years of hands-on teaching experience involving students and practicing engineers alike, this text offers an ideal introduction to the design and performance of turbomachinery. Pumps, compressors, and turbines are described in detail, with emphasis on their key features and the flow equations relevant to each part of the machine. Experimental data are presented to aid understanding. Also covered are boundary layer and computational techniques for flow prediction, stability limits, and structural and modal analysis of blades and rotors. Test bed, laboratory, and workshop procedures for turbomachinery development together with instrumentation issues are also covered, drawing on the authors' wide experience. Fully illustrated and comprehensive in its treatment of turbomachinery types, Introduction to Turbomachinery provides the most up-to-date account of the subject for final-year undergraduates or new graduates beginning a study of turbomachinery, as well as a refresher and reference text for established practitioners.
Book Synopsis Thermal Management for Opto-electronics Packaging and Applications by : Xiaobing Luo
Download or read book Thermal Management for Opto-electronics Packaging and Applications written by Xiaobing Luo and published by John Wiley & Sons. This book was released on 2024-08-12 with total page 373 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thermal Management for Opto-electronics Packaging and Applications A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling Practical discussions of thermally enhanced thermal interfacial materials (TIMs) Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.
Book Synopsis Advanced Thermal Design of Electronic Equipment by : Ralph Remsburg
Download or read book Advanced Thermal Design of Electronic Equipment written by Ralph Remsburg and published by Springer Science & Business Media. This book was released on 1998-02-28 with total page 632 pages. Available in PDF, EPUB and Kindle. Book excerpt: With today's high density, high performance electronic systems, packaging and more specifically thermal engineering has become the critical factor that limits on-time product introduction and reliability in the field. This book serves as a reference for engineers who must predict the thermal performance of a company's latest product as well as the technicians who must quickly solve the problem of an overheating chip in a product that is already on the shelves.
Book Synopsis Heat Transfer Enhancement with Nanofluids by : Vincenzo Bianco
Download or read book Heat Transfer Enhancement with Nanofluids written by Vincenzo Bianco and published by CRC Press. This book was released on 2015-04-01 with total page 473 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nanofluids are gaining the attention of scientists and researchers around the world. This new category of heat transfer medium improves the thermal conductivity of fluid by suspending small solid particles within it and offers the possibility of increased heat transfer in a variety of applications. Bringing together expert contributions from
Book Synopsis Advanced Materials and Components for 5G and Beyond by : Colin Tong
Download or read book Advanced Materials and Components for 5G and Beyond written by Colin Tong and published by Springer Nature. This book was released on 2022-11-16 with total page 276 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive introduction to the current status and future trends of materials and component design for fifth-generation (5G) wireless communications and beyond. Necessitated by rapidly increasing numbers of mobile devices and data volumes, and acting as a driving force for innovation in information technology, 5G networks are broadly characterized by ubiquitous connectivity, extremely low latency, and very high-speed data transfer. Such capabilities are facilitated by nanoscale and massive multi-input multi-output (MIMO) with extreme base station and device densities, as well as unprecedented numbers of antennas. This book covers semiconductor solutions for 5G electronics, design and performance enhancement for 5G antennas, high frequency PCB materials and design requirements, materials for high frequency filters, EMI shielding materials and absorbers for 5G systems, thermal management materials and components, and protective packaging and sealing materials for 5G devices. It explores fundamental physics, design, and engineering aspects, as well as the full array of state-of-the-art applications of 5G-and-beyond wireless communications. Future challenges and potential trends of 5G-and-beyond applications and related materials technologies are also addressed. Throughout this book, illustrations clarify core concepts, techniques, and processes. At the end of each chapter, references serve as a gateway to the primary literature in the field. This book is essential reading for today’s students, scientists, engineers and professionals who want to understand the current status and future trends in materials advancement and component design in 5G and beyond, and acquire skills for selecting and using materials and 5G component design that takes economic and regulatory aspects into account.
