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48th Joint Technological Conference
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Book Synopsis Solder Joint Technology by : King-Ning Tu
Download or read book Solder Joint Technology written by King-Ning Tu and published by Springer Science & Business Media. This book was released on 2007-07-27 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt: The European Union’s directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. This book provides a comprehensive examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems.
Author :South India Textile Research Association. Joint Technological Conference Publisher : ISBN 13 : Total Pages :72 pages Book Rating :4.E/5 ( download)
Book Synopsis Resume of Papers ... Technological Conference by : South India Textile Research Association. Joint Technological Conference
Download or read book Resume of Papers ... Technological Conference written by South India Textile Research Association. Joint Technological Conference and published by . This book was released on 2007 with total page 72 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Area Array Interconnection Handbook by : Karl J. Puttlitz
Download or read book Area Array Interconnection Handbook written by Karl J. Puttlitz and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 1250 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
Book Synopsis Proceedings of the 13th Reinventing Space Conference by : Scott Hatton
Download or read book Proceedings of the 13th Reinventing Space Conference written by Scott Hatton and published by Springer. This book was released on 2018-04-28 with total page 341 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reinventing Space is the largest global conference and exhibition for one of the space industry’s fastest growing sectors. Over its 82-year history, the British Interplanetary Society has acted as a forum for new and innovative ideas and developments in astronautics, low-cost access and utilization of space. These conference proceedings reflect the work done at the 13th Reinventing Space Conference, the second biggest space event in the UK during 2015. The global economic climate is creating demand to reduce expenditure, leading to new challenges and opportunities in the world’s space industry. The need to create more responsive systems and launchers that are capable of delivering to space quickly, cheaply and reliably has never been more vital. This collection from RIspace brings together industry, agency, government, financiers, academia and end users. It focuses on the commercialization of space and addresses a range of topics including low-cost launch opportunities, the rebirth of constellations, beyond LEO activities and novel technologies. These papers encourage and promote forward-thinking ideas and concepts for the future exploration and utilization of space. The proceedings address: • New ways of doing business in space – how do we make money on affordable and responsive space missions? • Tactical space systems – how do we best serve the needs of defense missions; civilian missions; the needs of emergency responders? • Interplanetary missions – can we use new technology to explore the Solar System at dramatically lower cost? • What are the methods, processes, and technologies that we can use to make major reductions in the cost of space missions? • New application areas for low-cost space systems – which ones can take advantage of newer, much lower-cost systems? • How do we educate and motivate the coming generation, without whom there won’t be a space industry?
Book Synopsis Advanced Manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging by :
Download or read book Advanced Manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging written by and published by Emerald Group Publishing. This book was released on 2006 with total page 72 pages. Available in PDF, EPUB and Kindle. Book excerpt: This issue of Soldering & Surface Mount Technology (SSMT) presents a number of papers from the 7th High Density Microsystems Design, Packaging and Failure Analysis (HDP'05) conference held in 2005 in the dynamic city of Shanghai, China. With over 100 high quality technical papers and presentation this annual conference brings together scholars and industrialists from Asia, Europe and the Americas to discuss the challenges and latest advances in high density packaging. This e-book contains six papers from the HDP conference, plus one additional contribution, which discuss the behaviour of key i.
Book Synopsis Modeling and Simulation for Microelectronic Packaging Assembly by : Shen Liu
Download or read book Modeling and Simulation for Microelectronic Packaging Assembly written by Shen Liu and published by John Wiley & Sons. This book was released on 2011-05-17 with total page 586 pages. Available in PDF, EPUB and Kindle. Book excerpt: Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging
Book Synopsis Encyclopedia of Plasma Technology - Two Volume Set by : J. Leon Shohet
Download or read book Encyclopedia of Plasma Technology - Two Volume Set written by J. Leon Shohet and published by CRC Press. This book was released on 2016-12-12 with total page 1654 pages. Available in PDF, EPUB and Kindle. Book excerpt: Technical plasmas have a wide range of industrial applications. The Encyclopedia of Plasma Technology covers all aspects of plasma technology from the fundamentals to a range of applications across a large number of industries and disciplines. Topics covered include nanotechnology, solar cell technology, biomedical and clinical applications, electronic materials, sustainability, and clean technologies. The book bridges materials science, industrial chemistry, physics, and engineering, making it a must have for researchers in industry and academia, as well as those working on application-oriented plasma technologies. Also Available Online This Taylor & Francis encyclopedia is also available through online subscription, offering a variety of extra benefits for researchers, students, and librarians, including: Citation tracking and alerts Active reference linking Saved searches and marked lists HTML and PDF format options Contact Taylor and Francis for more information or to inquire about subscription options and print/online combination packages. US: (Tel) 1.888.318.2367; (E-mail) [email protected] International: (Tel) +44 (0) 20 7017 6062; (E-mail) [email protected]
Book Synopsis Advanced Flip Chip Packaging by : Ho-Ming Tong
Download or read book Advanced Flip Chip Packaging written by Ho-Ming Tong and published by Springer Science & Business Media. This book was released on 2013-03-20 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Download or read book The Textile Magazine written by and published by . This book was released on 1999 with total page 564 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Fatigue of Composite Materials by : Ronald F. Gibson
Download or read book Fatigue of Composite Materials written by Ronald F. Gibson and published by DEStech Publications, Inc. This book was released on 2013 with total page 245 pages. Available in PDF, EPUB and Kindle. Book excerpt: Presents investigations into fatigue in composite materials and structures. Sections include: research into aspects of fatigue modeling including prediction of fatigue life, fatigue strength and fatigue crack growth rate; experimental characterization of fatigue in composites, and discussing fatigue behavior of fullscale composite structures.
