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A Hierarchy Of Interconnect Limits And Opportunities For Gigascale Integration Gsi
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Book Synopsis Silicon Photonics by : Lorenzo Pavesi
Download or read book Silicon Photonics written by Lorenzo Pavesi and published by Springer Science & Business Media. This book was released on 2004-03-04 with total page 424 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book gives a fascinating picture of the state-of-the-art in silicon photonics and a perspective on what can be expected in the near future. It is composed of a selected number of reviews authored by world leaders in the field and is written from both academic and industrial viewpoints. An in-depth discussion of the route towards fully integrated silicon photonics is presented. This book will be useful not only to physicists, chemists, materials scientists, and engineers but also to graduate students who are interested in the fields of microphotonics and optoelectronics.
Book Synopsis Copper Interconnect Technology by : Tapan Gupta
Download or read book Copper Interconnect Technology written by Tapan Gupta and published by Springer Science & Business Media. This book was released on 2010-01-22 with total page 433 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology. Because metallic conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials is now prevalent in the international microelectronics industry. As the feature size of the Cu-lines forming interconnects is scaled, resistivity of the lines increases. At the same time electromigration and stress-induced voids due to increased current density become significant reliability issues. Although copper/low-k technology has become fairly mature, there is no single book available on the promise and challenges of these next-generation technologies. In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology.
Book Synopsis Advanced Interconnects and Contact Materials and Processes for Future Integrated Circuits: Volume 514 by : S. P. Murarka
Download or read book Advanced Interconnects and Contact Materials and Processes for Future Integrated Circuits: Volume 514 written by S. P. Murarka and published by . This book was released on 1998-11-02 with total page 596 pages. Available in PDF, EPUB and Kindle. Book excerpt: Comprising the proceedings of an MRS symposium held in April of 1998, contributions in this volume are divided into ten sections: interconnection frontiers; aluminum interconnects; cobalt and other silicides; titanium silicide; MOSFET, source, drain, and interconnect engineering; copper interconnects and barriers; a poster session on advanced interconnects and contacts; contacts to compound semiconductor devices; novel interconnect materials and schemes; and diffusion barriers. Annotation copyrighted by Book News, Inc., Portland, OR
Book Synopsis Handbook of 3D Integration, Volume 1 by : Philip Garrou
Download or read book Handbook of 3D Integration, Volume 1 written by Philip Garrou and published by John Wiley & Sons. This book was released on 2011-09-22 with total page 798 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.
Book Synopsis Low-Power CMOS Design by : Anantha Chandrakasan
Download or read book Low-Power CMOS Design written by Anantha Chandrakasan and published by John Wiley & Sons. This book was released on 1998-02-11 with total page 656 pages. Available in PDF, EPUB and Kindle. Book excerpt: This collection of important papers provides a comprehensive overview of low-power system design, from component technologies and circuits to architecture, system design, and CAD techniques. LOW POWER CMOS DESIGN summarizes the key low-power contributions through papers written by experts in this evolving field.
Book Synopsis Materials Reliability in Microelectronics by :
Download or read book Materials Reliability in Microelectronics written by and published by . This book was released on 1997 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Materials Reliability in Microelectronics VII: Volume 473 by : J. Joseph Clement
Download or read book Materials Reliability in Microelectronics VII: Volume 473 written by J. Joseph Clement and published by . This book was released on 1997-10-20 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt: The inexorable drive for increased integrated circuit functionality and performance places growing demands on the metal and dielectric thin films used in fabricating these circuits, as well as spurring demand for new materials applications and processes. This book directly addresses issues of widespread concern in the microelectronics industry - smaller feature sizes, new materials and new applications that challenge the reliability of new technologies. While the book continues the focus on issues related to interconnect reliability, such as electromigration and stress, particular emphasis is placed on the effects of microstructure. An underlying theme is understanding the importance of interactions among different materials and associated interfaces comprising a single structure with dimensions near or below the micrometer scale. Topics include: adhesion and fracture; gate oxide growth and oxide interfaces; surface preparation and gate oxide reliability; oxide degradation and defects; micro-structure, texture and reliability; novel measurement techniques; interconnect performance and reliability modeling; electromigration and interconnect reliability and stress and stress relaxation.