Download or read book Heat transfer written by Yunus Ali Cengel and published by . This book was released on 2003 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Convective Heat and Mass Transfer by : S. Mostafa Ghiaasiaan
Download or read book Convective Heat and Mass Transfer written by S. Mostafa Ghiaasiaan and published by CRC Press. This book was released on 2018-06-12 with total page 788 pages. Available in PDF, EPUB and Kindle. Book excerpt: Convective Heat and Mass Transfer, Second Edition, is ideal for the graduate level study of convection heat and mass transfer, with coverage of well-established theory and practice as well as trending topics, such as nanoscale heat transfer and CFD. It is appropriate for both Mechanical and Chemical Engineering courses/modules.
Book Synopsis Electronics Cooling by : S. M. Sohel Murshed
Download or read book Electronics Cooling written by S. M. Sohel Murshed and published by BoD – Books on Demand. This book was released on 2016-06-15 with total page 184 pages. Available in PDF, EPUB and Kindle. Book excerpt: Featuring contributions from the renowned researchers and academicians in the field, this book covers key conventional and emerging cooling techniques and coolants for electronics cooling. It includes following thematic topics: - Cooling approaches and coolants - Boiling and phase change-based technologies - Heat pipes-based cooling - Microchannels cooling systems - Heat loop cooling technology - Nanofluids as coolants - Theoretical development for the junction temperature of package chips. This book is intended to be a reference source and guide to researchers, engineers, postgraduate students, and academicians in the fields of thermal management and cooling technologies as well as for people in the electronics and semiconductors industries.
Download or read book Heat Transfer written by Adrian Bejan and published by John Wiley & Sons. This book was released on 2022-04-05 with total page 612 pages. Available in PDF, EPUB and Kindle. Book excerpt: HEAT TRANSFER Provides authoritative coverage of the fundamentals of heat transfer, written by one of the most cited authors in all of Engineering Heat Transfer presents the fundamentals of the generation, use, conversion, and exchange of heat between physical systems. A pioneer in establishing heat transfer as a pillar of the modern thermal sciences, Professor Adrian Bejan presents the fundamental concepts and problem-solving methods of the discipline, predicts the evolution of heat transfer configurations, the principles of thermodynamics, and more. Building upon his classic 1993 book Heat Transfer, the author maintains his straightforward scientific approach to teaching essential developments such as Fourier conduction, fins, boundary layer theory, duct flow, scale analysis, and the structure of turbulence. In this new volume, Bejan explores topics and research developments that have emerged during the past decade, including the designing of convective flow and heat and mass transfer, the crucial relationship between configuration and performance, and new populations of configurations such as tapered ducts, plates with multi-scale features, and dendritic fins. Heat Transfer: Evolution, Design and Performance: Covers thermodynamics principles and establishes performance and evolution as fundamental concepts in thermal sciences Demonstrates how principles of physics predict a future with economies of scale, multi-scale design, vascularization, and hierarchical distribution of many small features Explores new work on conduction architecture, convection with nanofluids, boiling and condensation on designed surfaces, and resonance of natural circulation in enclosures Includes numerous examples, problems with solutions, and access to a companion website Heat Transfer: Evolution, Design and Performance is essential reading for undergraduate and graduate students in mechanical and chemical engineering, and for all engineers, physicists, biologists, and earth scientists.
Book Synopsis Compact Heat Exchangers by : Alexander Louis London
Download or read book Compact Heat Exchangers written by Alexander Louis London and published by CRC Press. This book was released on 1990 with total page 798 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heat exchangers are a crucial part of aerospace, marine, cryogenic and refrigeration technology. These essays cover such topics as complicated flow arrangements, complex extended surfaces, two-phase flow and irreversibility in heat exchangers, and single-phase heat transfer.
Book Synopsis Cooling of Electronic Systems by : Sadik Kakaç
Download or read book Cooling of Electronic Systems written by Sadik Kakaç and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 953 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.