Book Synopsis Clean Energy and Fuel (Hydrogen) Storage by : Sesha S. Srinivasan
Download or read book Clean Energy and Fuel (Hydrogen) Storage written by Sesha S. Srinivasan and published by MDPI. This book was released on 2019-10-16 with total page 278 pages. Available in PDF, EPUB and Kindle. Book excerpt: Clean energy and fuel storage are often required for both stationary and automotive applications. Some of these clean energy and fuel storage technologies currently under extensive research and development include hydrogen storage, direct electric storage, mechanical energy storage, solar–thermal energy storage, electrochemical (batteries and supercapacitors), and thermochemical storage. The gravimetric and volumetric storage capacity, energy storage density, power output, operating temperature and pressure, cycle life, recyclability, and cost of clean energy or fuel storage are some of the factors that govern efficient energy and fuel storage technologies for potential deployment in energy harvesting (solar and wind farms) stations and onboard vehicular transportation. This Special Issue thus serves the need for promoting exploratory research and development on clean energy and fuel storage technologies while addressing their challenges to practical and sustainable infrastructures.
Download or read book Bibliography of Agriculture written by and published by . This book was released on 1963 with total page 1450 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Advanced Intelligent Systems for Sustainable Development (AI2SD’2019) by : Mostafa Ezziyyani
Download or read book Advanced Intelligent Systems for Sustainable Development (AI2SD’2019) written by Mostafa Ezziyyani and published by Springer Nature. This book was released on 2019-10-11 with total page 329 pages. Available in PDF, EPUB and Kindle. Book excerpt: This proceedings book presents extended versions of papers on advanced intelligent systems for networks and system selected from the second edition of the International Conference on Advanced Intelligent Systems for Sustainable Development (AI2SD’2019), which was held on 8–11 July 2019 in Marrakech, Morocco. The book explores a number of aspects of networks and systems design issues, and focuses on the latest research developments in a number of areas, including various aspects of modern networking such as smart networked systems, network protocols and performance, security and privacy, mobile and wireless systems, Internet of things, artificial intelligence and expert systems, and cloud computing, as well as enabling technologies. The book also examines the area of intelligence, comprehensively examining a range of important topics like intelligent collaborative systems for work and learning, security, organization, management and autonomic computing for intelligent networking and collaborative systems, wireless and sensor systems for intelligent networking and collaborative systems, data mining and knowledge management for intelligent networking and collaborative systems, data for Internet of things, and cloud computing. Each chapter presents the state of the art in a specific topic as well as the results of research and laboratory experiments, and successful applications. The book is intended for academic and industry researchers and telecommunication network engineers wanting to gain insights into these areas, particularly in the context of Industry 4.0.
Book Synopsis Advanced Transmission Techniques in WiMAX by : Roberto Hincapie
Download or read book Advanced Transmission Techniques in WiMAX written by Roberto Hincapie and published by BoD – Books on Demand. This book was released on 2012-01-18 with total page 350 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book has been prepared to present the state of the art on WiMAX Technology. The focus of the book is the physical layer, and it collects the contributions of many important researchers around the world. So many different works on WiMAX show the great worldwide importance of WiMAX as a wireless broadband access technology. This book is intended for readers interested in the transmission process under WiMAX. All chapters include both theoretical and technical information, which provides an in-depth review of the most recent advances in the field, for engineers and researchers, and other readers interested in WiMAX.
Book Synopsis Future Spacecraft Propulsion Systems and Integration by : Paul A. Czysz
Download or read book Future Spacecraft Propulsion Systems and Integration written by Paul A. Czysz and published by Springer. This book was released on 2017-08-30 with total page 515 pages. Available in PDF, EPUB and Kindle. Book excerpt: The updated and expanded third edition of this book focuses on the multi-disciplinary coupling between flight-vehicle hardware alternatives and enabling propulsion systems. It discusses how to match near-term and far-term aerospace vehicles to missions and provides a comprehensive overview of the subject, directly contributing to the next-generation space infrastructure, from space tourism to space exploration. This holistic treatment defines a mission portfolio addressing near-term to long-term space transportation needs covering sub-orbital, orbital and escape flight profiles. In this context, a vehicle configuration classification is introduced covering alternatives starting from the dawn of space access. A best-practice parametric sizing approach is introduced to correctly design the flight vehicle for the mission. This technique balances required mission with the available vehicle solution space and is an essential capability sought after by technology forecasters and strategic planners alike.
Download or read book Nanopackaging written by James E. Morris and published by Springer Science & Business Media. This book was released on 2008-12-30 with total page 553 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.
Book Synopsis Reliability of Microtechnology by : Johan Liu
Download or read book Reliability of Microtechnology written by Johan Liu and published by Springer Science & Business Media. This book was released on 2011-02-07 with total page 216 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail. The book also includes exercises and detailed solutions at the end of each chapter.