Book Synopsis American Doctoral Dissertations by :
Download or read book American Doctoral Dissertations written by and published by . This book was released on 1999 with total page 848 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Dissertation Abstracts International by :
Download or read book Dissertation Abstracts International written by and published by . This book was released on 2001 with total page 790 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Interconnect Technology and Design for Gigascale Integration by : Jeffrey A. Davis
Download or read book Interconnect Technology and Design for Gigascale Integration written by Jeffrey A. Davis and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 417 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in-depth exploration into interconnect-aware computer architectures.
Book Synopsis IBM Journal of Research and Development by :
Download or read book IBM Journal of Research and Development written by and published by . This book was released on 2005 with total page 1048 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Semiconductor Characterization by : W. Murray Bullis
Download or read book Semiconductor Characterization written by W. Murray Bullis and published by American Institute of Physics. This book was released on 1996 with total page 760 pages. Available in PDF, EPUB and Kindle. Book excerpt: Market: Those in government, industry, and academia interested in state-of-the-art knowledge on semiconductor characterization for research, development, and manufacturing. Based on papers given at an International Nist Workshop in January 1995, Semiconductor Characterization covers the unique characterization requirements of both silicon IC development and manufacturing, and compound semiconductor materials, devices, and manufacturing. Additional sections discuss technology trends and future requirements for compound semiconductor applications. Also highlighted are recent developments in characterization, including in- situ, in-FAB, and off-line analysis methods. The book provides a concise, effective portrayal of industry needs and problems in the important specialty of metrology for semiconductor technology.
Book Synopsis Energy-Efficient Technologies for the Dismounted Soldier by : National Research Council
Download or read book Energy-Efficient Technologies for the Dismounted Soldier written by National Research Council and published by National Academies Press. This book was released on 1998-01-30 with total page 287 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book documents electric power requirements for the dismounted soldier on future Army battlefields, describes advanced energy concepts, and provides an integrated assessment of technologies likely to affect limitations and needs in the future. It surveys technologies associated with both supply and demand including: energy sources and systems; low power electronics and design; communications, computers, displays, and sensors; and networks, protocols, and operations. Advanced concepts discussed are predicated on continued development by the Army of soldier systems similar to the Land Warrior system on which the committee bases its projections on energy use. Finally, the volume proposes twenty research objectives to achieve energy goals in the 2025 time frame.
Book Synopsis Proceedings of Technical Papers by :
Download or read book Proceedings of Technical Papers written by and published by . This book was released on 1991 with total page 456 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings written by and published by . This book was released on 1996 with total page 658 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Cognitive Informatics and Soft Computing by : Pradeep Kumar Mallick
Download or read book Cognitive Informatics and Soft Computing written by Pradeep Kumar Mallick and published by Springer Nature. This book was released on 2022-05-30 with total page 779 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents best selected research papers presented at the 4th International Conference on Cognitive Informatics and Soft Computing (CISC 2021), held at Balasore College of Engineering & Technology, Balasore, Odisha, India, from 21–22 August 2021. It highlights, in particular, innovative research in the fields of cognitive informatics, cognitive computing, computational intelligence, advanced computing, and hybrid intelligent models and applications. New algorithms and methods in a variety of fields are presented, together with solution-based approaches. The topics addressed include various theoretical aspects and applications of computer science, artificial intelligence, cybernetics, automation control theory, and software engineering.
Book Synopsis Electrical & Electronics Abstracts by :
Download or read book Electrical & Electronics Abstracts written by and published by . This book was released on 1997 with total page 1904 pages. Available in PDF, EPUB and Kindle. Book excerpt:
